Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: A method of searching an MP-MLQ fixed codebook through bit predetermination includes the steps of generating a target vector with amplitude, reducing time to search an optimal pulse array through the bit predetermination and searching all of pulses if two errors have an identical value.

Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: The multi functional cleaning module comprises a plurality of air curtain, an eximer ultraviolet light irradiating device, a brush, a high-speed shower device, and an air knife, where they are arranged continually on a plan and the glass substrates are inserted continually into them. The cleaning apparatus using the multi functional cleaning module comprises a driving part having a loading and an unloading portions as well as the multi functional cleaning module.

Abstract: A semiconductor chip comprises a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern. The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region. The bond pad-wiring pattern is formed substantially in a center region of the semiconductor substrate. Thus, with the embodiments of the present invention, the overall chip size can thereby be substantially reduced and an MCP can be fabricated without the problems mentioned above.

Abstract: The invention provides method of etching and cleaning objects contained in a vessel, including: etching the objects by providing etching solution into the vessel; exiting the etching solution from the vessel by providing pressurized gas into the vessel; cleaning the objects by providing cleaning solution into the vessel; and draining the cleaning solution from the vessel. By exiting the etching with pressurized gas such as nitrogen gas, there is no density difference of the etching solution through out the objects, leading to uniform etching of the objects.

Abstract: The multi functional cleaning module comprises a plurality of air curtain, an eximer ultraviolet light irradiating device, a brush, a high-speed shower device, and an air knife, where they are arranged continually on a plan and the glass substrates are inserted continually into them.

Abstract: A method for improving process time and speech quality of G.723.1 and reducing bit rate in a CLEP (Code Excited Linear Prediction) voice coder (or, called as vocoder) includes: a method of searching MP-MLQ fixed codebook through bit predetermination includes the steps of generating a target vector with amplitude, reducing time to search an optimal pulse array through the bit predetermination and searching all of pulses if two errors have an identical value; a formant post-filtering method of extracting a reflection coefficient of a slope compensation filter to apply a multi-degree slope compensation thereto; a pitch post-filtering method including an energy level standardization step and a step of generating a signal approximate to an average energy level; a VAD algorithm method using an energy, a pitch gain and a LSP distance; and a method of enhancing a processing time of G.723.