Patents by Inventor Jens Pohl

Jens Pohl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIPID GROWTH FACTOR FORMULATIONS
    Publication number: 20100074959
    Abstract: The present invention is directed to novel formulations and methods for the improved delivery and administration of hydrophobic therapeutic compounds that are substantially insoluble and/or susceptible to precipitation in aqueous solution at physiological pH, including, e.g., growth and differentiation factor-5 and related proteins. Many therapeutic compounds are hydrophobic at physiological pH levels.
    Type: Application
    Filed: October 23, 2007
    Publication date: March 25, 2010
    Applicants: Biopharm Gesellschaft Zur Biotechnologischen Entwicklung von Pharmaka mbH, Healthpartners Research Foundation
    Inventors: Leah R. Hansom, William H. Frey, II, John D. Hoekman, Jens Pohl
  • USE OF GDF-5 FOR THE IMPROVEMENT OR MAINTENANCE OF DERMAL APPEARANCE
    Publication number: 20100047299
    Abstract: The present invention is directed to novel methods and compositions containing growth factor proteins. Said compositions are specifically designed to optimize the amount of crucial structural elements of mammalian tissues. The invention is especially useful for the preservation and improvement of dermal tissue appearance.
    Type: Application
    Filed: January 24, 2008
    Publication date: February 25, 2010
    Applicant: Biopharm Gesellschaft zur biotechnologischen Entwicklung von Pharmaka mbH
    Inventor: Jens Pohl
  • Electronic structure with components connected by way of solderable connecting elements and method
    Patent number: 7666777
    Abstract: For the vertical electrical connection of a number of components, an electronic structure with at least two components has solderable connecting elements, which include at least one socket element and a solder ball stacked on the socket element. The socket element has a cylindrical core of an electrically conducting first material with a lateral surface, a bottom surface and a top surface. The core is surrounded with a cladding of an electrically insulating second material in such a way that the lateral surface of the core is covered by the cladding and the top surface and the bottom surface are kept free of the cladding.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: February 23, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Markus Brunnbauer, Irmgard Escher-Poeppel, Jens Pohl, Christian Stuempfl
  • Electronic circuit in a package-on-package configuration and method for producing the same
    Patent number: 7662664
    Abstract: An electronic circuit in a package-on-package configuration includes: a lower subassembly with a first electronic element, a first wiring carrier, a first housing with a first redistribution layer and an arrangement of solder balls disposed on the first redistribution layer and an upper subassembly with a second electronic element mounted on the lower subassembly. A method for producing the electronic circuit in a package-on-package configuration includes: adhering an upper side of the first electronic element to an underside of the first redistribution layer via a radiation-crosslinking thermoplastic adhesive.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: February 16, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl
  • Coupling substrate for semiconductor components and method for producing the same
    Patent number: 7663223
    Abstract: A coupling substrate for semiconductor components includes a patterned metal layer on a topside of an insulating carrier. Metal tracks project beyond the insulating carrier, the metal tracks being angled away at the lateral edges of the carrier in the direction of the underside of the carrier and projecting beyond the underside of the carrier. The metal tracks have a metal coating, thereby enlarging each cross section such that the metal tracks form dimensionally stable, flat, conductor external contacts of the coupling substrate.
    Type: Grant
    Filed: September 18, 2006
    Date of Patent: February 16, 2010
    Assignee: Infineon Technologies AG
    Inventor: Jens Pohl
  • Package for an electronic component and method for its production
    Patent number: 7656018
    Abstract: A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: February 2, 2010
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Jens Pohl
  • Use of MP52 or MP121 for the treatment and prevention of diseases of the nervous system
    Patent number: 7632808
    Abstract: The present invention concerns the use of biologically active MP52 or/and MP121 for the treatment and prevention of diseases of the nervous system or/and for the treatment of neuropathological situations which are caused by ageing of the nervous system. A pharmaceutical agent according to the invention for the treatment and prevention of diseases of the nervous system or/and for treating neuropathological situations which are caused by ageing of the nervous system therefore contains biologically active MP52 or/and MP121 as the active substance.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: December 15, 2009
    Assignee: Biopharm Gesellschaft zur Biotechnologischen Entwicklung von Pharmaka
    Inventors: Gertrud Hötten, Jens Pohl, Rolf Bechtold, Michael Paulista, Klaus Unsicker
  • Method for applying a structure of joining material to the back surfaces of semiconductor chips
    Patent number: 7592236
    Abstract: A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form via a joining material jet appliance, to the back surfaces of the semiconductor chips of a divided semiconductor wafer.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: September 22, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl
  • SEMICONDUCTOR DEVICE INCLUDING ADHESIVE COVERED ELEMENT
    Publication number: 20090230553
    Abstract: A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element, and a mold material at least partially covering the chip and the adhesive.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 17, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Thorsten Meyer, Jens Pohl
  • Smart card, smart card module, and a method for production of a smart card module
    Patent number: 7575173
    Abstract: A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: August 18, 2009
    Assignee: Infineon Technologies, AG
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Monomeric protein of the TGF-? family
    Patent number: 7569227
    Abstract: The present invention is concerned with proteins selected from the members of the TGF-? superfamily, which are monomeric due to substitution or deletion of a cysteine which is responsible for dimer formation. The invention is also concerned with nucleic acids, encoding such monomeric proteins, vectors or host cells containing the nucleic acids as well as with pharmaceutical compositions comprising the proteins or nucleic acids encoding the proteins. The compositions can be applied advantageously for all indications for which the respective dimeric proteins are useful.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: August 4, 2009
    Assignee: HyGene AG
    Inventors: Gertrud Hötten, Rolf Bechtold, Jens Pohl
  • SEMICONDUCTOR DEVICE
    Publication number: 20090155956
    Abstract: A semiconductor device and method. One embodiment provides an encapsulation plate defining a first main surface and a second main surface opposite to the first main surface. The encapsulation plate includes multiple semiconductor chips. An electrically conductive layer is applied to the first and second main surface of the encapsulation plate at the same time.
    Type: Application
    Filed: February 18, 2009
    Publication date: June 18, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Jens Pohl, Markus Brunnbauer, Irmgard Escher-Poeppel, Thorsten Meyer
  • OSTEOINDUCTIVE MATERIALS
    Publication number: 20090155366
    Abstract: The present invention concerns improved osteoinductive materials comprising matrix materials and morphogenetic roteins, wherein depending on the subject matter the proteins may be dimeric or monomeric proteins. The osteoinductive materials according to the present invention have improved properties. The invention further concerns methods for producing the respective improved osteoinductive materials.
    Type: Application
    Filed: December 17, 2008
    Publication date: June 18, 2009
    Applicant: Biopharm Gesellschaft zur Biotechnologischen Entwicklung von Pharmaka MbH
    Inventors: Jens POHL, Rolf Bechtold, Michael Kruse
  • Method for coating a structure comprising semiconductor chips
    Patent number: 7547645
    Abstract: A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.
    Type: Grant
    Filed: August 16, 2006
    Date of Patent: June 16, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Ludwig Heitzer, Jens Pohl, Peter Strobel, Christian Stuempfl
  • Through Substrate Via Semiconductor Components
    Publication number: 20090134497
    Abstract: A structure and method of forming landing pads for through substrate vias in forming stacked semiconductor components are described. In various embodiments, the current invention describes landing pad structures that includes multiple levels of conductive plates connected by vias such that the electrical connection between a through substrate etch and landing pad is independent of the location of the bottom of the through substrate trench.
    Type: Application
    Filed: November 26, 2007
    Publication date: May 28, 2009
    Inventors: Hans-Joachim Barth, Jens Pohl
  • Electronic component and a panel
    Patent number: 7524699
    Abstract: One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: April 28, 2009
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Semiconductor device having a chip stack on a rewiring plate
    Patent number: 7521809
    Abstract: A semiconductor device having a semiconductor chip stack on a rewiring plate is disclosed. In one embodiment, the device includes an external contact area having a plurality of external contact area regions which are physically separate from one another is arranged on the underside. The individual external contact area regions are assigned to the individual semiconductor chips in the semiconductor chip stack. The external contact regions of an individual external contact area have a common external contact which electrically connects the external contact area regions.
    Type: Grant
    Filed: February 3, 2005
    Date of Patent: April 21, 2009
    Assignee: Infineon Technologies AG
    Inventors: Christian Birzer, Jens Pohl
  • SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD FOR FABRICATING A DEVICE
    Publication number: 20090091022
    Abstract: A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.
    Type: Application
    Filed: October 9, 2007
    Publication date: April 9, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Thorsten Meyer, Markus Brunnbauer, Jens Pohl
  • Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel
    Patent number: 7514273
    Abstract: The invention relates to a method for applying rewiring to a panel. For this purpose, a panel is provided which has a coplanar overall upper side of an upper side of a plastic compound and the upper sides of semiconductor chips. The method provides a rewiring layer with implementation of external contacts and rewiring lines which, by means of a two-stage exposure step, compensates for position errors of the semiconductor chips in the component positions of the panel.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: April 7, 2009
    Assignee: Qimonda AG
    Inventors: Harry Hedler, Jens Pohl, Holger Woerner
  • Placement system for populating a substrate with electronic components
    Patent number: 7500305
    Abstract: A novel method and placement system are configured for populating a substrate with an electronic component. The placement system has a substrate holding device for receiving the substrate, a wafer holding device above the substrate holding device serving for receiving a wafer holding frame, and a vacuum forceps holding device arranged above the wafer holding device. The wafer holding frame can receive a complete semiconductor wafer divided into electronic components.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: March 10, 2009
    Assignee: Qimonda AG
    Inventors: Jürgen Högerl, Jens Pohl, Uta Sasse, Ingo Wennemuth