Abstract: A downdraft gasifier that utilizes a plurality of vertically positioned tubes to create a pyrolysis zone, an oxidation zone beneath the pyrolysis zone and a reduction zone beneath the oxidation zone. The shape of the tubes eliminates the need for a restriction (hearth), which limits the maximum achievable throughput. A rotating and vertically adjustable grate is located beneath, but not attached to, the reduction zone of the gasifier.

Abstract: Disclosed is a technique for providing minimal sequential overhead in a flip-flop circuit. Equalization of setup times is achieved in one embodiment. In addition, delays in clock to Q can be equalized for both rising data transitions and falling data transitions. Large setup times are not required since optimization techniques equalize setup times for both rising and falling data transitions.

Abstract: A method of gasification using a downdraft gasifier having a plurality of vertically positioned tubes to create a pyrolysis zone, an oxidation zone beneath the pyrolysis zone and a reduction zone beneath the oxidation zone. The shape of the tubes eliminates the need for a restriction (hearth) in the gasifier, which limits the maximum achievable throughput. A rotating and vertically adjustable grate is located beneath, but not attached to, the reduction zone of the gasifier.

Abstract: Disclosed is a technique for providing minimal sequential overhead in a flip-flop circuit. Equalization of setup times is achieved in one embodiment. In addition, delays in clock to Q can be equalized for both rising data transitions and falling data transitions. Large setup times are not required since optimization techniques equalize setup times for both rising and falling data transitions.

Abstract: A self-timed memory array is disclosed, in which segmentability and metal-programmability are supported while minimizing layout space. Self-timing row decoder circuits are placed at the top and bottom of the array adjacent to respective I/O blocks. A self-timing signal is routed from the top (resp. bottom) of the array to a point halfway down (resp. up) the memory array and then back to a self-timing row decoder at the top (resp. bottom) of the array. The same approach may also be used to account for the bitline wire delay from the bottom (resp. top) of the array to the sense amplifiers in the I/O block. Further flexibility in wire routing is provided by eliminating metal routing layers from unneeded memory cells, and a programmable gate array may be used to allow an arbitrary word size to be chosen for the memory.

Abstract: Disclosed is a technique for providing minimal sequential overhead in a flip-flop circuit. Equalization of setup times is achieved in one embodiment. In addition, delays in clock to Q can be equalized for both rising data transitions and falling data transitions. Large setup times are not required since optimization techniques equalize setup times for both rising and falling data transitions.

Abstract: A self-timed memory array is disclosed, in which segmentability and metal-programmability are supported while minimizing layout space. Self-timing row decoder circuits are placed at the top and bottom of the array adjacent to respective I/O blocks. A self-timing signal is routed from the top (resp. bottom) of the array to a point halfway down (resp. up) the memory array and then back to a self-timing row decoder at the top (resp. bottom) of the array. The same approach may also be used to account for the bitline wire delay from the bottom (resp. top) of the array to the sense amplifiers in the I/O block. Further flexibility in wire routing is provided by eliminating metal routing layers from unneeded memory cells, and a programmable gate array may be used to allow an arbitrary word size to be chosen for the memory.

Abstract: A self-timed memory array is disclosed, in which segmentability and metal-programmability are supported while minimizing layout space. Self-timing row decoder circuits are placed at the top and bottom of the array adjacent to respective I/O blocks. A self-timing signal is routed from the top (resp. bottom) of the array to a point halfway down (resp. up) the memory array and then back to a self-timing row decoder at the top (resp. bottom) of the array. The same approach may also be used to account for the bitline wire delay from the bottom (resp. top) of the array to the sense amplifiers in the I/O block. Further flexibility in wire routing is provided by eliminating metal routing layers from unneeded memory cells, and a programmable gate array may be used to allow an arbitrary word size to be chosen for the memory.

Abstract: A pre-diffused array of core memory cells is provided in a metal programmable device. Multiple control block versions of interface logic are also provided and placed around the memory core. Contact points for each control block are brought to the surface of the wafer using a via. The appropriate interface logic is selected by connecting the metal layer to the appropriate surface contacts to access the core memory cells. The application-specific circuit, including memory configuration and memory interface type, is programmed with the metal layer.

Abstract: The present invention is a method and system for providing a scalable memory building block device. The memory building block device includes a plurality of separate memory arrays, decode logic for selecting only one bit from the plurality of memory arrays, and output means for providing only one bit as an output of the memory building block device, such that the memory building block device generates as its output only one bit.

Abstract: The present invention is a method and system for providing a scalable memory building block device. The memory building block device includes a plurality of separate memory arrays, decode logic for selecting only one bit from the plurality of memory arrays, and output means for providing only one bit as an output of the memory building block device, such that the memory building block device generates as its output only one bit.

Abstract: A semiconductor structure, and associated method of fabrication, comprising a substrate having a continuous buried oxide layer and having a plurality of trench isolation structures. The buried oxide layer may be located at more than one depth within the substrate. The geometry of the trench isolation structure may vary with depth. The trench isolation structure may touch or not touch the buried oxide layer. Two trench isolation structures may penetrate the substrate to the same depth or to different depths. The trench isolation structures provide insulative separation between regions within the substrate and the separated regions may contain semiconductor devices. The semiconductor structure facilitates the providing of digital and analog devices on a common wafer. A dual-depth buried oxide layer facilitates an asymmetric semiconductor structure.

Abstract: An SRAM memory cell device comprises wordline and bitline inputs for enabling read/write access to memory cell contents, and, a diffusion region for maintaining a voltage to preserve memory cell content when the cell is not being accessed. The device further comprises a transistor device having a gate input for receiving a wordline voltage to turn off the transistor device when not performing memory cell read/write access; and, a gate oxide layer formed under the transistor device gate exhibiting resistance property for leaking current therethrough when the wordline voltage is applied to the gate input and the transistor device is off. The diffusion region receives voltage derived from the wordline voltage applied to said gate input to enable retention of said memory cell content in the absence of applied bitline voltage to thereby reduce power consumption.

Abstract: A FET with reduced reverse short channel effects is described, as well as a method to make said FET. Germanium is implanted throughout a semiconductor substrate at an intensity and dose such that a peak ion concentration is created below the source and drain of the FET. The germanium can be implanted prior to gate and source and drain formation, and reduces the reverse short channel effect normally seen in FETs. The short channel effect normally occurring in FETs is not negatively impacted by the germanium implant.

Abstract: A semiconductor structure, and associated method of fabrication, comprising a substrate having a continuous buried oxide layer and having a plurality of trench isolation structures. The buried oxide layer may be located at more than one depth within the substrate. The geometry of the trench isolation structure may vary with depth. The trench isolation structure may touch or not touch the buried oxide layer. Two trench isolation structures may penetrate the substrate to the same depth or to different depths. The trench isolation structures provide insulative separation between regions within the substrate and the separated regions may contain semiconductor devices. The semiconductor structure facilitates the providing of digital and analog devices on a common wafer. A dual-depth buried oxide layer facilitates an asymmetric semiconductor structure.

Abstract: A semiconductor structure, and associated method of fabrication, comprising a substrate having a continuous buried oxide layer and having a plurality of trench isolation structures. The buried oxide layer may be located at more than one depth within the substrate. The geometry of the trench isolation structure may vary with depth. The trench isolation structure may touch or not touch the buried oxide layer. Two trench isolation structures may penetrate the substrate to the same depth or to different depths. The trench isolation structures provide insulative separation between regions within the substrate and the separated regions may contain semiconductor devices. The semiconductor structure facilitates the providing of digital and analog devices on a common wafer. A dual-depth buried oxide layer facilitates an asymmetric semiconductor structure.

Abstract: A FET with reduced reverse short channel effects is described, as well as a method to make said FET. Germanium is implanted throughout a semiconductor substrate at an intensity and dose such that a peak ion concentration is created below the source and drain of the FET. The germanium can be implanted prior to gate and source and drain formation, and reduces the reverse short channel effect normally seen in FETs. The short channel effect normally occurring in FETs is not negatively impacted by the germanium implant.

Abstract: A FET with reduced reverse short channel effects is described, as well as a method to make said FET. Germanium is implanted throughout a semiconductor substrate at an intensity and dose such that a peak ion concentration is created below the source and drain of the FET. The germanium can be implanted prior to gate and source and drain formation, and reduces the reverse short channel effect normally seen in FETs. The short channel effect normally occurring in FETs is not negatively impacted by the germanium implant.

Abstract: A method and structure for improving the latch-up characteristic of semiconductor devices is provided. A dual depth STI is used to isolate the wells from each other. The trench has a first substantially horizontal surface at a first depth and a second substantially horizontal surface at a second depth which is deeper than the first depth. The n- and p-wells are formed on either side of the trench. A highly doped region is formed in the substrate underneath the second substantially horizontal surface of the trench. The highly doped region abuts both the first and the second wells and extends the isolation of the trench.

Abstract: A body contact to a SOI device is created by providing a deeper buried oxide region for providing connection to the FET body.