Abstract: The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer.

Abstract: The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern.

Abstract: There is provided an electronic paper display device and a manufacturing method thereof. The electronic paper display device includes a first electrode formed of a transparent material; at least one or more second electrodes disposed to face the first electrode with differing gaps therebetween; and at least one or more display units disposed between the first and second electrodes and having optical properties varied according to voltage applied to the first and second electrodes. The display units are disposed between the first electrode and the second electrodes disposed to face the first electrode with differing gaps, so respective rotation amounts or rotation angles of the display units become different when the same magnitude of voltage is applied. Accordingly, a wide range of contrast levels is displayed.

Abstract: The present invention relates to a common mode filter and a method of manufacturing the same and provides a thin film type common mode filter including: a first magnetic substrate; a first laminate disposed on the first magnetic substrate and including a primary coil pattern electrode; a core magnetic layer disposed on the first laminate; a second laminate disposed on the core magnetic layer and including a secondary coil pattern electrode; and a second magnetic substrate disposed on the second laminate.

Abstract: Disclosed herein are a common mode filter and a fabrication method thereof. The common mode filter includes: a first magnetic substrate; a laminate including insulating sheets with coil pattern electrodes printed thereon, having holes therein, and provided on the first magnetic substrate; a magnetic core inserted into the hole; and a second magnetic substrate integrally formed with the magnetic core and provided on the laminate.

Abstract: The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.

Abstract: The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer provided on the lower magnetic body and including at least one conductor pattern; and an upper magnetic body including a primary ferrite composite provided on the insulating layer and a secondary ferrite composite provided on the primary ferrite composite to cover a pore formed on a surface of the primary ferrite composite, and a method of manufacturing the same. According to the present invention, it is possible to implement a filter for removing noise with high performance and characteristics by increasing magnetic permeability and improving impedance characteristics through simple structure and process.

Abstract: The present invention discloses a filter for removing noise, which includes: a lower magnetic substrate; a coil layer disposed on the lower magnetic substrate and including at least one conductor pattern and an insulating layer covering the conductor pattern; an upper magnetic substrate disposed on the coil layer; and a magnetic permeability enhancing layer disposed on the magnetic substrate with lower magnetic permeability of the lower magnetic substrate and the upper magnetic substrate. According to the present invention, it is possible to implement a filter for removing noise with high performance, characteristics, and reliability by increasing magnetic permeability to improve impedance characteristics and improving an effect of shielding electromagnetic waves such as jamming.

Abstract: A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion.

Abstract: The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer.

Abstract: A coil part is provided. The coil part includes a coil layer, a lower magnetic layer, and an upper magnetic layer. The coil layer includes a primary coil pattern, a secondary coil pattern, and a dielectric including the primary coil pattern and the secondary coil pattern. The lower magnetic layer is disposed under the coil layer. The upper magnetic layer is disposed on the lower magnetic layer to fill up the center and the periphery of the coil layer and cover the coil layer. Accordingly, the coil part can improve filtering characteristics by more smoothly increasing a magnetic flux surrounding the coil pattern. Also, the coil part can cut fabrication costs by reducing the length of the coil pattern with respect to the same characteristics.

Abstract: A coil part is provided. The coil part includes a coil layer including a core and a first coil and a second coil disposed on and under the core, a lower magnetic layer bonded under the coil layer, and an upper magnetic layer bonded on the coil layer. Accordingly, it is possible to improve process and productivity and cut fabrication costs by preventing process defects that occur during the fabrication process of a coil part using a ferrite substrate.

Abstract: Disclosed herein are a magnetic substrate, a common mode filter, a method for manufacturing a magnetic substrate, and a method for manufacturing a common mode filter. The common mode filter includes: a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part, wherein the magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon.

Abstract: Disclosed herein are a conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern including: a straight part; and a curved part connected to the straight part at both sides thereof, wherein a line width of the curved part is smaller than that of the straight part, and an electronic component including the same. With the conductor pattern and the electronic component including the same according to the present invention, the high precision fine line width and the high resolution conductor pattern may be implemented to improve connectivity, thereby improving characteristics and reliability of the electronic component.

Abstract: The present invention provides a magnetic substrate, which comprises a first magnetic layer made of a first magnetic material; and a second magnetic layer made of a second magnetic material, wherein the first and second magnetic materials are equal each other, and have different grain sizes.

Abstract: There are provided a coil component and a manufacturing method thereof which secure coupling force between a coil and a substrate. The coil component includes: a substrate unit including a first substrate layer, an insulating layer stacked on the first substrate, and a second substrate layer stacked on the insulating layer; and coil layers each interposed between the first substrate layer and the insulating layer and between the insulating layer and the second substrate layer.

Abstract: An electrophoretic display device includes: a transparent substrate positioned at a display side and having a transparent front electrode; a wiring substrate disposed to face the transparent substrate and having a field applying unit; a spacer disposed between the transparent substrate and the wiring substrate and having a plurality of accommodating holes with upper and lower portions open; and a plurality of microcapsules respectively positioned in the plurality of accommodating holes and including a dispersion solvent encapsulated with a plurality of charged particles contained therein, wherein the accommodating holes comprise upper holes with a width for receiving the microcapsules and lower holes allowing the microcapsules to be mounted thereon.

Abstract: A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.

Abstract: There are provided an electronic paper display device and a method of manufacturing the same. The electronic paper display device includes first and second substrates disposed to be opposite to each other, and having a predetermined interval therebetween, a plurality of first barrier ribs formed between the first and second substrates to be spaced apart from each other, a plurality of second barrier ribs formed between the first and second substrates, disposed on the plurality of first barrier ribs, and intersecting with the plurality of first barrier ribs and electronic paper display elements disposed in cell spaces formed by the first and second barrier ribs. Therefore, the barrier ribs may be easily formed, a process thereof may be simply performed, and various patterns may be formed.

Abstract: Disclosed herein is a method for manufacturing an electronic paper display device, including: laminating a dry film on a first electrode; performing exposing and developing processes on the dry film to form barriers defining cells; injecting electronic balls into the cells; and binding a second electrode onto the first electrode including the electronic balls.