Abstract: A corner shield for protecting corners of objects for placement on a substantially horizontal surface comprising a body and an elongated protector. The body comprises inner and outer support sections with a slot therebetween for receiving an elongated protector. The slot has an outer section and an inner section with the outer section angled inwardly from bottom to top by a sloped angle of at least 2 degrees from perpendicular relative to the surface.

Abstract: An arrangement includes a confining layer, a metallization layer and a semiconductor component, wherein the metallization layer is arranged on the semiconductor component, and the confining layer is arranged on the metallization layer, the confining layer spatially establishes a reservoir for the marker material at least partially in a defined manner, the confining layer and the metallization layer include an identical material, and the marker material is arranged in the reservoir of the arrangement.

Abstract: The invention relates to a mold material mixture for producing casting molds for metal processing, a process for producing casting molds, casting molds which can be obtained by the process and their use. The production of the casting molds is carried out using a refractory base molding material and a binder based on water glass. A proportion of a particulate metal oxide selected from the group consisting of silicon dioxide, aluminium oxide, titanium oxide and zinc oxide is added to the binder, with particular preference being given to using synthetic amorphous silicon dioxide. The mold material mixture contains a surface-active material as further significant constituent. The addition of the surface-active material enables the flowability of the mold material mixture to be improved, which makes it possible to produce casting molds having a very complicated geometry.

Abstract: A semiconductor laser includes a main body and a ridge structure arranged on the main body, the ridge structure being oriented along a longitudinal axis above an active zone, wherein the ridge structure has a first width, the ridge structure has two opposite end faces along the longitudinal axis, adjacent to at least one end face, the ridge structure has an end section arranged on one side with respect to a center axis of the ridge structure such that the ridge structure is widened on one side adjacent to the end face, and on an opposite side of the ridge structure relative to the end section a fracture trench is arranged adjacent to the end face and at a distance from the ridge structure in a surface of the main body.

Abstract: An optoelectronic component includes an active zone that generates electromagnetic radiation, wherein the electromagnetic radiation is guided in a guide plane, the electromagnetic radiation is output essentially in the guide plane, the active zone emits stray radiation laterally with respect to the guide plane, an electrical contact pad is provided, the contact pad is arranged outside the guide plane, the contact pad is formed by a surface at least partially covered by a conductive layer, the surface has inclined partial faces, and the electrically conductive layer on at least a subset of the inclined faces of the contact pad is configured to be so thin that electromagnetic stray radiation is emitted via the subset of the inclined faces.

Abstract: A corner shield for protecting corners of objects for placement on a substantially horizontal surface comprising a body and an elongated protector. The body comprises inner and outer support sections with a slot therebetween for receiving an elongated protector. The slot has an outer section and an inner section with the outer section angled inwardly from bottom to top by a sloped angle of at least 2 degrees from perpendicular relative to the surface.

Abstract: An optoelectronic semiconductor chip is disclosed. In an embodiment, the chip includes a semiconductor layer sequence with a first side, a second side and an active zone and at least one via electrically contacting the first side with the second side through the active zone, wherein the via has a base region including a cylinder, a truncated cone or a truncated pyramid, wherein the via is surrounded in a lateral direction by an electric insulation layer, wherein the via has a contact region including a truncated cone, a truncated pyramid, or a spherical or aspherical body, wherein the contract region directly follows the base region, wherein the contact region is in direct contact with the second side, wherein a first flank angle of the base region is different from a second flank angle of the contact region, and wherein the first and second flank angles are related to the lateral direction.

Abstract: The disclosure relates to a flow-conducting grille for arranging on the suction side of a fan, with a grille web structure which comprises radial webs spaced apart in the circumferential direction and coaxial circumferential webs spaced apart in the radial direction, wherein the radial webs of at least one quadrant of the flow-conducting grille are curved in each case over their radial extension, viewed in the circumferential direction, towards a predetermined radial plane extending from a central axis of the flow conducting grille.

Abstract: A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the breaking direction, 2) in at least one depression, the rear boundary face is inclined by an angle of 95° to 170° relative to the top side of the semiconductor wafer, 3) at least one depression includes a shoulder adjacent to the rear boundary face, and 4) the shoulder includes a shoulder face parallel to the top side of the semiconductor wafer and adjacent to the rear boundary face; and breaking the semiconductor wafer in the breaking direction at a breaking plane oriented perpendicularly to the top side of the semiconductor wafer and which runs through the depressions.

Abstract: An arrangement includes a confining layer, a metallization layer and a semiconductor component, wherein the metallization layer is arranged on the semiconductor component, and the confining layer is arranged on the metallization layer, the confining layer spatially establishes a reservoir for the marker material at least partially in a defined manner, the confining layer and the metallization layer include an identical material, and the marker material is arranged in the reservoir of the arrangement.

Abstract: A ventilation device, in particular for heating, cooling and/or humidifying air in residential buildings, includes a duct-shaped housing (1) with an air inlet opening (2) and an air outlet opening (3), and a fan impeller (6) as well as a filter unit, heat exchange unit and/or heating coil unit (14) arranged in the main flow direction (Z) of an air flow generated by the fan impeller (6). An air guiding device (17) is arranged in the flow direction (Z) of the air flow in front of a suction nozzle (16)—configured as a flow conditioner, includes a bar structure with air guiding bars-such that a flow inlet opening is configured on the suction side at an axial height in front of the flow inlet opening (15) by the bar structure whose opening surface is smaller than the opening surface of the flow inlet opening (15).

Abstract: A semiconductor laser includes a main body, a strip having a narrower width provided on the main body, and an active zone that generates light radiation, wherein surfaces of the main body laterally with respect to the strip and side surfaces of the strip are covered with an electrically insulating protective layer, an electrically conductive layer as a contact is provided on a top side of the strip, a cavity is provided between a side surface of the strip and the protective layer at least in a delimited section.

Abstract: A method of producing an electronic component includes providing a surface comprising a first region and a second region adjoining the first region, arranging a sacrificial layer above the first region of the surface, arranging a passivation layer above the sacrificial layer and the second region of the surface, creating an opening in the passivation layer above the first region of the surface, wherein the opening in the passivation layer is created with an opening area that is smaller than the first region, and removing the sacrificial layer and the portions of the passivation layer that are arranged above the first region.

Abstract: The invention relates to a ventilator wheel which is produced in the form of a radial or a diagonal ventilator wheel, and comprises a bottom disc and a plurality of ventilator blades arranged, on said bottom disc, so as to be distributed about an axial rotational axis, said bottom disc comprising a circumferential radial outer edge section that, when viewed in cross-section, extends in a curved shape in at least some sections and thus forms an elliptical transition of said bottom disc from a radial extension into an axial extension.

Abstract: A semiconductor laser includes a main body, a strip having a narrower width provided on the main body, and an active zone that generates light radiation, wherein surfaces of the main body laterally with respect to the strip and side surfaces of the strip are covered with an electrically insulating protective layer, an electrically conductive layer as a contact is provided on a top side of the strip, a cavity is provided between a side surface of the strip and the protective layer at least in a delimited section.

Abstract: A display and operating device has a touch-sensitive display field by way of which the parameters of a parameter vector can be changed. In order to set the parameters, a structure of circular or annular elements is displayed, on the circumference of which a corresponding contact element is positioned. Using the position of a contact element on the circumference of the ring element, the value of the parameter is coded. The contact element is moved by user interaction to different radial positions about the center of the respective ring element to change the parameter value along the display field in the radial direction, and rotated in the circumferential direction of the ring element. The resolution of the parameter adjustment can be established in a simple and intuitive manner by selecting the radial position of the contact element during its rotation.

Abstract: A protective grille for a fan has a web structure which comprises radial webs spaced apart in a circumferential direction and coaxial circumferential webs spaced apart in a radial direction. The protective grille has at least a radial outer region and a central region around a central axis of the protective grille. An envelope surface spanned by the radial outer region and the central region is of convexly curved form in the radial outer region and is of flat form, parallel to a radial plane of the protective grille, in the central region.

Abstract: A semiconductor strip laser and a semiconductor component are disclosed. In embodiments the laser includes a first semiconductor region of a first conductivity type of a semiconductor body, a second semiconductor region of a second different conductivity type of the semiconductor body, at least one active zone of the semiconductor body configured to generate laser radiation between the first and second semiconductor regions. The laser further includes a strip waveguide formed at least in the second semiconductor region and providing a one-dimensional wave guidance along a waveguide direction of the laser radiation generated in the active zone during operation, a first electric contact on the first semiconductor region, a second electric contact on the second semiconductor region and at least one heat spreader dimensionally stably connected to the semiconductor body at least up to a temperature of 220° C., and having an average thermal conductivity of at least 50 W/m·K.

Abstract: A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the breaking direction, 2) in at least one depression, the rear boundary face is inclined by an angle of 95° to 170° relative to the top side of the semiconductor wafer, 3) at least one depression includes a shoulder adjacent to the rear boundary face, and 4) the shoulder includes a shoulder face parallel to the top side of the semiconductor wafer and adjacent to the rear boundary face; and breaking the semiconductor wafer in the breaking direction at a breaking plane oriented perpendicularly to the top side of the semiconductor wafer and which runs through the depressions.

Abstract: The invention relates to a method for regenerating used foundry sand, which is contaminated with soluble glass, wherein: used foundry sand is provided, which is tainted with a binding agent made of the soluble glass, to which a particle-shaped metal oxide is added; and the used foundry sand is subjected to a thermal treatment, wherein the foundry sand is heated to a temperature of at least 200° C., thereby obtaining regenerated foundry sand. The invention further relates to regenerated foundry sand, as that obtained from using the method.