Abstract: A backplane test system is provided that uses a pressed or deposited resistive film and infra-red (IR) imaging to visualize and quantify the current drive of pixels. In one form, the system is used for measuring organic light-emitting-diode (OLED) backplanes or other current-actuated-display (CAD) backplanes.

Abstract: A method of manufacturing and using micro assembler systems are described. A method of manufacturing includes disposing a first plurality of electrodes above a first zone of the substrate, wherein the first plurality of electrodes has a first range of spacing. The method further includes disposing a second plurality of electrodes above a second zone of the substrate, wherein the second plurality of electrodes has a second range of spacing that is less than the first range of spacing. A method of using micro assembler systems includes disposing a mobile particle at least partially submersed in an assembly medium above a substrate, a first plurality of electrodes and a second plurality of electrodes. The method further includes conducting a field through individual electrodes of the first plurality of electrodes and the second plurality of electrodes to generate electrophoretic forces or dielectrophoretic forces on the mobile particle.

Abstract: An electrode array including a substrate. The electrode array includes a first plurality of electrodes disposed above a first zone of the substrate, wherein the first plurality of electrodes has a first range of spacing. The electrode array further includes a second plurality of electrodes disposed above a second zone of the substrate, wherein the second plurality of electrodes has a second range of spacing that is less than the first range of spacing.

Abstract: A microassembler system includes an alignment surface, a two-dimensional array of electrodes adjacent the alignment surface, a sensor network arranged adjacent the array of electrodes, and a control computer electrically connected to the array of electrodes and the sensor network, the control computer to receive signals from the sensor network indicating a position of at least one chiplet and to actuate the electrodes to change the position of the chiplet based upon the signals. A method of assembling chiplets includes receiving, at one of an array of control logic units, a signal from a control computer identifying an assembly location in a block of an assembly template at which a chiplet is to be located, using a sensor to determine a chiplet location of a nearest chiplet, and generating, using electrodes corresponding to the control logic unit, a traveling wave pattern to translate and orient the nearest chiplet to the location.

Abstract: The system and method described below allow for real-time control over positioning of a micro-object. A movement of at least one micro-object suspended in a medium can be induced by a generation of one or more forces by electrodes proximate to the micro-object. Prior to inducing the movement, a simulation is used to develop a model describing a parameter of an interaction between each of the electrodes and the micro-object. A function describing the forces generated by an electrode and an extent of the movement induced due to the forces is generated using the model. The function is used to design closed loop policy control scheme for moving the micro-object towards a desired position. The position of the micro-object is tracked and taken into account when generating control signals in the scheme.

Abstract: A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.

Abstract: A microassembler system includes an alignment surface, a two-dimensional array of electrodes adjacent the alignment surface, a sensor network arranged adjacent the array of electrodes, and a control computer electrically connected to the array of electrodes and the sensor network, the control computer to receive signals from the sensor network indicating a position of at least one chiplet and to actuate the electrodes to change the position of the chiplet based upon the signals. A method of assembling chiplets includes receiving, at one of an array of control logic units, a signal from a control computer identifying an assembly location in a block of an assembly template at which a chiplet is to be located, using a sensor to determine a chiplet location of a nearest chiplet, and generating, using electrodes corresponding to the control logic unit, a traveling wave pattern to translate and orient the nearest chiplet to the location.

Abstract: An intermediate transfer surface includes a substrate, a two-dimensional array of electrodes, a dielectric spacer layer on the two-dimensional array of electrodes, and a voltage controller electrically connected to the array of electrodes. A method of manufacturing an intermediate transfer surface, depositing an array of etch stops on a conductive surface, etching the conductive surface to form mesas of the conductive surface separated by gaps, and coating the mesas with a dielectric coating. A microassembly system includes an assembly surface having a first two dimensional array of potential wells on a first surface, a first voltage source electrically connected to the first array of potential wells, an intermediate transfer surface having a second two dimensional array of potential wells on a second surface arranged to face the first surface, and a second voltage source electrically connected to the second array of potential wells.

Abstract: An embodiment is a variable acoustic grating. Each of the local grating structures in an array of local grating structures has a variable impedance such that the impedance is modified, steering an ultrasonic signal impinging on the array in a reflection or transmission mode through a medium.

Abstract: A polarization controlled device has a first layer comprising a group III-nitride semiconductor substrate or template; a second group III-nitride semiconductor layer disposed over the group III-nitride semiconductor substrate or template; a third group III-nitride semiconductor layer disposed over the second group III-nitride semiconductor layer; and a fourth group III-nitride semiconductor layer disposed over the third group III-nitride semiconductor layer. A pn junction is formed at an interface between the third and fourth group III-nitride semiconductor layers. A polarization heterojunction is formed between the second group III-nitride semiconductor layer and the third group III-nitride semiconductor layer. The polarization junction has fixed charges of a polarity on one side of the polarization junction and fixed charges of an opposite polarity on an opposite side of the polarization junction.

Abstract: An embodiment is a method and apparatus for ultrasonic contact imaging. A thin-film transistor (TFT) array is deposited on a substrate. A receiver having a plurality of receiver elements is deposited on the TFT array to receive a received signal. A transmitter adjacent to the receiver generates a transmit signal at an ultrasonic frequency. The transmit signal is reflected from a surface to produce a reflected signal. The received signal is a superposition of the transmit signal and the reflected signal as result of interference. The received signal is representative of differences in acoustic impedances across the surface.

Abstract: An optical imaging system includes a thin film imager that is able to create images of objects in various modes of imaging such as bright field, dark field, frustrated total internal reflection, fly eye, and the like. The imaging system may be an integrated optical design that performs different modes of optical imaging in the same imaging device by positioned pin hole structures in geometries that capture images according to the desired mode of imaging.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: An embodiment is a method and apparatus for coherent ultrasonic imaging. A receiver array has a plurality of receiver elements on a substrate to detect in-phase and quadrature components of a received signal corresponding to a transmit signal. Each of the receiver elements includes a receiver transducer and a thin-film transistor (TFT) receiver circuit. The TFT receiver circuit includes a quadrature detector having a mixer to mix a received signal with a reference signal in a composite bias signal that is distributed across the plurality of receiver elements. A transmitter is acoustically coupled to the plurality of receiver elements to generate the transmit signal through an imaging medium.

Abstract: An optical imaging system includes a thin film imager that is able to create images of objects in various modes of imaging such as bright field, dark field, frustrated total internal reflection, fly eye, and the like. The imaging system may be an integrated optical design that performs different modes of optical imaging in the same imaging device by positioned pin hole structures in geometries that capture images according to the desired mode of imaging.

Abstract: An embodiment is a method and apparatus for coherent ultrasonic imaging. A receiver array has a plurality of receiver elements on a substrate to detect in-phase and quadrature components of a received signal corresponding to a transmit signal. Each of the receiver elements includes a receiver transducer and a thin-film transistor (TFT) receiver circuit. The TFT receiver circuit includes a quadrature detector having a mixer to mix a received signal with a reference signal in a composite bias signal that is distributed across the plurality of receiver elements. A transmitter is acoustically coupled to the plurality of receiver elements to generate the transmit signal through an imaging medium.

Abstract: A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on the sorting unit and then transferred to a substrate. The system, method and apparatus can also include a device for detecting errors in at least one of the micro-objects on the sorting unit and a protection means for preventing an improper micro-object from being transferred to the substrate. The system, method and apparatus can also include an organized micro-object feeder assembly that can transfer at least one of a plurality of micro-objects to the sorting unit or directly to the substrate.

Abstract: An optically based transport system and method for transporting particles across a virtual electrode array are disclosed. The system comprises a photoconductor layer where optically induced electrodes are projected thereon through sequential light images in a traveling wave grid pattern in order to transport particles across the virtual electrode array with a traveling wave.

Abstract: An embodiment is a variable acoustic grating. Each of the local grating structures in an array of local grating structures has a variable impedance such that the impedance is modified, steering an ultrasonic signal impinging on the array in a reflection or transmission mode through a medium.

Abstract: An embodiment is a method and apparatus for ultrasonic contact imaging. A thin-film transistor (TFT) array is deposited on a substrate. A receiver having a plurality of receiver elements is deposited on the TFT array to receive a received signal. A transmitter adjacent to the receiver generates a transmit signal at an ultrasonic frequency. The transmit signal is reflected from a surface to produce a reflected signal. The received signal is a superposition of the transmit signal and the reflected signal as result of interference. The received signal is representative of differences in acoustic impedances across the surface.