Patents by Inventor Jenny Shio Yin ONG

Jenny Shio Yin ONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
    Publication number: 20180286804
    Abstract: Interconnects for semiconductor packages are described. An apparatus may comprise a decoupling capacitor on a logic board, and a conductive interconnect element on the logic board, the conductive interconnect element to connect the decoupling capacitor on the logic board to a power conductor comprising a power pad of a semiconductor package, the conductive interconnect element at a different layer than a ground-potential layer of the logic board. Other embodiments are described and claimed.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Applicant: INTEL CORPORATION
    Inventors: SEOK LING LIM, ENG HUAT GOH, HOAY TIEN TEOH, JENNY SHIO YIN ONG, JIA YAN GO, JIUN HANN SIR, MIN SUET LIM
  • Package on wide I/O silicon
    Patent number: 9159714
    Abstract: An apparatus including a die including a device side and an opposite backside, first contacts on the backside and a through vias from the device side to the first contacts and second contacts on the backside of the die or on at least two opposing sidewalls of the die; a secondary die coupled to the first plurality of contacts; and a carrier including carrier contact points operable for mounting the carrier to a substrate. A method including forming a first portion of a carrier adjacent a device side of a die and including carrier contact points operable for mounting the carrier to a substrate; and forming a second portion including second carrier contact points connected to contacts on the backside of the die or on at least two opposing sidewalls of the die; and coupling a secondary die to the second carrier contact points.
    Type: Grant
    Filed: September 28, 2013
    Date of Patent: October 13, 2015
    Assignee: Intel Corporation
    Inventors: Jenny Shio Yin Ong, Choong Kooi Chee, Seok Ling Lim
  • PACKAGE ON WIDE I/O SILICON
    Publication number: 20150091180
    Abstract: An apparatus including a die including a device side and an opposite backside, first contacts on the backside and a through vias from the device side to the first contacts and second contacts on the backside of the die or on at least two opposing sidewalls of the die; a secondary die coupled to the first plurality of contacts; and a carrier including carrier contact points operable for mounting the carrier to a substrate. A method including forming a first portion of a carrier adjacent a device side of a die and including carrier contact points operable for mounting the carrier to a substrate; and forming a second portion including second carrier contact points connected to contacts on the backside of the die or on at least two opposing sidewalls of the die; and coupling a secondary die to the second carrier contact points.
    Type: Application
    Filed: September 28, 2013
    Publication date: April 2, 2015
    Inventors: Jenny Shio Yin ONG, Choong Kooi Chee, Seok Ling Lim