Abstract: The present invention relates to a use of a human small leucine zipper protein in the adipocyte differentiation procedure. More specifically, sLZIP binds with PPAR?2 to induce the formation of a complex of HDAC3 and PPAR?2, thereby functioning as a corepressor to negatively inhibit the transcriptional activity of PPAR?2 and suppress the differentiation to adipocytes, and thus can be used as a marker for treating diabetes and obesity and developing new medicines therefor.

Abstract: The present invention relates to a use of a human small leucine zipper protein in the osteogenesis procedure. More specifically, sLZIP increases the transcriptional activity of Runx2 and inhibits the transcriptional activity of PPAR?2, thereby increasing the osteoblast differentiation, so that sLZIP performs an important role in the osteogenesis procedure, and thus can be used as a marker for treating bone disease and developing new medicines.

Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.

Abstract: Methods of operating nonvolatile memory devices include counting a number of consecutive read operations performed on a first memory region within the nonvolatile memory device, and executing a page reclaim operation on the first memory region in response to detecting that a count in the number of consecutive read operations meets or exceeds a threshold count. A page reclaim operation may include checking an error bit level within a page of data stored in a multi-level cell block within the memory device. The page reclaim operation may further include moving page data from the multi-level cell block to a single-level cell block in the memory device and error correcting the page data during the moving.

Abstract: The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.

Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.

Abstract: A shielding device that shields high voltage for a voltage connector is provided. In the shielding device, a second wire is brought into contact with a first wire and a shielding terminal is formed at the end of the second wire to shield contact between a voltage connector and the first wire. The shielding terminal is then connected to a shielding plate in the voltage connector to ground the shielding terminal.

Abstract: A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

Abstract: A mobile terminal and a method of controlling a mobile terminal are provided. The method includes displaying a camera preview image; detecting a face area from the camera preview image; if a button for capturing an image is manipulated, correcting an image captured by a camera using the detected face area and displaying the corrected captured image; and storing the corrected captured image.

Abstract: Disclosed is a belt for an image forming apparatus including a releasing coating layer including a layered inorganic compound.

Abstract: Provided is a manufacturing method of an electrode substrate in which a carbon nanotube is strongly bonded on a base by forming a mixed film of the carbon nanotube and a silicon-based organic and inorganic hybrid polymer.

Abstract: A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.

Abstract: A driver knee bolster may include a first bracket arranged on a cowl crossbar, wherein an upper portion may be fixed to the cowl crossbar, a second bracket disposed in front of the first bracket, wherein a lower portion of the second bracket may be coupled to a lower portion of the first bracket, and an upper portion of the second bracket may be spaced apart from the upper portion of the first bracket to form a space therebetween, and a buffering member arranged in the space formed between the first and second brackets.

Abstract: A refrigerator capable of supercooling a target object and a control method thereof are provided. The refrigerator includes a temperature sensor which senses a temperature of the target object in the cooling compartment, wherein the temperature sensor is prevented from being in contact with ambient cool air and is installed on a bottom surface on which the target object is placed so as to sense only the temperature of the target object. Further, the control method includes sensing a temperature of the target object at each interval of a specified time ?t, calculating a difference between two temperatures sensed at specified time intervals, and comparing the difference between two temperatures with a predetermined reference value ?Tc to determine the supercooled state of the target object.

Abstract: A power transmission apparatus according to an embodiment of the present invention can improve the reliability of an opening operation of the high voltage LBS by using both a main circuit opening driving force of an opening spring and an opening driving force from an actuator mechanism. The power transmission apparatus comprises a main circuit opening power transmission mechanism for transmitting an opening position rotating power of a power transmission shaft to the main circuit switch in order to move the main circuit switch to an opening position.

Abstract: Disclosed is a method of manufacturing a conductive coating film having superior chemical resistance or solvent resistance and durability by chemically bonding a resin having an amine group (—NH2) with carbon nanotubes having a carboxyl group (—COOH). The conductive material having high bondability with carbon nanotubes and superior electrical properties includes carbon nanotubes uniformly contained therein, and thus has appropriate surface resistivity, and thereby can be used for antistatic, electrostatic dissipation and electromagnetic shielding purposes and in transparent or opaque electrodes depending on the resistivity value.

Abstract: Disclosed is a large seamless belt which is prevented from being curled in a width direction of the belt.

Abstract: Disclosed herein are a dryer and a method of controlling a cleaning operation thereof that are capable of supplying moisture into a drying chamber of the dryer to wet contaminants in the drying chamber and blowing air to the wetted contaminants to remove the contaminants. The method includes supplying moisture into a drying chamber to wet contaminants in the drying chamber and removing the contaminants wetted by the moisture.

Abstract: A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.

Abstract: A driver knee bolster may include a first bracket arranged on a cowl crossbar, wherein an upper portion may be fixed to the cowl crossbar, a second bracket disposed in front of the first bracket, wherein a lower portion of the second bracket may be coupled to a lower portion of the first bracket, and an upper portion of the second bracket may be spaced apart from the upper portion of the first bracket to form a space therebetween, and a buffering member arranged in the space formed between the first and second brackets.