Abstract: A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure includes a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip enclosed in the integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip.

Abstract: A BGA (Ball-Grid Array) IC package with an unembedded type of heat-dissipation structure is proposed. The unembedded type of heat-dissipation structure is characterized in that a plurality of thermally-conductive vias are formed in the substrate and extending from the die-attachment area to the back side of the substrate; and further, a plurality of thermally-conductive balls are bonded to the thermally-conductive vias on the back side of the substrate. Moreover, a thermally-conductive layer is formed over a thermally-conductive area on the back side of the substrate on which the thermally-conductive balls are mounted for the purpose of increasing the exposed area of the overall heat-dissipation structure to the atmosphere. This allows the IC-produced heat during operation to be conducted through the thermally-conductive vias, the thermally-conductive balls, and the thermally-conductive layer to be dissipated the atmosphere.

Abstract: A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure includes a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip enclosed in the integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip.

Abstract: An integrated circuit package with a fully-exposed heat sink is provided. The integrated circuit package includes a substrate having a first side being formed with first conductive traces and a second side being formed with second conductive traces. At least one chip is mounted on the substrate and electrically connected to the first conductive traces. A plurality of solder balls are provided at the terminal ends of the second conductive traces to allow external connection of the chip. The fully-exposed heat sink is mounted on the substrate. The heat sink is formed with a plurality of supportive legs arranged in such a manner as to allow a bottom surface of the heat sink to be separated from the chip and a top surface of the heat sink to be tightly attached to a cavity in a mold used to form an encapsulant for enclosing the chip. A plurality of positioning tongues are formed on the heat sink for securing the heat sink in position when performing a molding process for forming the encapsulant.

Abstract: A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure includes a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip enclosed in the integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip.