Patents by Inventor Jeong-kyu Ha

Jeong-kyu Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200372232
    Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: WOONBAE KIM, Jikho SONG, Sungeun JO, Ji-Yong PARK, Jeong-Kyu HA
  • Patent number: 10776601
    Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woonbae Kim, Jikho Song, Sungeun Jo, Ji-Yong Park, Jeong-Kyu Ha
  • Patent number: 10504829
    Abstract: A semiconductor package includes a substrate having a top surface on which a semiconductor chip is mounted and a bottom surface opposite the top surface, an upper metal pattern including an upper connection region to which an external electrical device is connected and a chip connection region to which the semiconductor chip is connected, a lower metal pattern including a lower connection region to which other external electrical device is connected, and an intermediate metal pattern electrically connecting the upper and lower metal patterns. The upper metal pattern provides at least three groups of inner leads. The lower metal pattern provides at least three groups of outer leads. A module, such as that of a display device, may include the semiconductor package.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: December 10, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jeong-Kyu Ha
  • Patent number: 10487021
    Abstract: The present disclosure relates to catalysts supported on a modified-carrier for oxidative coupling reaction of methane and a method for oxidative coupling reaction of methane using the same. The catalysts in which sodium tungstate is supported on a delaminated zeolite carrier increase the methane conversion rate and the selectivity to C2+ hydrocarbon compounds and thereby improve the reactivity of the oxidative coupling reaction of methane.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: November 26, 2019
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sangseo Gu, Jeong-Myeong Ha, Jae Wook Choi, Dong Jin Suh, Young Hyun Yoon, Jungho Jae, Jung Kyu Choi
  • Publication number: 20190240578
    Abstract: An apparatus for controlling an object may include a communicator configured to communicate with a first user terminal and a second user terminal, and a processor configured to control a first object corresponding to a first user in a virtual world to be displayed, configured to control the first object to move in the virtual world in response to a movement control of the first user, configured to randomly select at least one candidate object in response to a morphing control of the first user, and configured to change the first object to a second object when the first user selects the second object from the at least one candidate object. Methods for controlling an object are also provided.
    Type: Application
    Filed: April 19, 2019
    Publication date: August 8, 2019
    Inventors: Jung Kyu YE, Geon Yeong KIM, Chang Hoon YI, Joo Seok LEE, Guhyun PARK, Young Suk KIM, Jae Hyun PARK, June Sik YI, Hun Joon HA, Nak Hyun KIM, Ho Sik KIM, Jeong Min SEO, Tae Hoon KOO, Duc Chun KIM, Seoung Hwi JUNG, Byung Eun JIN, Jin Woo LEE, Seok Hyun KIM, Ju Yong LIM, Hyun Ju CHO, Sang Yeop LEE, Min Kwan CHAE, Sang Ho KIM, Hee Seok KANG, Seongkwan LEE, Jeong Pyo HONG, Choong Yeol LEE, Yong Woo PARK, Kyoung Su LEE, Yu Ju KIM, Dong Gook LEE, Hyun Jin KIM, Hyun Jeong LEE, Dong Young CHANG, Jong Min LEE, Jin Woo LEE, Song I HAN, Taek Ki LEE, Eun Ji NAM, Choon Hwa LEE, Young Min KANG, Jung Soo LEE
  • Publication number: 20190213373
    Abstract: Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.
    Type: Application
    Filed: July 5, 2018
    Publication date: July 11, 2019
    Inventors: Woonbae KIM, Jikho SONG, Sungeun JO, Ji-Yong PARK, Jeong-Kyu HA
  • Publication number: 20190189551
    Abstract: A semiconductor package includes a substrate having a top surface on which a semiconductor chip is mounted and a bottom surface opposite the top surface, an upper metal pattern including an upper connection region to which an external electrical device is connected and a chip connection region to which the semiconductor chip is connected, a lower metal pattern including a lower connection region to which other external electrical device is connected, and an intermediate metal pattern electrically connecting the upper and lower metal patterns. The upper metal pattern provides at least three groups of inner leads. The lower metal pattern provides at least three groups of outer leads. A module, such as that of a display device, may include the semiconductor package.
    Type: Application
    Filed: August 7, 2018
    Publication date: June 20, 2019
    Inventor: JEONG-KYU HA
  • Patent number: 10315112
    Abstract: An apparatus for controlling an object may include a communicator configured to communicate with a first user terminal and a second user terminal, and a processor configured to control a first object corresponding to a first user in a virtual world to be displayed, configured to control the first object to move in the virtual world in response to a movement control of the first user, configured to randomly select at least one candidate object in response to a morphing control of the first user, and configured to change the first object to a second object when the first user selects the second object from the at least one candidate object. Methods for controlling an object are also provided.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: June 11, 2019
    Assignee: Nexon Korea Corporation
    Inventors: Jung Kyu Ye, Geon Yeong Kim, Chang Hoon Yi, Joo Seok Lee, Guhyun Park, Young Suk Kim, Jae Hyun Park, June Sik Yi, Hun Joon Ha, Nak Hyun Kim, Ho Sik Kim, Jeong Min Seo, Tae Hoon Koo, Duc Chun Kim, Seoung Hwi Jung, Byung Eun Jin, Jin Woo Lee, Seok Hyun Kim, Ju Yong Lim, Hyun Ju Cho, Sang Yeop Lee, Min Kwan Chae, Sang Ho Kim, Hee Seok Kang, Seongkwan Lee, Jeong Pyo Hong, Choong Yeol Lee, Yong Woo Park, Kyoung Su Lee, Yu Ju Kim, Dong Gook Lee, Hyun Jin Kim, Hyun Jeong Lee, Dong Young Chang, Jong Min Lee, Jin Woo Lee, Song I Han, Taek Ki Lee, Eun Ji Nam, Choon Hwa Lee, Young Min Kang, Jung Soo Lee
  • Patent number: 10304764
    Abstract: In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the first surface and the second surface, and the first plurality of pads is arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction. At least one merge line is electrically connecting at least two of the first plurality of pads.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yechung Chung, Woonbae Kim, Soyoung Lim, Jeong-Kyu Ha
  • Publication number: 20190152876
    Abstract: The present disclosure relates to catalysts supported on a modified-carrier for oxidative coupling reaction of methane and a method for oxidative coupling reaction of methane using the same. The catalysts in which sodium tungstate is supported on a delaminated zeolite carrier increase the methane conversion rate and the selectivity to C2+ hydrocarbon compounds and thereby improve the reactivity of the oxidative coupling reaction of methane.
    Type: Application
    Filed: December 28, 2017
    Publication date: May 23, 2019
    Inventors: Sangseo GU, Jeong-Myeong HA, Jae Wook CHOI, Dong Jin SUH, Young Hyun YOON, Jungho JAE, Jung Kyu CHOI
  • Patent number: 10282587
    Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: May 7, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Inho Choi, Youngdoo Jung, Woonbae Kim, Jungwoo Kim, Ji-Yong Park, Kyoungsuk Yang, Jeong-Kyu Ha
  • Patent number: 10134667
    Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 20, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-woo Kim, Jae-min Jung, Ji-yong Park, Jeong-kyu Ha, Woon-bae Kim
  • Publication number: 20180247882
    Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
    Type: Application
    Filed: April 27, 2018
    Publication date: August 30, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-woo Kim, Jae-min Jung, Ji-yong Park, Jeong-kyu Ha, Woon-bae Kim
  • Patent number: 9978674
    Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: May 22, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-woo Kim, Jae-min Jung, Ji-yong Park, Jeong-kyu Ha, Woon-bae Kim
  • Patent number: 9929083
    Abstract: A semiconductor package includes a flexible film substrate including a chip mounting region and a cut-line interposed between an inner region and an outer region of the flexible film substrate, the cut-line partially surrounding the inner region. The semiconductor package further includes first interconnection lines extending in the inner region from a first side of the chip mounting region towards an edge of the inner region of the flexible film substrate, and second interconnection lines extending in the outer region from a second side of the chip mounting region towards an edge of the outer region of the flexible film substrate. The edge of the inner region and the edge of the outer region are located on the first side of the semiconductor chip.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: March 27, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jeong-Kyu Ha
  • Patent number: 9922891
    Abstract: A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor chip disposed between the first output test pad and the second output test pad on a second surface opposing to the first surface of the insulating film.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: March 20, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soyoung Lim, JaeMin Jung, Jeong-Kyu Ha, Donghan Kim
  • Publication number: 20170372992
    Abstract: In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the first surface and the second surface, and the first plurality of pads is arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction. At least one merge line is electrically connecting at least two of the first plurality of pads.
    Type: Application
    Filed: March 21, 2017
    Publication date: December 28, 2017
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yechung CHUNG, Woonbae KIM, Soyoung LIM, Jeong-Kyu HA
  • Patent number: 9818732
    Abstract: Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: November 14, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Min Jung, Sang-Uk Han, KwanJai Lee, KyongSoon Cho, Jeong-Kyu Ha
  • Publication number: 20170287814
    Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.
    Type: Application
    Filed: April 5, 2017
    Publication date: October 5, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-woo KIM, Jae-min JUNG, Ji-yong PARK, Jeong-kyu HA, Woon-bae KIM
  • Publication number: 20170235997
    Abstract: A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.
    Type: Application
    Filed: December 30, 2016
    Publication date: August 17, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Inho CHOI, Youngdoo JUNG, Woonbae KIM, Jungwoo KIM, Ji-Yong PARK, Kyoungsuk YANG, Jeong-Kyu HA