Patents by Inventor Jeong Do Yang
Jeong Do Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11380219Abstract: A display device includes a display panel including a first region and a second region adjacent to the first region and being extendable, a supporting plate configured to support the first region of the display panel and being inflexible, and an extending portion supporter configured to support the second region of the display panel and being deformable, wherein the extending portion supporter includes a first metal thin film layer and a second metal thin film layer overlapping each other.Type: GrantFiled: March 15, 2019Date of Patent: July 5, 2022Assignee: Samsung Display Co., Ltd.Inventor: Jeong Do Yang
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Patent number: 11016532Abstract: A display device includes: a first roller; a second roller; a gear unit that is coupled to the second roller and configured to rotate with the second roller; a rail unit that is engaged with the gear unit; a housing where the rail unit is provided; and a display panel module of which one end is fixed to the housing and the other end is fixed to the second roller and is configured to be bent by the first roller and then rolled on the second roller, wherein the display panel module is configured to be slide-extended and slide-retracted as the gear unit and the rail unit operate while being engaged with each other.Type: GrantFiled: March 15, 2019Date of Patent: May 25, 2021Assignee: Samsung Display Co., Ltd.Inventor: Jeong Do Yang
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Patent number: 10643931Abstract: A semiconductor chip includes: a base substrate; a conductive pad on one surface of the base substrate; an insulating layer on the one surface of the base substrate and having an opening exposing a portion of the conductive pad; and a bump on the exposed portion of the conductive pad and on the insulating layer around the opening. The bump includes a plurality of concave portions corresponding to the opening and is arranged in a longitudinal direction of the bump.Type: GrantFiled: August 24, 2017Date of Patent: May 5, 2020Assignee: Samsung Display Co., Ltd.Inventors: Seung Hwa Ha, Jung Yun Jo, Byoung Yong Kim, Jeong Do Yang, Jeong Ho Hwang
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Publication number: 20200043383Abstract: A display device includes a display panel including a first region and a second region adjacent to the first region and being extendable, a supporting plate configured to support the first region of the display panel and being inflexible, and an extending portion supporter configured to support the second region of the display panel and being deformable, wherein the extending portion supporter includes a first metal thin film layer and a second metal thin film layer overlapping each other.Type: ApplicationFiled: March 15, 2019Publication date: February 6, 2020Inventor: Jeong Do YANG
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Publication number: 20200033913Abstract: A display device includes: a first roller; a second roller; a gear unit that is coupled to the second roller and configured to rotate with the second roller; a rail unit that is engaged with the gear unit; a housing where the rail unit is provided; and a display panel module of which one end is fixed to the housing and the other end is fixed to the second roller and is configured to be bent by the first roller and then rolled on the second roller, wherein the display panel module is configured to be slide-extended and slide-retracted as the gear unit and the rail unit operate while being engaged with each other.Type: ApplicationFiled: March 15, 2019Publication date: January 30, 2020Inventor: Jeong Do YANG
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Patent number: 10405437Abstract: A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.Type: GrantFiled: August 14, 2017Date of Patent: September 3, 2019Assignee: Samsung Display Co., Ltd.Inventors: Seung-Hwa Ha, Jeong Do Yang, Jung Yun Jo, Jeong Ho Hwang
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Patent number: 10356900Abstract: A circuit board, a display device including the same, and a method of manufacturing a circuit board are provided. A circuit board includes a base substrate, a wiring line provided on the base substrate, a passivation layer provided on the wiring line, an elastic bump provided on the passivation layer, and a conductive layer provided on the elastic bump. The passivation layer includes a first opening and a second opening that expose a partial region of the wiring line, and the second opening is arranged in a region adjacent to the first opening.Type: GrantFiled: August 15, 2017Date of Patent: July 16, 2019Assignee: Samsung Display Co., Ltd.Inventors: Jung Yun Jo, Jeong Do Yang
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Patent number: 10262965Abstract: A display device includes: a flexible substrate having a display area for displaying an image and a peripheral area outside the display area; a first pad electrode in the peripheral area of the flexible substrate; and a driver connected to the first pad electrode. The driver includes: a circuit board including a driving circuit; a second pad electrode on one side of the circuit board and facing the first pad electrode; a convex structure on one side of the second pad electrode and having an oval cross-section; and a bump electrode on one side of the convex structure and connected to the first pad electrode. The bump electrode includes a column covering the convex structure and a convex portion extending from one side of the column and protruding to the first pad electrode.Type: GrantFiled: June 7, 2017Date of Patent: April 16, 2019Assignee: Samsung Display Co., Ltd.Inventors: Seung-Soo Ryu, Jeong Do Yang, Jung Yun Jo
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Patent number: 10153193Abstract: An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.Type: GrantFiled: June 6, 2017Date of Patent: December 11, 2018Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Jeong Do Yang, Byoung Yong Kim, Seung-Soo Ryu, Sang Hyeon Song, Jung Yun Jo, Seung-Hwa Ha, Jeong Ho Hwang
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Patent number: 10014362Abstract: A display device is disclosed. In one aspect, the display device includes a substrate including a display area and a non-display area and an input wiring portion and an output wiring portion formed in the non-display area. The display device also includes a driver integrated circuit (IC) formed over the substrate and electrically connected to the input and output wiring portions. Each of the input and output wiring portions includes a metal layer and a metal carbide layer that covers the metal layer.Type: GrantFiled: September 12, 2016Date of Patent: July 3, 2018Assignee: Samsung Display Co., Ltd.Inventors: Jung Yun Jo, Su Bin Bae, Jang-Kyum Kim, Jeong Do Yang, Chung-Seok Lee
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Publication number: 20180068931Abstract: A semiconductor chip includes: a base substrate; a conductive pad on one surface of the base substrate; an insulating layer on the one surface of the base substrate and having an opening exposing a portion of the conductive pad; and a bump on the exposed portion of the conductive pad and on the insulating layer around the opening. The bump includes a plurality of concave portions corresponding to the opening and is arranged in a longitudinal direction of the bump.Type: ApplicationFiled: August 24, 2017Publication date: March 8, 2018Inventors: Seung Hwa HA, Jung Yun JO, Byoung Yong KIM, Jeong Do YANG, Jeong Ho HWANG
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Publication number: 20180063970Abstract: A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.Type: ApplicationFiled: August 14, 2017Publication date: March 1, 2018Inventors: Seung-Hwa HA, Jeong Do YANG, Jung Yun JO, Jeong Ho HWANG
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Publication number: 20180063953Abstract: A circuit board, a display device including the same, and a method of manufacturing a circuit board are provided. A circuit board includes a base substrate, a wiring line provided on the base substrate, a passivation layer provided on the wiring line, an elastic bump provided on the passivation layer, and a conductive layer provided on the elastic bump. The passivation layer includes a first opening and a second opening that expose a partial region of the wiring line, and the second opening is arranged in a region adjacent to the first opening.Type: ApplicationFiled: August 15, 2017Publication date: March 1, 2018Inventors: Jung Yun JO, Jeong Do YANG
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Publication number: 20180033755Abstract: An exemplary embodiment provides a driving circuit chip including: a substrate; a terminal electrode disposed on the substrate; and an electrode pad disposed on the terminal electrode, wherein the electrode pad includes: a bump structure protruded from the substrate to include a short side and a long side; and a bump electrode disposed on the bump structure and connected with the terminal electrode around a short edge portion of the bump structure, wherein the bump electrode is disposed to not cover at least a part of a long edge portion of the bump structure.Type: ApplicationFiled: July 21, 2017Publication date: February 1, 2018Inventors: Jeong Do YANG, Jeong Ho HWANG, Sang Hyeon SONG, Jung Yun JO, Seung-Hwa HA
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Publication number: 20180019220Abstract: A display device includes: a flexible substrate having a display area for displaying an image and a peripheral area outside the display area; a first pad electrode in the peripheral area of the flexible substrate; and a driver connected to the first pad electrode. The driver includes: a circuit board including a driving circuit; a second pad electrode on one side of the circuit board and facing the first pad electrode; a convex structure on one side of the second pad electrode and having an oval cross-section; and a bump electrode on one side of the convex structure and connected to the first pad electrode. The bump electrode includes a column covering the convex structure and a convex portion extending from one side of the column and protruding to the first pad electrode.Type: ApplicationFiled: June 7, 2017Publication date: January 18, 2018Inventors: Seung-Soo RYU, Jeong Do YANG, Jung Yun JO
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Publication number: 20170365503Abstract: An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.Type: ApplicationFiled: June 6, 2017Publication date: December 21, 2017Inventors: JEONG DO YANG, BYOUNG YONG KIM, SEUNG-SOO RYU, SANG HYEON SONG, JUNG YUN JO, SEUNG-HWA HA, JEONG HO HWANG
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Patent number: 9761560Abstract: A display device includes a panel substrate including a pad region, and a COF (Chip On Film) including a wire region, the wire region including a plurality of wires connected to the pad region of the panel substrate, wherein the plurality of wires in the wire region is arranged into a plurality of sections, intervals between wires within each section being different from intervals between wires within an adjacent section, and at least one of the plurality of sections including a plurality of wires at a fixed interval.Type: GrantFiled: March 11, 2015Date of Patent: September 12, 2017Assignee: Samsung Display Co., Ltd.Inventors: Chung Seok Lee, Jeong Do Yang, Tae Ho Lee
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Publication number: 20170077213Abstract: A display device is disclosed. In one aspect, the display device includes a substrate including a display area and a non-display area and an input wiring portion and an output wiring portion formed in the non-display area. The display device also includes a driver integrated circuit (IC) formed over the substrate and electrically connected to the input and output wiring portions. Each of the input and output wiring portions includes a metal layer and a metal carbide layer that covers the metal layer.Type: ApplicationFiled: September 12, 2016Publication date: March 16, 2017Inventors: Jung Yun Jo, Su Bin Bae, Jang-Kyum Kim, Jeong Do Yang, Chung-Seok Lee
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Publication number: 20160104692Abstract: A display device includes a panel substrate including a pad region, and a COF (Chip On Film) including a wire region, the wire region including a plurality of wires connected to the pad region of the panel substrate, wherein the plurality of wires in the wire region is arranged into a plurality of sections, intervals between wires within each section being different from intervals between wires within an adjacent section, and at least one of the plurality of sections including a plurality of wires at a fixed interval.Type: ApplicationFiled: March 11, 2015Publication date: April 14, 2016Inventors: Chung Seok LEE, Jeong Do YANG, Tae Ho LEE
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Patent number: 8581222Abstract: The present invention relates to a phase change memory device comprising bismuth-tellurium nanowires. More specifically, the bismuth-tellurium nanowires having PRAM characteristics may be prepared by using a porous nano template without any high temperature process and said nanowires may be used in the phase change memory device by using their phase change characteristics to identify memory characteristics.Type: GrantFiled: January 21, 2011Date of Patent: November 12, 2013Assignee: Industry-Academic Cooperation Foundation, Yonsei UniversityInventors: Kyung Hwa Yoo, Nal Ae Han, Sung In Kim, Jeong Do Yang