Abstract: A buffer, logic circuit, and data processing system employing fast turn-off drive circuitry for reducing leakage. Leakage current in logic circuitry is managed by coupling and decoupling the voltage potentials applied to large, high-leakage devices. Circuitry includes a low leakage logic path for holding logic states of an output after turning off high-leakage devices. A fast turn-off logic path in parallel with the low leakage logic path is used to assert each logic state in the forward direction from input to output. The large output device in each fast turn-off path is relieved of leakage stress by asserting logic states at driver inputs that cause the driver to turn OFF after the output logic state has been asserted.

Abstract: Methods and apparatus are provided for creating field effect transistor (FET) body connections with high-quality matching characteristics and no area penalty for partially depleted silicon-on-insulator (SOI) circuits. The FET body connections are created for partially depleted silicon-on-insulator (SOI) technologies by forming adjacent FET devices inside a shallow trench shape. The adjacent FET devices share a common diffusion area, such as source or drain. Selectively spacing apart adjacent gate lines form an underpath connecting bodies of the adjacent FET devices. The underpath is defined by forming an undepleted region on top of a buried oxide layer. The adjacent polysilicon gate lines are selectively spaced apart to define a depth of depletion in a shared diffusion region for creating the underpath. Also, adjacent FET devices with connecting bodies can be built by adding an ion implant masking step to the fabrication process. This masking step changes the depletion depth under the shared diffusion area.

Abstract: Methods and apparatus are provided to ensure functionality and timing robustness in silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) circuits. A select signal for the SOI CMOS circuit is received. A floating body charge monitoring circuit is coupled to the SOI CMOS circuit for monitoring excess body charges in at least one predefined SOI device and providing an output control signal. A select signal adjusting circuit is coupled to the floating body charge monitoring circuit receiving the output control signal and the select signal and providing a conditionally adjusted select signal responsive to the output control signal of the floating body charge monitor circuit. The conditionally adjusted select signal is applied to the SOI CMOS circuit.

Abstract: Methods and apparatus are provided to ensure functionality and timing robustness in silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) circuits. A select signal for the SOI CMOS circuit is received. A floating body charge monitoring circuit is coupled to the SOI CMOS circuit for monitoring excess body charges in at least one predefined SOI device and providing an output control signal. A select signal adjusting circuit is coupled to the floating body charge monitoring circuit receiving the output control signal and the select signal and providing a conditionally adjusted select signal responsive to the output control signal of the floating body charge monitor circuit. The conditionally adjusted select signal is applied to the SOI CMOS circuit.

Abstract: A method and apparatus are provided for implementing enhanced silicon-on-insulator (SOI) passgate operations. The apparatus for implementing enhanced silicon-on-insulator (SOI) passgate operations includes a silicon-on-insulator (SOI) passgate field effect transistor. A select input is coupled to the silicon-on-insulator (SOI) passgate field effect transistor. A discharging field effect transistor of an opposite channel type is coupled to the silicon-on-insulator (SOI) passgate field effect transistor. The discharging field effect transistor is activated during an off cycle of the silicon-on-insulator (SOI) passgate field effect transistor. The discharging field effect transistor is coupled to the body of the SOI passgate field effect transistor. The discharging field effect transistor is deactivated during an on cycle of the SOI passgate field effect transistor, whereby the body of the SOI passgate field effect transistor floats during the on cycle.

Abstract: Methods and apparatus are provided for creating field effect transistor (FET) body connections with high-quality matching characteristics and no area penalty for partially depleted silicon-on-insulator (SOI) circuits. The FET body connections are created for partially depleted silicon-on-insulator (SOI) technologies by forming adjacent FET devices inside a shallow trench shape. The adjacent FET devices share a common diffusion area, such as source or drain. Selectively spacing apart adjacent gate lines form an underpath connecting bodies of the adjacent FET devices. The underpath is defined by forming an undepleted region on top of a buried oxide layer. The adjacent polysilicon gate lines are selectively spaced apart to define a depth of depletion in a shared diffusion region for creating the underpath. Also, adjacent FET devices with connecting bodies can be built by adding an ion implant masking step to the fabrication process. This masking step changes the depletion depth under the shared diffusion area.

Abstract: A tri-state Schmitt trigger inverting device having multiple tri-state controller switching devices between a conventional voltage mode Schmitt trigger its voltage supply rails. When an enabling signal to the tri-state controller switching devices is set to a first level, the tri-state Schmitt trigger functions as a standard logic inverter. When a complementary enabling signal is received at the tri-state controller switching devices, the connections to the high voltage rail and low voltage rail of the tri-state Schmitt trigger are turned off, and the output of the tri-state Schmitt trigger is a high impedance. Thus, the device is a single stage tri-state Schmitt inverter having optimal hysteresis characteristics with minimal power consumption.

Abstract: A silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) Schmitt trigger circuit with controllable hysteresis and a method are provided for adapting a CMOS Schmitt trigger circuit for deep sub-micrometer partially depleted SOI (PD/SOI) applications. A SOI CMOS Schmitt trigger circuit with controllable hysteresis includes a stack of a plurality of field effect transistors (FETs) connected in series between a voltage supply and ground. An input is applied to a gate of each of the stack of the plurality of field effect transistors (FETs). The stack of the plurality of field effect transistors (FETs) provides an output at a junction of a predetermined pair of the plurality of field effect transistors (FETs). At least one feedback field effect transistor (FET) has a source coupled a junction of a predefined pair of the stack of field effect transistors (FETs) and has a gate coupled to the output.

Abstract: A high performance, low cell stress, low-power silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) latch-type sensing method and apparatus are provided. A silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) latch-type sense amplifier includes a precharge circuit for charging complementary bit and data lines to a predefined precharge voltage during a precharge cycle. The precharge voltage is lower than a full rail voltage. The reduced bit and data line precharge voltage substantially reduces voltage stress applied to the access transistors in the RAM cells. A pre-amplifying mechanism produces an offset voltage between the complementary data lines before the. sense amplifier is set. The pre-amplifying mechanism includes a pre-amplifying FET that is substantially smaller than a sensing silicon-on-insulator (SOI) field effect transistor (FET) in the sense amplifier. The pre-amplifying mechanism aids offset voltage development before the sense amplifier is set.

Abstract: Methods and apparatus are provided for monitoring excess body charges in partially depleted SOI CMOS devices. An apparatus for floating body charge monitoring in partially depleted silicon-on-insulator (SOI) CMOS circuits includes a monitor core circuit for conditionally generating an intentional bipolar discharge current. A current mirroring multiplier is coupled to the monitor core circuit for amplifying the intentional bipolar discharge current and generating a state disturb current. A state setting latch is coupled to the current mirroring multiplier for determining and setting a condition for a discharge action.

Abstract: A method and apparatus are provided for tri-state dynamic body charge modulation for sensing devices in silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) applications. A sense amplifier includes a silicon-on-insulator (SOI) field effect transistor. A tri-state body charge modulation circuit is coupled to a body of the silicon-on-insulator (SOI) field effect transistor. The body charge modulation circuit provides a high body bias preparatory state; a floating body state and a low body bias stand-by state enabling high performance operation, good matching characteristics, and low stand-by leakage suitable for low-power applications. The tri-state body charge modulation circuit includes a P-channel field effect transistor (PFET) and an N-channel field effect transistor (NFET) connected between a high voltage potential and ground.

Abstract: In a method and apparatus for reducing parasitic bipolar current in an insulated body, field effect transistor (“FET”), for an n-type FET, the body of the insulated body NFET is electrically isolated, responsive to turning on the NFET. This permits a charge to accumulate on the body in connection with turning the NFET on, temporarily lowering the threshold voltage for the insulated body NFET. Responsive to turning off the insulated body NFET, at least a portion of the charge on the body is discharged. This discharging of the body reduces parasitic bipolar current which would otherwise occur upon turning the NFET back on if the body had charged up during the time when the NFET was off. For a p-type FET that is susceptible to parasitic bipolar current, the body is discharged responsive to turning off the PFET, and isolated responsive to turning on the PFET.

Abstract: An apparatus for improving device matching and switching point tolerance in a silicon-on-insulator cross-coupled circuit is disclosed. The silicon-on-insulator circuit includes first and second sets of transistors, first and second rails, and first and second discharge transistors. The first set of transistors is cross-coupled with the second set of transistors. The first rail is connected to each gate of the transistors in the first set, and the second rail is connected to each gate of the transistors in the second set. The body of at least one transistor within the first set of transistors is connected to the first discharge transistor having the same channel type as the connected transistor. The body of at least one transistor within the second set of transistors is connected to the second discharge transistor having the same channel type as the connected transistor.

Abstract: A silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) sense amplifier is provided with improved matching characteristics and sense point tolerance under no penalty of performance degradation. The sense amplifier includes a silicon-on-insulator (SOI) field effect transistor. A flooding field effect transistor is coupled to a body of the silicon-on-insulator (SOI) field effect transistor. The flooding field effect transistor is activated before the sense amplifier is set. The flooding field effect transistor has an opposite polarity of the silicon-on-insulator (SOI) field effect transistor. The flooding field effect transistor provides a charging path to a voltage supply rail. A pair of flooding field effect transistors serve as charging to voltage supply rail elements for silicon-on-insulator (SOI) field effect transistors on each side of complementary bitline structures of the sense amplifier.