Patents by Inventor Jen-Ti WANG
Jen-Ti WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11854844Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.Type: GrantFiled: June 16, 2022Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chi-Yuan Chu, Jen-Ti Wang, Wei-Chih Chen, Kuo-Fong Chuang, Cheng-Ho Hung
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Publication number: 20230411193Abstract: When there is an interruption in power to an area of an integrated circuit manufacturing facility, product may be stranded in a vehicle mounted to an automated material handling system. An automated rescue vehicle can be deployed to retrieve the stranded vehicle so that a payload carried by that vehicle can be recovered and processing can resume. The rescue vehicle can carry a battery payload. The battery payload provides backup power while the rescue operation is performed. With such an automated system, no human intervention is needed to recover product during a power outage. In addition to improving wafer throughput during the power outage, such a rescue operation may prevent quality degradation for time-critical sequences of processing operations.Type: ApplicationFiled: June 17, 2022Publication date: December 21, 2023Inventors: Chun-Jung HUANG, Y.Y. LEE, Kuang Huan HSU, Li-Hsin CHU, Jen-Ti WANG, Chieh HSU
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Patent number: 11848221Abstract: A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.Type: GrantFiled: July 25, 2022Date of Patent: December 19, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tzu-Chi Chiu, Jen-Ti Wang, Ting-Wei Wang, Kuo-Fong Chuang
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Publication number: 20230191619Abstract: A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.Type: ApplicationFiled: February 17, 2023Publication date: June 22, 2023Inventors: Jen-Ti Wang, Chih-Wei Lin, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung
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Patent number: 11605553Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.Type: GrantFiled: November 16, 2020Date of Patent: March 14, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Fu-Hsien Li, Chi-Feng Tung, Chi Yuan Chu, Jen-Ti Wang, Hsiang Yin Shen
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Patent number: 11584019Abstract: An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.Type: GrantFiled: December 7, 2020Date of Patent: February 21, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Jen-Ti Wang, Chih-Wei Lin, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung
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Publication number: 20220359252Abstract: A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tzu-Chi CHIU, Jen-Ti WANG, Ting-Wei WANG, Kuo-Fong CHUANG
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Publication number: 20220328330Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.Type: ApplicationFiled: June 16, 2022Publication date: October 13, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chi-Yuan CHU, Jen-Ti WANG, Wei-Chih CHEN, Kuo-Fong CHUANG, Cheng-Ho HUNG
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Publication number: 20220285190Abstract: A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.Type: ApplicationFiled: May 19, 2022Publication date: September 8, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Chih CHEN, Shi-Chi CHEN, Ting-Wei WANG, Jen-Ti WANG, Kuo-Fong CHUANG
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Patent number: 11437258Abstract: A method for storage a workpiece used in fabrication of a semiconductor device includes disposing the workpiece on a workpiece carrier, disposing the workpiece carrier with the workpiece in a workpiece container via a workpiece storage system, identifying a content of the workpiece container, and adjusting a storage condition inside the workpiece container in response to the content of the workpiece container via the workpiece storage system.Type: GrantFiled: July 24, 2019Date of Patent: September 6, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tzu-Chi Chiu, Jen-Ti Wang, Ting-Wei Wang, Kuo-Fong Chuang
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Patent number: 11367637Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.Type: GrantFiled: February 11, 2020Date of Patent: June 21, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chi-Yuan Chu, Jen-Ti Wang, Wei-Chih Chen, Kuo-Fong Chuang, Cheng-Ho Hung
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Patent number: 11348817Abstract: A wafer transport device is moved on a transport rail, and stopped above a load port having a top surface. A light beam is projected onto the top surface of the load port, and image of the top surface is and the light beam is captured. A position of the hoist unit of the wafer transport device is aligned with respect to a position of the load port according to the image. The hoist unit is lowered toward the load port.Type: GrantFiled: November 14, 2019Date of Patent: May 31, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Chih Chen, Shi-Chi Chen, Ting-Wei Wang, Jen-Ti Wang, Kuo-Fong Chuang
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Publication number: 20220155180Abstract: A method for monitoring a transport vehicle is provided. The method includes the operations as follows. A transport vehicle is scanned by a monitor during the transport vehicle is operated on a rail to acquire a vehicle pattern of the transport vehicle. The vehicle pattern of the transport vehicle is analyzed. An abnormal transport vehicle is determined based on the vehicle pattern. The monitor is placed nearby the rail. A method for transport vehicle maintenance is also provided.Type: ApplicationFiled: November 13, 2020Publication date: May 19, 2022Inventors: CHUN-JUNG HUANG, KUANG HUAN HSU, JEN-TI WANG, PO-FENG TSAI, AN-SHENG CHUNG
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Publication number: 20210249297Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.Type: ApplicationFiled: February 11, 2020Publication date: August 12, 2021Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chi-Yuan CHU, Jen-Ti WANG, Wei-Chih CHEN, Kuo-Fong CHUANG, Cheng-Ho HUNG
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Publication number: 20210118665Abstract: An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.Type: ApplicationFiled: December 7, 2020Publication date: April 22, 2021Inventors: Jen-Ti Wang, Chih-Wei Lin, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung
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Publication number: 20210082736Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.Type: ApplicationFiled: November 16, 2020Publication date: March 18, 2021Inventors: Fu-Hsien LI, Chi-Feng TUNG, Chi Yuan CHU, Jen-Ti WANG, Hsiang Yin SHEN
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Patent number: 10867823Abstract: A fault detection method in a semiconductor fabricating factory is provided. The method includes delivering a test vehicle along a rail to a test region. The method further includes projecting a test signal from a transducer that is positioned on the test vehicle over a check board when the test vehicle is located within the test region. The check board and the test vehicle are arranged along an axis that is parallel to the rail. The method also includes performing an analysis of the test signal projected over the check board. In addition, the method includes issuing a warning alarm when an abnormality is detected based on the analysis result.Type: GrantFiled: May 29, 2018Date of Patent: December 15, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chun-Jung Huang, Yung-Lin Hsu, Kuang-Huan Hsu, Wei-Chih Chen, Jen-Ti Wang, Chih-Hung Liu
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Patent number: 10861692Abstract: A method includes receiving a carrier with a plurality of wafers inside; supplying a purge gas to an inlet of the carrier; extracting an exhaust gas from an outlet of the carrier; and generating a health indicator of the carrier while performing the supplying of the purge gas and the extracting of the exhaust gas.Type: GrantFiled: October 26, 2017Date of Patent: December 8, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Jen-Ti Wang, Chih-Wei Lin, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung
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Patent number: 10840121Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.Type: GrantFiled: October 31, 2016Date of Patent: November 17, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Fu-Hsien Li, Chi-Feng Tung, Chi Yuan Chu, Jen-Ti Wang, Hsiang Yin Shen
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Patent number: 10804124Abstract: A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.Type: GrantFiled: December 12, 2018Date of Patent: October 13, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chao-Hsiung Yeh, Hsuan Chang, Jen-Ti Wang, Chin-Tsan Chen, Kuo-Fong Chuang