Abstract: The prior art for handling components to be tested is to insert (to load) the components for each of the testing steps in each case individually into the testing device respectively used and to remove them again after each test. This requires very awkward handling of the components and loads the connecting contacts of the components during each testing operation. In addition, it is necessary, for each testing device and for each component, to provide a holder which permits the mechanical and electrical connection between component and testing device. A further disadvantage is to be seen in the fact that components can be interchanged during sorting.

Abstract: The memory cells with floating gates are tested by applying voltage surges to the source or the drain of a selection transistor.

Abstract: The burn-in test device has a multiplicity of test receptacles (101, 102, 103, 104 . . . ) in a test board for receiving semiconductor memories. The test board is wired alternately in such a way that burn-in pulses can be applied to the semiconductor modules in dependence on its organization, with the result that the burn-in pulses are applied in each case to the total number of input/output lines.