Abstract: A heat dissipation device for an electronic element includes a first chamber containing a printed circuit board with heating elements, and a second chamber for heat exchange. The second chamber contains a refrigerant injection part and supply part. A heat transfer part between the chambers receives heat from the heating elements and transfers it to the second chamber. A condensing part condenses injected refrigerant. The heat transfer part has evaporation-inducing ribs on its surface exposed to the second chamber, allowing injected liquid refrigerant to be adsorbed and flow downward in a zigzag pattern. This configuration enables efficient heat dissipation through phase changes of the refrigerant as it evaporates and condenses. The device may also include features like specially-shaped condensation ribs, a blower part to improve condensation, and a pressure regulator for the second chamber. This design provides improved heat dissipation performance without increasing device size.

Abstract: A cooling apparatus for an electronic element includes a first chamber in a non-vacuum state, the first chamber being configured such that a printed circuit board equipped with a heat-generating element is disposed in the first chamber, a second chamber in a vacuum state, the second chamber being configured such that a spray unit configured to spray a refrigerant and a refrigerant supply unit configured to supply the refrigerant to the spray unit are disposed in the second chamber, and an evaporation unit disposed between the first chamber and the second chamber, in which the spray unit sprays the refrigerant, which is supplied by the refrigerant supply unit and condensed in the second chamber, into the second chamber, and in which the evaporation unit evaporates the refrigerant, which is sprayed into the second chamber by the spray unit.

Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.

Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.

Abstract: The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed

Abstract: Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size.

Abstract: According to an exemplary embodiment of the present disclosure, there is disclosed a method of analyzing text data performed by a computing device including at least one processor. The method may include: obtaining a concept word list including two or more concept words and a knowledge text for each concept word from an input document; calculating relationship information between two concept words included in the concept word list; and generating knowledge graph data based on the concept word list, the knowledge text for each of the concept words, and the relationship information.

Abstract: An emulsion particle, an emulsion including the same, and a method of manufacturing an emulsion are provided. The emulsion particle includes: a core derived from a polymer of an unsaturated ethylenic monomer and including a first sub core and a second sub core surrounding the first sub core; and a shell surrounding the core and including an alkali-soluble resin, wherein the first sub core includes a polymer having a first glass transition temperature, and the second sub core includes a polymer having a second glass transition temperature lower than the first glass transition temperature.

Abstract: An emulsion, and a method of preparing an emulsion are provided. The emulsion includes styrene/acrylic latex particles and a metal stearate-based material.

Abstract: An emulsion, a method of preparing an emulsion, and a method of forming a coating film using an emulsion are provided. The emulsion includes latex particles, wherein each of the latex particles comprises a core portion formed of a polymer matrix having an internal network structure, and a shell portion which surrounds the core portion.

Abstract: An emulsion, and a method of preparing an emulsion are provided. The emulsion includes styrene/acrylic latex particles and a metal stearate-based material.

Abstract: An alkali-soluble resin, a method of preparing an alkali-soluble resin, and an emulsion polymer including an alkali-soluble resin are provided. The alkali-soluble resin includes a first monomer including at least one of an acrylic monomer, a methacrylic monomer, and a styrene-based monomer and having no allyl group; and a second monomer having an allyl group, wherein the alkali-soluble resin is prepared by polymerizing the first monomer and the second monomer.

Abstract: An emulsion particle, an emulsion including the same, and a method of manufacturing an emulsion are provided. The emulsion particle includes: a core derived from a polymer of an unsaturated ethylenic monomer and including a first sub core and a second sub core surrounding the first sub core; and a shell surrounding the core and including an alkali-soluble resin, wherein the first sub core includes a polymer having a first glass transition temperature, and the second sub core includes a polymer having a second glass transition temperature lower than the first glass transition temperature.

Abstract: The present invention provides a polymer emulsion having heat sealability for a blister package, and a method for preparing the same. Since the polymer emulsion of the present invention includes latex particles having an average particle diameter of a nanosize and a low unimodal particle size distribution, it may exhibit uniform and stable emulsion properties, particularly excellent heat sealability, and thus may be suitably used for a blister package and on the like. Furthermore, the polymer emulsion of the present invention is polymerized in an aqueous medium without using an organic solvent, and thus enables provision of a blister package with minimized harmfulness to a human body and the environment.

Abstract: A parallel output linear amplifier is provided that includes a transconductance amplifier configured to receive an analog input signal from an input terminal and amplify the analog input signal. The parallel output linear amplifier also includes a first pre-amplifier connected to the transconductance amplifier and operated using a floating drive voltage, and a cascode class AB amplifier connected to the first pre-amplifier and configured to provide an amplified signal to an output terminal. The parallel output linear amplifier further includes a second pre-amplifier configured connected to the transconductance amplifier and operated using the floating drive voltage, and a cascade class AB amplifier connected to the second pre-amplifier and configured to provide an amplified signal to the output terminal.

Abstract: The present invention provides a polymer emulsion having heat sealability for a blister package, and a method for preparing the same. Since the polymer emulsion of the present invention includes latex particles having an average particle diameter of a nanosize and a low unimodal particle size distribution, it may exhibit uniform and stable emulsion properties, particularly excellent heat sealability, and thus may be suitably used for a blister package and on the like. Furthermore, the polymer emulsion of the present invention is polymerized in an aqueous medium without using an organic solvent, and thus enables provision of a blister package with minimized harmfulness to a human body and the environment.

Abstract: The present invention relates to a resin for a blister package and a preparation method thereof. The resin for a blister package according to the present invention is a water-soluble resin which can minimize a hazard to a human body due to residual of a solvent, and particularly, a resin layer formed by using the resin can show an excellent heat seal property and is hardly deformed at the heat seal temperature condition.

Abstract: A parallel output linear amplifier is provided that includes a transconductance amplifier configured to receive an analog input signal from an input terminal and amplify the analog input signal. The parallel output linear amplifier also includes a first pre-amplifier connected to the transconductance amplifier and operated using a floating drive voltage, and a cascode class AB amplifier connected to the first pre-amplifier and configured to provide an amplified signal to an output terminal. The parallel output linear amplifier further includes a second pre-amplifier configured connected to the transconductance amplifier and operated using the floating drive voltage, and a cascade class AB amplifier connected to the second pre-amplifier and configured to provide an amplified signal to the output terminal.