Patents by Inventor Jens Pohl

Jens Pohl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10710663
    Abstract: The invention relates to a two-wheeled vehicle frame with two frame half-shells (1, 1?) which are joined so as to form a support frame (3), thereby forming at least one inner cavity (2). The support frame (3) has at least one separating surface (4) on which the two frame half-shells (1, 1?) rest against each other. The support frame (3) preferably has receiving areas (5, 6, 7) for a handlebar tube and/or a bottom bracket and/or an operator seat tube. The support frame (3) forms a rear structure (8) for assembling a rear wheel (9) at the rear end when seen in the travel direction (z). In order to form the rear structure (8), a left-hand support brace (10) when seen in the travel direction (z) and a right-hand support brace (11) when seen in the travel direction (z) are provided such that the rear wheel (8) can be mounted between the two support braces (10, 11).
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: July 14, 2020
    Assignees: REHAU AG + CO, TECHNISCHE UNIVERSIT√ĄT DRESDEN, STORCK BICYCLE GMBH
    Inventors: Andreas Jedrzejowski, Christian Garthaus, Martin Pohl, Michael Stegelmann, Michael Krahl, Werner Hufenbach, Georg Luttermann, Jens Buder
  • Patent number: 10585034
    Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: March 10, 2020
    Assignee: Infineon Technologies AG
    Inventors: Thomas Spoettl, Mathias Belzner, Ralph Domnick, Jens Pohl, Frank Pueschner, Peter Stampka, Daniel Weiss
  • Patent number: 10567191
    Abstract: A fieldbus system comprises a switching device, a control device and a fieldbus module connected to a first electrical supply voltage, wherein a value of the first electrical supply voltage is ascertained and transmitted to a control device by the fieldbus module, wherein the ascertained value of the first electrical supply voltage is compared with a predetermined value of the first electrical supply voltage by the control device, wherein, if the value of the first electrical supply voltage that is transmitted to the control device is not concordant with the predetermined value of the first electrical supply voltage, shutdown of a second electrical supply voltage by the switching device is initiated by the control device.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: February 18, 2020
    Assignee: Beckhoff Automation GmbH
    Inventors: Christopher Pohl, Jens Sachs, Thomas Rettig
  • Publication number: 20200028263
    Abstract: A method for trimming an antenna applied on a carrier, the method including pressing a region of the carrier out from a carrier plane of the carrier, the region having a portion of the antenna and the region being selected according to a target property of the antenna, and removing at least a part of the portion of the antenna from the pressed-out region of the carrier.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 23, 2020
    Inventors: Frank Pueschner, Jens Pohl
  • Patent number: 10440825
    Abstract: In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies Austria AG
    Inventors: Frank Pueschner, Peter Stampka, Jens Pohl, Marcus Janke
  • Patent number: 10395157
    Abstract: A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: August 27, 2019
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Thomas Spoettl, Jens Pohl, Peter Stampka
  • Patent number: 10380477
    Abstract: A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: August 13, 2019
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Peter Stampka, Siegfried Hoffner, Jens Pohl
  • Patent number: 10282655
    Abstract: A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: May 7, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Frank Pueschner, Siegfried Hoffner, Jens Pohl
  • Patent number: 10198684
    Abstract: A smart card module includes a substrate having a first main surface and a second main surface, which is opposite the first main surface. The substrate has a plurality of plated-through holes, which extend through the substrate from the first main surface to the second main surface. The smart card module further includes a chip over the first main surface of the substrate, a first metal structure over the second main surface of the substrate, electrically insulating material, which covers the first metal structure, and a second metal structure over the electrically insulating material, wherein the second metal structure is electrically insulated from the first metal structure by the electrically insulating material. The chip is connected to the first metal structure by at least one first plated-through hole. The chip is connected to the second metal structure by at least one second plated-through hole.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: February 5, 2019
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Alfred Haimerl, Jens Pohl, Wolfgang Schindler
  • Publication number: 20190033206
    Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.
    Type: Application
    Filed: July 24, 2018
    Publication date: January 31, 2019
    Inventors: Thomas Spoettl, Mathias Belzner, Ralph Domnick, Jens Pohl, Frank Pueschner, Peter Stampka, Daniel Weiss
  • Patent number: 10163820
    Abstract: A method may include providing a chip carrier having a chip supporting region to support a chip, and a chip contacting region having at least one contact pad, the chip carrier being thinner in the chip contacting region such that a first thickness of the chip carrier at the at least one contact pad is smaller than a second thickness of the chip carrier in the chip supporting region. A disposing of the chip, having at least one contact protrusion, over the chip carrier, such that the at least one contact protrusion is arranged over the at least one contact pad may be included. In addition, a pressing of the chip against the chip carrier such that the at least one contact protrusion extends at least partially into the chip contacting region and is electrically contacted to the at least one contact pad may be included.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: December 25, 2018
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Jens Pohl
  • Patent number: 10157848
    Abstract: A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 18, 2018
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Jens Pohl, Thomas Spoettl, Peter Stampka
  • Patent number: 10114992
    Abstract: An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: October 30, 2018
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Jens Pohl, Thomas Spoettl, Peter Stampka
  • Patent number: 9984900
    Abstract: A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element, and a mold material at least partially covering the chip and the adhesive.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: May 29, 2018
    Assignee: Infineon Technologies AG
    Inventors: Thorsten Meyer, Jens Pohl
  • Publication number: 20180040573
    Abstract: A method may include providing a chip carrier having a chip supporting region to support a chip, and a chip contacting region having at least one contact pad, the chip carrier being thinner in the chip contacting region such that a first thickness of the chip carrier at the at least one contact pad is smaller than a second thickness of the chip carrier in the chip supporting region. A disposing of the chip, having at least one contact protrusion, over the chip carrier, such that the at least one contact protrusion is arranged over the at least one contact pad may be included. In addition, a pressing of the chip against the chip carrier such that the at least one contact protrusion extends at least partially into the chip contacting region and is electrically contacted to the at least one contact pad may be included.
    Type: Application
    Filed: October 18, 2017
    Publication date: February 8, 2018
    Inventors: FRANK PUESCHNER, JENS POHL
  • Publication number: 20180032854
    Abstract: A chip card module is provided. The chip card module may include a carrier having a first side and an opposite second side, a chip arranged over the carrier, the chip having a first chip contact, a first and a second antenna contact formed over the first side, a metal-free area formed over the first side between the first antenna contact and the second antenna contact, wherein the metal-free area extends between a first edge portion and a second edge portion of the carrier, and a first chip connection electrically connecting the first chip contact to the first antenna contact, wherein the first chip connection is at least partially arranged over the second side in a region opposite the metal-free area.
    Type: Application
    Filed: July 17, 2017
    Publication date: February 1, 2018
    Inventors: Frank Pueschner, Siegfried Hoffner, Jens Pohl
  • Publication number: 20180025192
    Abstract: An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.
    Type: Application
    Filed: July 10, 2017
    Publication date: January 25, 2018
    Inventors: Frank Pueschner, Jens Pohl, Thomas Spoettl, Peter Stampka
  • Publication number: 20170359897
    Abstract: In various embodiments, a chip card module is provided. The chip card module includes a chip card module contact array having six contact pads that are arranged in two rows having three contact pads each in accordance with ISO 7816, and three additional contact pads that are arranged between the two rows. Each additional contact pad is electrically conductively connected to a respective associated contact pad from a row from the two rows.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 14, 2017
    Inventors: Frank Pueschner, Peter Stampka, Jens Pohl, Marcus Janke
  • Patent number: 9824983
    Abstract: According to various embodiments, a chip carrier may include: a chip supporting region configured to support a chip; a chip contacting region including at least one contact pad for electrically contacting the chip; wherein the chip carrier is thinned in the chip contacting region such that a first thickness of the chip carrier at the at least one contact pad is smaller than a second thickness of the chip carrier in the chip supporting region.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: November 21, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Frank Pueschner, Jens Pohl
  • Publication number: 20170293833
    Abstract: In various embodiments, a smart card is provided. The smart card includes a smart card body having a first depression for accommodating a chip carrier and having a second depression in the first depression for accommodating a chip that is arranged on the chip carrier, and a booster antenna structure having a chip coupling region for inductive coupling to the chip. The chip coupling region includes a plurality of coupling turns. The chip coupling region is embedded in the smart card body. The bottom of the second depression is arranged in the smart card body less deeply than the highest region of the coupling turns which faces the second depression.
    Type: Application
    Filed: April 10, 2017
    Publication date: October 12, 2017
    Inventors: Jens POHL, Frank PUESCHNER