Abstract: A test strip includes a substrate, a spacer layer having a notch, a reagent layer, a support layer, and a cover layer having a covering portion covering the notch and a channel portion extending rearward from the covering portion corresponding to a rear end of the notch. The substrate is attached under the spacer layer and has a reaction region exposed from the notch. The support layer is located at two sides of the notch and connected to the cover layer and the spacer layer to make the channel portion away from the spacer layer at a vertical distance. The support layer, the covering portion, the notch, and the substrate form a reaction chamber for allowing an analyte solution to react with the reagent layer coated on the reaction region, and the support layer, the channel portion, and the spacer layer forms a channel for exhausting air.

Abstract: A method for assembling a touch control display apparatus includes: mounting a frame member to an assembly surface of a touch control panel; fixing a display panel to one of the frame member and the assembly surface of the touch control panel such that a display surface of the display panel faces the touch control panel; mounting at least one electronic component on a section of the frame member that is not covered by the display panel; and coupling a bottom case to the frame member for enclosing the display panel and the at least one electronic component.

Abstract: A micro electro mechanical system (MEMS) structure is provided, which includes a first substrate, a second substrate, a MEMS device and a hydrophobic semiconductor layer. The first substrate has a first portion. The second substrate is substantially parallel to the first substrate and has a second portion substantially aligned with the first portion. The MEMS device is between the first portion and the second portion. The hydrophobic semiconductor layer is made of germanium (Ge), silicon (Si) or a combination thereof on the first portion, the second portion or the first portion and the second portion and faces toward the MEMS device. A cap substrate for a MEMS device and a method of fabricating the same are also provided.

Abstract: A protection device for rotatably supporting a portable electronic device includes a cover, a holder and a transmission cable. The holder has a first surface and a second surface opposite to each other. A sunken slot is formed on the first surface which supports the portable electronic device. A hole structure of the holder is connected to the sunken slot and formed between the first surface and the second surface, and an arc structure is disposed on the second surface to rotatably assemble with a rotary portion of the cover. A section of the transmission cable is connected to a first connector to be disposed inside the sunken slot, another section of cable is connected to a second connector to be embedded into the cover, and a middle section of the cable pierces through the hole structure to electrically connect the first connector with the second connector.

Abstract: A protection device for rotatably supporting a portable electronic device includes a cover, a holder and a transmission cable. The holder has a first surface and a second surface opposite to each other. A sunken slot is formed on the first surface which supports the portable electronic device. A hole structure of the holder is connected to the sunken slot and formed between the first surface and the second surface, and an arc structure is disposed on the second surface to rotatably assemble with a rotary portion of the cover. A section of the transmission cable is connected to a first connector to be disposed inside the sunken slot, another section of cable is connected to a second connector to be embedded into the cover, and a middle section of the cable pierces through the hole structure to electrically connect the first connector with the second connector.

Abstract: A semiconductor package structure includes a first wafer and a second wafer. The first wafer has a concave portion. The concave portion has a bottom surface and at least one sidewall adjacent to the bottom surface. An obtuse angle is formed between the bottom surface and the sidewall. The second wafer is disposed on the first wafer and has a protruding portion. When the protruding portion enters an opening of the concave portion, the protruding portion slides along the sidewall to the bottom surface, such that the protruding portion is coupled to the concave portion.

Abstract: A semiconductor package structure includes a first wafer and a second wafer. The first wafer has a concave portion. The concave portion has a bottom surface and at least one sidewall adjacent to the bottom surface. An obtuse angle is formed between the bottom surface and the sidewall. The second wafer is disposed on the first wafer and has a protruding portion. When the protruding portion enters an opening of the concave portion, the protruding portion slides along the sidewall to the bottom surface, such that the protruding portion is coupled to the concave portion.

Abstract: A micro electro mechanical system (MEMS) structure is provided, which includes a first substrate, a second substrate, a MEMS device and a hydrophobic semiconductor layer. The first substrate has a first portion. The second substrate is substantially parallel to the first substrate and has a second portion substantially aligned with the first portion. The MEMS device is between the first portion and the second portion. The hydrophobic semiconductor layer is made of germanium (Ge), silicon (Si) or a combination thereof on the first portion, the second portion or the first portion and the second portion and faces toward the MEMS device. A cap substrate for a MEMS device and a method of fabricating the same are also provided.

Abstract: A method for assembling a touch control display apparatus includes: mounting a frame member to an assembly surface of a touch control panel; fixing a display panel to one of the frame member and the assembly surface of the touch control panel such that a display surface of the display panel faces the touch control panel; mounting at least one electronic component on a section of the frame member that is not covered by the display panel; and coupling a bottom case to the frame member for enclosing the display panel and the at least one electronic component.

Abstract: A hinge fixing structure includes a bezel whereon an opening is formed, and a cover whereon a slot is formed. The hinge fixing structure includes a hinge whereon a hole is formed, and a protrusion bolt. The protrusion bolt includes a fixing portion installed inside the slot on the cover in a tight fit manner, and a protruding portion connected to a side of the fixing portion and passing through the hole of the hinge. The hinge fixing structure further includes a screwing component for passing through the opening on the bezel and being screwed inside the protrusion blot at an end, so as to fix relative position of the bezel, the hinge and the cover.

Abstract: A fixing structure for fixing a display panel is disclosed. The fixing structure includes a bezel and a cover. The bezel includes a frame, a first bending portion bent from a side of the frame, and a first hooking portion connected to an end of the first bending portion. The cover and the bezel cover the display panel together. The cover includes a board, a first curved portion bent from a side of the board, and a first hook component connected to an end of the first curved portion and installed inside the frame and the first bending portion. The first hook component engages with the first hooking portion and fixes a side of the display panel on the side of the first curved portion as the bezel combines with the cover.

Abstract: A portable electronic module includes a bezel, a glass panel device, a first limiting member, a backlight device, a second limiting member, and a back cover. The glass panel device is fixed onto the bezel. The first limiting member is disposed at a first side of the glass panel device. The backlight device is disposed on the glass panel device. The second limiting member is disposed at a second side of the glass panel device for limiting the backlight device cooperatively with the first limiting member. The back cover covers the backlight device and is detachably connected to the bezel for containing the glass panel device and the backlight device cooperatively with the bezel.

Abstract: An embodiment of the disclosure provides a semiconductor device. The semiconductor device includes a plurality of metallization layers comprising a topmost metallization layer. The topmost metallization layer has two metal features having a thickness T1 and being separated by a gap. A composite passivation layer comprises a HDP CVD oxide layer under a nitride layer. The composite passivation layer is disposed over the metal features and partially fills the gap. The composite passivation layer has a thickness T2 about 20% to 50% of the thickness T1.

Abstract: A connector mechanism for connecting a board card is disclosed. The connector mechanism includes a circuit board, and a connector installed on the circuit board. An end of the board card is for inserting into the connector. The connector mechanism further includes a socket installed on the circuit board and located on a side of the connector, a rotating component pivoted to the socket, and at least one connecting component slidably installed on the rotating component and coupled to the circuit board for contacting with the other end of the board card so as to electrically connect to the board card as the end of the board card is inserted into the connector and the rotating component rotates to a connection position.

Abstract: A hinge fixing structure includes a bezel whereon an opening is formed, and a cover whereon a slot is formed. The hinge fixing structure includes a hinge whereon a hole is formed, and a protrusion bolt. The protrusion bolt includes a fixing portion installed inside the slot on the cover in a tight fit manner, and a protruding portion connected to a side of the fixing portion and passing through the hole of the hinge. The hinge fixing structure further includes a screwing component for passing through the opening on the bezel and being screwed inside the protrusion blot at an end, so as to fix relative position of the bezel, the hinge and the cover.

Abstract: A fixing structure for fixing a display panel is disclosed. The fixing structure includes a bezel and a cover. The bezel includes a frame, a first bending portion bent from a side of the frame, and a first hooking portion connected to an end of the first bending portion. The cover and the bezel cover the display panel together. The cover includes a board, a first curved portion bent from a side of the board, and a first hook component connected to an end of the first curved portion and installed inside the frame and the first bending portion. The first hook component engages with the first hooking portion and fixes a side of the display panel on the side of the first curved portion as the bezel combines with the cover.

Abstract: A portable electronic module includes a bezel, a glass panel device, a first limiting member, a backlight device, a second limiting member, and a back cover. The glass panel device is fixed onto the bezel. The first limiting member is disposed at a first side of the glass panel device. The backlight device is disposed on the glass panel device. The second limiting member is disposed at a second side of the glass panel device for limiting the backlight device cooperatively with the first limiting member. The back cover covers the backlight device and is detachably connected to the bezel for containing the glass panel device and the backlight device cooperatively with the bezel.

Abstract: A connector mechanism for connecting a board card is disclosed. The connector mechanism includes a circuit board, and a connector installed on the circuit board. An end of the board card is for inserting into the connector. The connector mechanism further includes a socket installed on the circuit board and located on a side of the connector, a rotating component pivoted to the socket, and at least one connecting component sliably installed on the rotating component and coupled to the circuit board for contacting with the other end of the board card so as to electrically connect to the board card as the end of the board card is inserted into the connector and the rotating component rotates to a connection position.

Abstract: An embodiment of the disclosure provides a semiconductor device. The semiconductor device includes a plurality of metallization layers comprising a topmost metallization layer. The topmost metallization layer has two metal features having a thickness T1 and being separated by a gap. A composite passivation layer comprises a HDP CVD oxide layer under a nitride layer. The composite passivation layer is disposed over the metal features and partially fills the gap. The composite passivation layer has a thickness T2 about 20% to 50% of the thickness T1.

Abstract: The present invention provides a method for mass producing any metal alloy. After melting a metal mixture, a mixture of heating, soaking and/or cooling is processed to obtain the alloy even with a trace element added. The metal alloy made by the present invention thus has a high purity and a low cost.