LED light device
Latest NEOBULB TECHNOLOGIES, Inc. Patents:
- LED component by integrating epitaxial structure and package substrate together and method of manufacturing the same
- LED lighting device
- Semiconductor light-emitting apparatus integrated with heat-conducting/dissipating module
- Light-emitting diode illumination apparatus
- Illuminating equipment using high power LED with high efficiency of heat dissipation
Description
The broken line showing is for the purpose of illustrating environmental structure and forms no part of the claimed design.
Claims
The ornamental design for a LED light device, as shown and described.
Referenced Cited
U.S. Patent Documents
D326537 | May 26, 1992 | Gattari |
D573294 | July 15, 2008 | Chan et al. |
D595005 | June 23, 2009 | Chou |
D597246 | July 28, 2009 | Meyer et al. |
D597247 | July 28, 2009 | Meyer et al. |
D613443 | April 6, 2010 | Chen |
7712927 | May 11, 2010 | Shuai et al. |
7758214 | July 20, 2010 | Lee et al. |
20090201683 | August 13, 2009 | Chuan |
20090296414 | December 3, 2009 | Moriyama et al. |
20100039829 | February 18, 2010 | Tsai |
20100195327 | August 5, 2010 | Inoue et al. |
20100208461 | August 19, 2010 | Xiang et al. |
Patent History
Patent number: D625875
Type: Grant
Filed: Apr 9, 2010
Date of Patent: Oct 19, 2010
Assignee: NEOBULB TECHNOLOGIES, Inc.
Inventors: Jen-Shyan Chen (Hsinchu), Chung-Jen Lin (Taipei), Hsian-Lung Tan (Zhongli)
Primary Examiner: Angela J Lee
Attorney: Thomas, Kayden, Horstemeyer & Risley, LLP.
Application Number: 29/359,367
Type: Grant
Filed: Apr 9, 2010
Date of Patent: Oct 19, 2010
Assignee: NEOBULB TECHNOLOGIES, Inc.
Inventors: Jen-Shyan Chen (Hsinchu), Chung-Jen Lin (Taipei), Hsian-Lung Tan (Zhongli)
Primary Examiner: Angela J Lee
Attorney: Thomas, Kayden, Horstemeyer & Risley, LLP.
Application Number: 29/359,367
Classifications
Current U.S. Class:
Recessed Within Mounting Surface (D26/74)