Patents by Inventor Jen-Shyan Chen

Jen-Shyan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110110088
    Abstract: A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin.
    Type: Application
    Filed: January 13, 2011
    Publication date: May 12, 2011
    Applicant: NEOBULB TECHNOLOGIES, INC.
    Inventor: Jen-Shyan Chen
  • Publication number: 20110089519
    Abstract: The invention discloses a chip lead frame and a photoelectric energy transducing module. The chip lead frame includes an insulator and a plurality of conductors. The insulator includes a first surface, a second surface, a first recess structure formed on the first surface, a through hole passing through the second surface and the first recess structure, and a venting structure. The first recess structure forms an accommodating space. The venting structure communicates with the accommodating space so that when a substrate is being bound to the first recess structure, the air in the accommodating space pressed by the substrate could flow through the venting structure out of the insulator without remaining between the substrate and the first recess structure. A photoelectric energy transducing semiconductor structure could be disposed on the substrate and electrically connected to the conductors, so as to form the photoelectric energy transducing module of the invention.
    Type: Application
    Filed: October 6, 2010
    Publication date: April 21, 2011
    Applicant: NEOBULB TECHNOLOGIES, INC.
    Inventors: Jen-Shyan Chen, Chun-Jen Lin, Yun-Lin Peng, Wei-Yeh Wen
  • Publication number: 20110088752
    Abstract: The invention discloses a photoelectric energy transducing apparatus, which includes a photoelectric energy transducing module and a semiconductor switch. The photoelectric energy transducing module includes a photoelectric energy transducing semiconductor structure, a first positive electrode, and a negative electrode. The semiconductor switch includes a second positive electrode and a second negative electrode. The second positive electrode is electrically connected to the first negative electrode. The second negative electrode is electrically connected to the first positive electrode. When light radiates onto the photoelectric energy transducing semiconductor structure, an electromotive force is induced between the first positive electrode and the first negative electrode, and the electromotive force provides a reverse bias on the semiconductor switch so that the semiconductor switch is cut off.
    Type: Application
    Filed: October 4, 2010
    Publication date: April 21, 2011
    Applicant: NEOBULB TECHNOLOGIES, INC.
    Inventors: Jen-Shyan Chen, Chun-Jen Lin, Yun-Lin Peng, Wei-Yeh Wen
  • Patent number: 7922361
    Abstract: The invention provides light-emitting diode illuminating equipment with high power and high heat-dissipation efficiency. The light-emitting diode illuminating equipment comprises a casing and N first packaged systems. Each of the first packaged systems comprises a first heat pipe, at least one first heat-dissipating fin, and a first diode light-emitting apparatus. Wherein a heat generated during the operation of the first diode light-emitting apparatus is conducted by the first heat pipe from the flat portion of the first heat pipe to the at least one first heat-dissipating fin, and then is dissipated by the at least one first heat-dissipating fin. In particular, the light-emitting diode illuminating equipment, according to the invention, is very suitable to be used as a street lamp.
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: April 12, 2011
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Patent number: 7905644
    Abstract: The invention provides a system-in-package, high power, and highly efficient light-emitting diode lamp. The light-emitting diode lamp, according to the invention, includes a light-guiding device. At least one end of two ends of the light-guiding device, the light, converted by a diode light-emitting device from an electric energy, is emitted into, and then is guided by the light-guiding device outside. The heat generated during light-emitting of the diode light-emitting is conducted by a heat-conducting device from a flat portion thereof to at least one heat-dissipating fin and further dissipated by the at least one heat-dissipating fin.
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: March 15, 2011
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Patent number: 7896527
    Abstract: The invention discloses a light-emitting diode illuminating equipment including an illuminating apparatus and a replaceable shell. The replaceable shell is detachable to be engaged to the illuminating apparatus. The illuminating apparatus includes a heat-dissipating plate device, a plurality of diode light-emitting devices, a plurality of heat-conducting devices, and a hollow barrel. The hollow barrel is engaged to the heat-dissipating plate device to form a space for accommodating the diode light-emitting devices and the heat-conducting devices. Depending on different product designs, the replaceable shell is variously detachable to be engaged to the heat-dissipating plate device or the hollow barrel. Therefore, the appearance of the light-emitting diode illuminating equipment of the invention is beautified by the appearance design of the replaceable shell.
    Type: Grant
    Filed: February 8, 2008
    Date of Patent: March 1, 2011
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Patent number: 7891837
    Abstract: A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: February 22, 2011
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Patent number: 7878687
    Abstract: The invention discloses a light-emitting diode illuminating equipment, including a heat-dissipating plate device, a plurality of heat-conducting devices, a plurality of diode light-emitting apparatuses, a plurality of optical devices, and a hollow barrel. The hollow barrel is engaged to the heat-dissipating plate device to form a space for accommodating the heat-conducting devices, the diode light-emitting apparatuses, and the optical devices. Each of the diode light-emitting apparatuses corresponds to one of the heat-conducting devices. Each of the optical devices corresponds to at least one of the diode light-emitting apparatuses and modulates a light pattern of the corresponding diode light-emitting apparatus. In an embodiment, each of the optical devices includes a cat's-eye-like lens. The cat's-eye-like lens includes a surface, where a groove is formed along an ellipse minor axis of the lens, such that the light transmitted through the lens can form a light pattern for a specific request.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: February 1, 2011
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Publication number: 20100319756
    Abstract: The invention provides a solar cell apparatus with high heat-dissipating efficiency. The solar cell apparatus includes a heat-conducting device, a heat-dissipating device, and an energy-converting device. The heat-conducting device includes a flat portion and a contact portion. The heat-dissipating device contacts the contact portion and includes a plurality of fins. The energy-converting device is disposed on the flat portion and includes a semiconductor structure for converting light into electricity. In the operation of converting energy, heat absorbed by the semiconductor structure could be conducted through the flat portion to the heat-conducting device and the heat-dissipating device and then be dissipated from the fins. Thereby, it is avoided for the semiconductor structure to be over heated to influence the energy conversion efficiency.
    Type: Application
    Filed: March 14, 2008
    Publication date: December 23, 2010
    Inventors: Jen-Shyan Chen, Chung-Zen Lin
  • Publication number: 20100294465
    Abstract: The invention discloses an energy transducing apparatus and an energy transducing equipment grouping a plurality of the energy transducing apparatuses. The energy transducing apparatus includes a heat pipe, a first heat-dissipating member, a second heat-dissipating member, and an energy transducing member. The heat pipe includes a contact portion and a flat portion. The first heat-dissipating member includes a plurality of fins. The second heat-dissipating member is connected to the first heat-dissipating member to form an accommodating space. The contact portion is accommodated in the accommodating space and contacts both the first heat-dissipating member and the second heat-dissipating member. The energy transducing member contacts the flat portion. Thereby, heat generated in operation by the energy transducing member is conducted through the flat portion to the heat pipe and then is dissipated through the first heat-dissipating member, the second heat-dissipating member, and the fins.
    Type: Application
    Filed: January 6, 2009
    Publication date: November 25, 2010
    Inventors: Jen-Shyan Chen, Chung-Zen Lin
  • Publication number: 20100271826
    Abstract: The invention provides a light-emitting diode illuminating equipment, including N diode light-emitting apparatuses and N optical devices, wherein N is a natural number. Each of the optical devices includes a lens. Each of the optical devices corresponds to one of the diode light-emitting apparatus, for modulating a light pattern of the corresponding diode light-emitting apparatus. In an embodiment, the lens of each of the optical devices is a cat's-eye-like lens. The lens includes a surface, where a groove is formed along an ellipse minor axis of the lens, such that the light transmitted through the lens can form a light pattern for a specific request.
    Type: Application
    Filed: June 30, 2010
    Publication date: October 28, 2010
    Applicant: NEOBULB TECHNOLOGIES, INC.
    Inventor: Jen-Shyan Chen
  • Publication number: 20100270565
    Abstract: The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.
    Type: Application
    Filed: July 12, 2010
    Publication date: October 28, 2010
    Applicant: NEOBULB TECHNOLOGIES, Inc.
    Inventor: Jen-Shyan Chen
  • Patent number: 7786490
    Abstract: The invention is to provide a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts and N semiconductor light-emitting die modules, where N is a positive integer lager than or equal to 2. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: August 31, 2010
    Assignee: Neobule Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Patent number: 7777237
    Abstract: The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: August 17, 2010
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Publication number: 20100202145
    Abstract: The invention provides a packaged system that is suitable for a LED package of high power. The packaged system further includes a heat-conducting device surrounded by at least one heat-dissipating fin to effectively dissipate the heat generated by the high power LED package. The packaged system with high efficiency of heat dissipation can be incorporated into various projecting illuminating equipments, such as a flashlight or floodlight, by simply installing the present invention into a housing and providing power connection thereto.
    Type: Application
    Filed: April 20, 2010
    Publication date: August 12, 2010
    Applicant: NEOBULB TECHNOLOGIES, INC.
    Inventor: Jen-Shyan Chen
  • Patent number: 7771088
    Abstract: The invention provides a light-emitting diode illuminating equipment, including N diode light-emitting apparatuses and N optical devices, wherein N is a natural number. Each of the optical devices includes a lens. Each of the optical devices corresponds to one of the diode light-emitting apparatus, for modulating a light pattern of the corresponding diode light-emitting apparatus. In an embodiment, the lens of each of the optical devices is a cat's-eye-like lens. The lens includes a surface, where a groove is formed along an ellipse minor axis of the lens, such that the light transmitted through the lens can form a light pattern for a specific request.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: August 10, 2010
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Patent number: D623326
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: September 7, 2010
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen
  • Patent number: D625875
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: October 19, 2010
    Assignee: NEOBULB TECHNOLOGIES, Inc.
    Inventors: Jen-Shyan Chen, Chung-Jen Lin, Hsian-Lung Tan
  • Patent number: D625876
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: October 19, 2010
    Assignee: Neobulb Technologies, Inc.
    Inventors: Jen-Shyan Chen, Chung-Jen Lin, Hsian-Lung Tan
  • Patent number: D633230
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: February 22, 2011
    Assignee: Neobulb Technologies, Inc.
    Inventor: Jen-Shyan Chen