Patents by Inventor Jeong-kyu Ha

Jeong-kyu Ha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7915727
    Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: March 29, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung-sei Choi, Byung-seo Kim, Young-jae Joo, Ye-chung Chung, Kyong-soon Cho, Sang-heui Lee, Si-hoon Lee, Sa-yoon Kang, Dae-woo Son, Sang-gui Jo, Jeong-kyu Ha, Young-sang Cho
  • Publication number: 20090273076
    Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
    Type: Application
    Filed: April 17, 2009
    Publication date: November 5, 2009
    Inventors: Kyong-sei CHOI, Byung-seo Kim, Young-jae Joo, Ye-chung Chung, Kyong-soon Cho, Sang-heui Lee, Si-hoon Lee, Sa-yoon Kang, Dae-woo Son, Sang-gui Jo, Jeong-kyu Ha, Young-sang Cho