Patents by Inventor Jeong-Hyun Choi

Jeong-Hyun Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963439
    Abstract: The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the compound according to the present disclosure, it is possible to produce an organic electroluminescent device having improved driving voltage, power efficiency, and/or lifetime properties compared to the conventional organic electroluminescent devices.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: April 16, 2024
    Assignee: Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Eun-Joung Choi, Young-Kwang Kim, Su-Hyun Lee, So-Young Jung, YeJin Jeon, Hong-Se Oh, Dong-Hyung Lee, Jin-Man Kim, Hyun-Woo Kang, Mi-Ja Lee, Hee-Ryong Kang, Hyo-Nim Shin, Jeong-Hwan Jeon, Sang-Hee Cho
  • Publication number: 20240118839
    Abstract: According to embodiments of the present disclosure, there may be provided a memory system and an operating method thereof, including a host accessible area accessible directly from an external device, transmitting information on the host accessible area to an external memory, receiving a direct memory access request generated based on the information for the host accessible area from the external device according to an urgent event, and providing the external device with a direct memory access to the host accessible area in response to the direct memory access request.
    Type: Application
    Filed: October 10, 2022
    Publication date: April 11, 2024
    Inventors: Jeong Hyun KIM, Ji Hun CHOI
  • Patent number: 11944958
    Abstract: Disclosed herein are a catalyst for hydrocracking reaction of high molecular weight components in bio-oil, a method for preparing the same and a method for bio-oil upgrading using the same. The catalyst includes a zeolite carrier; and at least one metal selected from the group consisting of nickel (Ni), ruthenium (Ru) and cerium (Ce) supported on the carrier. The catalyst promotes the hydrocracking of high molecular weight compounds contained in the bio-oil, but also inhibits the polymerization reaction of the decomposed product, thereby more effectively enhancing the hydrocracking reaction of the bio-oil.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: April 2, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chunjae Yoo, Jeong-Myeong Ha, Dong Jin Suh, Jae Wook Choi, Young Hyun Yoon, Kyeongsu Kim, Chang Soo Kim, Kwang Ho Kim, Thi Lien Do
  • Publication number: 20240082095
    Abstract: Disclosed is an exoskeleton-type rehabilitation robot system, including: a body part provided on a chair in which a user sits and provided with a robot arm capable of moving left or right based on the user seated on the chair; a conversion part configured to convert a position of the robot arm with respect to the body part; a driving part configured to articulate the robot arm with respect to the body part; and a controller configured to detect a change in a position of the robot arm and control a left or right driving mode of the driving part according to the position of the robot arm. In accordance with such a configuration, the exoskeleton-type rehabilitation robot system of the present invention is provided integrally with a chair, thereby having excellent space utilization. In addition, the user's initial preparation for rehabilitation training is simple, which can improve efficiency.
    Type: Application
    Filed: December 27, 2021
    Publication date: March 14, 2024
    Applicant: HEXARHUMANCAR CO., LTD
    Inventors: Chang Soo HAN, Ho Jun KIM, Su Hyun PARK, Young Hoon JI, Jeong Ho CHO, Byung Gab RYU, Jeong Gyu PARK, Dong Eun CHOI
  • Patent number: 11921557
    Abstract: A data processing system may include a storage device configured to: transmit, to an exterior, prediction information, for each power mode, that indicates a predicted time for performing a background operation for managing a memory device; and perform the background operation in an idle state of the storage device by switching to a corresponding power mode in response to a power mode control signal that is received in the idle state; and a control device configured to: determine a power mode of the storage device and an idle time for the idle state during which the background operation is performed based on the prediction information; transmit the power mode control signal to the storage device; and suspend, during the idle time, execution of a command processing request transmitted to the storage device.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 5, 2024
    Assignee: SK HYNIX INC.
    Inventors: Ji Hun Choi, Jeong Hyun Kim
  • Publication number: 20230099375
    Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.
    Type: Application
    Filed: December 5, 2022
    Publication date: March 30, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Kyu Chul CHOI, Hye Yeon KIM, In Hwa CHOI, Jae Ho JANG, Jae Hyun PARK, Youn Jun CHO, Jeong Hyun CHOI
  • Publication number: 20230047942
    Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 16, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Kyu Chul CHOI, In Hwa CHOI, Youn Jun CHO, Jae Hyun PARK, Kyo Sung JI, Hye Yeon KIM, Chi Back RYU, Jeong Hyun CHOI, Jae Ho JANG
  • Publication number: 20230021186
    Abstract: The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed
    Type: Application
    Filed: September 18, 2022
    Publication date: January 19, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Jin Soo YEO, Kyu Chul CHOI, In Hwa CHOI, Youn Jun CHO, Jeong Hyun CHOI, Jae Hyun PARK
  • Publication number: 20220354018
    Abstract: Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 3, 2022
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Jin Soo YEO, Kyu Chul CHOI, In Hwa CHOI, Youn Jun CHO, Jeong Hyun CHOI, Jae Hyun PARK
  • Publication number: 20220156468
    Abstract: According to an exemplary embodiment of the present disclosure, there is disclosed a method of analyzing text data performed by a computing device including at least one processor. The method may include: obtaining a concept word list including two or more concept words and a knowledge text for each concept word from an input document; calculating relationship information between two concept words included in the concept word list; and generating knowledge graph data based on the concept word list, the knowledge text for each of the concept words, and the relationship information.
    Type: Application
    Filed: September 9, 2021
    Publication date: May 19, 2022
    Inventors: Kichang KIM, Jonghyun SEONG, Wonyl CHOI, Jeong Hyun CHOI, Youngrok JANG
  • Patent number: 11046821
    Abstract: An emulsion particle, an emulsion including the same, and a method of manufacturing an emulsion are provided. The emulsion particle includes: a core derived from a polymer of an unsaturated ethylenic monomer and including a first sub core and a second sub core surrounding the first sub core; and a shell surrounding the core and including an alkali-soluble resin, wherein the first sub core includes a polymer having a first glass transition temperature, and the second sub core includes a polymer having a second glass transition temperature lower than the first glass transition temperature.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: June 29, 2021
    Assignee: Hanwha Chemical Corporation
    Inventors: Jeong Hyun Choi, Hee Yun Kim, Tae Hoon Yeum, Su Jin Lee, Dae Won Cho
  • Patent number: 10954370
    Abstract: An emulsion, and a method of preparing an emulsion are provided. The emulsion includes styrene/acrylic latex particles and a metal stearate-based material.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: March 23, 2021
    Assignee: Hanwha Chemical Corporation
    Inventors: Hee Yun Kim, Tae Hoon Yeum, Su Jin Lee, Dae Won Cho, Jeong Hyun Choi
  • Publication number: 20190367741
    Abstract: An emulsion, a method of preparing an emulsion, and a method of forming a coating film using an emulsion are provided. The emulsion includes latex particles, wherein each of the latex particles comprises a core portion formed of a polymer matrix having an internal network structure, and a shell portion which surrounds the core portion.
    Type: Application
    Filed: March 14, 2018
    Publication date: December 5, 2019
    Inventors: Dae Won Cho, Hee Yun Kim, Tae Hoon Yeum, Su Jin Lee, Jeong Hyun Choi
  • Publication number: 20190352493
    Abstract: An emulsion, and a method of preparing an emulsion are provided. The emulsion includes styrene/acrylic latex particles and a metal stearate-based material.
    Type: Application
    Filed: January 29, 2018
    Publication date: November 21, 2019
    Inventors: Hee Yun Kim, Tae Hoon Yeum, Su Jin Lee, Dae Won Cho, Jeong Hyun Choi
  • Publication number: 20190352441
    Abstract: An alkali-soluble resin, a method of preparing an alkali-soluble resin, and an emulsion polymer including an alkali-soluble resin are provided. The alkali-soluble resin includes a first monomer including at least one of an acrylic monomer, a methacrylic monomer, and a styrene-based monomer and having no allyl group; and a second monomer having an allyl group, wherein the alkali-soluble resin is prepared by polymerizing the first monomer and the second monomer.
    Type: Application
    Filed: January 18, 2018
    Publication date: November 21, 2019
    Inventors: Su Jin Lee, Hee Yun Kim, Tae Hoon Yeum, Dae Won Cho, Jeong Hyun Choi
  • Publication number: 20190330427
    Abstract: An emulsion particle, an emulsion including the same, and a method of manufacturing an emulsion are provided. The emulsion particle includes: a core derived from a polymer of an unsaturated ethylenic monomer and including a first sub core and a second sub core surrounding the first sub core; and a shell surrounding the core and including an alkali-soluble resin, wherein the first sub core includes a polymer having a first glass transition temperature, and the second sub core includes a polymer having a second glass transition temperature lower than the first glass transition temperature.
    Type: Application
    Filed: December 29, 2017
    Publication date: October 31, 2019
    Inventors: Jeong Hyun CHOI, Hee Yun KIM, Tae Hoon YEUM, Su Jin LEE, Dae Won CHO
  • Patent number: 10053571
    Abstract: The present invention provides a polymer emulsion having heat sealability for a blister package, and a method for preparing the same. Since the polymer emulsion of the present invention includes latex particles having an average particle diameter of a nanosize and a low unimodal particle size distribution, it may exhibit uniform and stable emulsion properties, particularly excellent heat sealability, and thus may be suitably used for a blister package and on the like. Furthermore, the polymer emulsion of the present invention is polymerized in an aqueous medium without using an organic solvent, and thus enables provision of a blister package with minimized harmfulness to a human body and the environment.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: August 21, 2018
    Assignee: HANWHA CHEMICAL CORPORATION
    Inventors: Su Jin Lee, Dae Won Cho, Jeong Hyun Choi, Sang Hyun Cho
  • Patent number: 9859847
    Abstract: A parallel output linear amplifier is provided that includes a transconductance amplifier configured to receive an analog input signal from an input terminal and amplify the analog input signal. The parallel output linear amplifier also includes a first pre-amplifier connected to the transconductance amplifier and operated using a floating drive voltage, and a cascode class AB amplifier connected to the first pre-amplifier and configured to provide an amplified signal to an output terminal. The parallel output linear amplifier further includes a second pre-amplifier configured connected to the transconductance amplifier and operated using the floating drive voltage, and a cascade class AB amplifier connected to the second pre-amplifier and configured to provide an amplified signal to the output terminal.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: January 2, 2018
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Ji-Seon Paek, Seung-Chul Lee, Young-Hwan Choo, Sung-Jun Lee, Jun-Hee Jung, Thomas Byunghak Cho, Jeong-Hyun Choi
  • Patent number: D966240
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: October 11, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Kyu Chul Choi, In Hwa Choi, Youn Jun Cho, Jae Hyun Park, Kyo Sung Ji, Hye Yeon Kim, Chi Back Ryu, Jeong Hyun Choi
  • Patent number: D966241
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: October 11, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Kyu Chul Choi, In Hwa Choi, Youn Jun Cho, Jae Hyun Park, Kyo Sung Ji, Hye Yeon Kim, Chi Back Ryu, Jeong Hyun Choi