Patents by Inventor Jen-Ti WANG

Jen-Ti WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200176294
    Abstract: A wafer transport device is moved on a transport rail, and stopped above a load port having a top surface. A light beam is projected onto the top surface of the load port, and image of the top surface is and the light beam is captured. A position of the hoist unit of the wafer transport device is aligned with respect to a position of the load port according to the image. The hoist unit is lowered toward the load port.
    Type: Application
    Filed: November 14, 2019
    Publication date: June 4, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih CHEN, Shi-Chi CHEN, Ting-Wei WANG, Jen-Ti WANG, Kuo-Fong CHUANG
  • Patent number: 10618534
    Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle, a supporting structure, and a first sensor. The wheeled trolley is above a rail of the rail system, is operable to move over the rail, and has a bottom surface. The overhead vehicle body is suspended by the wheeled trolley and below the rail. The supporting structure connects the wheeled trolley and the overhead vehicle body. The first sensor is on the bottom surface of the wheeled trolley and is configured to detect a first parameter of the rail of the rail system.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: April 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Hung Chien, Jen-Ti Wang, Fu-Hsien Li, Chih-Hung Liu, Yung-Lin Hsu
  • Publication number: 20200105557
    Abstract: A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.
    Type: Application
    Filed: December 12, 2018
    Publication date: April 2, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Hsiung YEH, Hsuan CHANG, Jen-Ti WANG, Chin-Tsan CHEN, Kuo-Fong CHUANG
  • Publication number: 20200075378
    Abstract: A method for storage a workpiece used in fabrication of a semiconductor device includes disposing the workpiece on a workpiece carrier, disposing the workpiece carrier with the workpiece in a workpiece container via a workpiece storage system, identifying a content of the workpiece container, and adjusting a storage condition inside the workpiece container in response to the content of the workpiece container via the workpiece storage system.
    Type: Application
    Filed: July 24, 2019
    Publication date: March 5, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tzu-Chi CHIU, Jen-Ti WANG, Ting-Wei WANG, Kuo-Fong CHUANG
  • Publication number: 20200062285
    Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle, a supporting structure, and a first sensor. The wheeled trolley is above a rail of the rail system, is operable to move over the rail, and has a bottom surface. The overhead vehicle body is suspended by the wheeled trolley and below the rail. The supporting structure connects the wheeled trolley and the overhead vehicle body. The first sensor is on the bottom surface of the wheeled trolley and is configured to detect a first parameter of the rail of the rail system.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Hung CHIEN, Jen-Ti WANG, Fu-Hsien LI, Chih-Hung LIU, Yung-Lin HSU
  • Publication number: 20190371636
    Abstract: A fault detection method in a semiconductor fabricating factory is provided. The method includes delivering a test vehicle along a rail to a test region. The method further includes projecting a test signal from a transducer that is positioned on the test vehicle over a check board when the test vehicle is located within the test region. The check board and the test vehicle are arranged along an axis that is parallel to the rail. The method also includes performing an analysis of the test signal projected over the check board. In addition, the method includes issuing a warning alarm when an abnormality is detected based on the analysis result.
    Type: Application
    Filed: May 29, 2018
    Publication date: December 5, 2019
    Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang-Huan HSU, Wei-Chih CHEN, Jen-Ti WANG, Chih-Hung LIU
  • Patent number: 10464583
    Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: November 5, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Hung Chien, Jen-Ti Wang, Fu-Hsien Li, Chih-Hung Liu, Yung-Lin Hsu
  • Publication number: 20190131119
    Abstract: A method includes receiving a carrier with a plurality of wafers inside; supplying a purge gas to an inlet of the carrier; extracting an exhaust gas from an outlet of the carrier; and generating a health indicator of the carrier while performing the supplying of the purge gas and the extracting of the exhaust gas.
    Type: Application
    Filed: October 26, 2017
    Publication date: May 2, 2019
    Inventors: Jen-Ti Wang, Chih-Wei Lin, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung
  • Patent number: 10161033
    Abstract: A cleaning module adapted for cleaning a load port of a processing apparatus in semiconductor fabrication is provided. The cleaning module includes a housing having at least one opening formed on a bottom wall panel of the housing. The cleaning module further includes a filter unit positioned in the housing. The leaning module also includes a driving assembly. The driving assembly is arranged to correspond to the opening and positioned in the housing. The driving assembly is used to create an air flow from outside of the housing via the opening to the filter unit. The filter unit is used to separate particles or contaminants from the air flow.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: December 25, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsueh-Lei Wang, Jen-Ti Wang, Ting-Wei Wang, Wen-Chieh Tsou
  • Publication number: 20180148076
    Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.
    Type: Application
    Filed: July 10, 2017
    Publication date: May 31, 2018
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Hung CHIEN, Jen-Ti WANG, Fu-Hsien LI, Chih-Hung LIU, Yung-Lin HSU
  • Publication number: 20180118398
    Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 3, 2018
    Inventors: Fu-Hsien LI, Chi-Feng TUNG, Chi Yuan CHU, Jen-Ti WANG, Hsiang Yin SHEN
  • Publication number: 20170049284
    Abstract: A cleaning module adapted for cleaning a load port of a processing apparatus in semiconductor fabrication is provided. The cleaning module includes a housing having at least one opening formed on a bottom wall panel of the housing. The cleaning module further includes a filter unit positioned in the housing. The leaning module also includes a driving assembly. The driving assembly is arranged to correspond to the opening and positioned in the housing. The driving assembly is used to create an air flow from outside of the housing via the opening to the filter unit. The filter unit is used to separate particles or contaminants from the air flow.
    Type: Application
    Filed: August 21, 2015
    Publication date: February 23, 2017
    Inventors: Hsueh-Lei WANG, Jen-Ti WANG, Ting-Wei WANG, Wen-Chieh TSOU