Patents by Inventor Jeong-Min Cho

Jeong-Min Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160152274
    Abstract: A B-pillar unit for a vehicle is provided. The B-pillar unit includes a B-pillar that is connected to a vehicle body. In particular, the B-pillar includes a roof surface, a left surface, a right surface and a floor surface that are connected in a substantially circular shape.
    Type: Application
    Filed: March 16, 2015
    Publication date: June 2, 2016
    Inventors: Kyung Bum Kang, Huen Sick Min, Jeong Min Cho
  • Patent number: 9245685
    Abstract: Disclosed herein is a common mode filter including: a body element including an insulating member enclosing a coil electrode pattern and a magnetic member disposed on one surface or both surfaces of the insulating member; and an insulating layer disposed on at least one side of the body element, thereby increasing an interlayer adhesion between the respective components configuring the common mode filter.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: January 26, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Min Cho, Sung Kwon Wi, Chan Yoon, Ho Jin Yun, Young Seuck Yoo
  • Patent number: 9236847
    Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a dielectric layer laminated on the magnetic substrate; an external electrode formed on the dielectric layer in such a way that one surface thereof is exposed to an outside; a conductive pattern formed on a surface of the dielectric layer so as to be located on a same plane as the external electrode and having one end thereof connected with the external electrode; an insulator film formed on a surface of the conductive pattern; and a magnetic layer formed on the insulator film so as to cover an upper surface and a lateral surface of the conductive pattern.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: January 12, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju-Hwan Yang, Sang-Moon Lee, Jeong-Min Cho, Young-Do Kweon, Won-Chul Sim
  • Publication number: 20150325363
    Abstract: A common mode filter and a manufacturing method thereof are disclosed. A common mode filter in accordance with an aspect of the present invention includes: a substrate: a filter layer disposed on the substrate and configured to remove a signal noise; an electrode column formed to be bent along a perimetric portion of the filter layer and electrically connected with the filter layer; an electrode pad formed to have a larger longitudinal cross-sectional area than the electrode column and integrally coupled on the electrode column; and a magnetic layer formed on a layer on which the electrode column and the electrode pad are formed.
    Type: Application
    Filed: February 5, 2015
    Publication date: November 12, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geon-Se CHANG, Jeong-Min CHO, Jin-Hyuck YANG
  • Publication number: 20150318104
    Abstract: Disclosed herein is a common mode filter including: at least four coil layers having a primary coil and a secondary coil; and discontinuous parts each connecting starting points of each of the primary coil and the secondary coil positioned on the lowest layer among the coil layer to ending points of each of the primary coil and the secondary coil positioned on the highest layer among the coil layers with each other in series. The common mode filter is able to be miniaturized and to improve impedance characteristics.
    Type: Application
    Filed: April 30, 2015
    Publication date: November 5, 2015
    Inventors: Geon Se CHANG, Won Chul SIM, Jeong Min CHO
  • Publication number: 20150303893
    Abstract: The present invention discloses a common mode filter and a method for manufacturing the common mode filter. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a first coil electrode formed on the magnetic substrate; a first lead electrode formed on the magnetic substrate; a first dielectric layer formed on the magnetic substrate; a height compensation electrode formed on the upper surface of the first lead electrode; a second coil electrode formed on the first dielectric layer; a second lead electrode formed on the first dielectric layer; a second dielectric layer formed on the first dielectric layer; and an external electrode formed on the second dielectric layer.
    Type: Application
    Filed: August 4, 2014
    Publication date: October 22, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Geon-Se CHANG, Jin-Hyuck Yang, Jeong-Min Cho
  • Publication number: 20150251700
    Abstract: An under-floor frame system is disclosed. In particular, a main frame made of carbon fiber composite materials forms a closed quadrangle. A center cross member made of carbon fiber composite materials runs along a width direction of a vehicle and connects middles of the both side members. Also, a front cross member and a rear cross member made of carbon fiber composite materials runs along a width direction of a vehicle and connects a front side member portion and a rear side member portion at both sides of the main frame, respectively. A center tunnel member made of carbon fiber composite materials and is extended in a width direction of a vehicle to traverse an upper space of the center cross member and connects the front cross member and the rear cross member.
    Type: Application
    Filed: October 21, 2014
    Publication date: September 10, 2015
    Inventors: Chi Hoon Choi, Young Ho Choi, Gi Hwan Kim, Jeong Min Cho, Hermann Hansen, Rolf Verhoeven, Pawel Kwasniak
  • Publication number: 20150166742
    Abstract: The present invention provides a carbon fiber reinforced polypropylene resin composition with improved molding property. In particular, provided is a carbon fiber reinforced polypropylene resin composition with significantly improved molding property, tensile strength, flexural strength and the like by adding a modified polypropylene grafted with maleic anhydride as a compatibilizer to a polypropylene resin to reinforce the carbon fiber.
    Type: Application
    Filed: September 8, 2014
    Publication date: June 18, 2015
    Inventors: Chi Hoon Choi, Young Ho Choi, Gi Hwan Kim, Jeong Min Cho, Eun Hwa Jang, Seong Min Cho, Chang Hyoo Choi
  • Publication number: 20150145618
    Abstract: A common mode filter in which at least one surface of all of external electrodes and ground electrodes are exposed to a first surface, at least one side of each of two of the external electrodes and at least one side of one of the ground electrodes contact a first side of the first surface, and at least one side of each of the external electrodes and the ground electrodes of which sides do not contact the first side contact a second side of the first surface, thereby making it possible to improve sticking strength and decrease a short-circuit phenomenon occurrence rate.
    Type: Application
    Filed: November 25, 2014
    Publication date: May 28, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Min CHO, Won Chul SIM, Hye Won BANG, Geon Se CHANG, Kwang Mo KIM
  • Publication number: 20150102884
    Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a dielectric layer laminated on the magnetic substrate; an external electrode formed on the dielectric layer in such a way that one surface thereof is exposed to an outside; a conductive pattern formed on a surface of the dielectric layer so as to be located on a same plane as the external electrode and having one end thereof connected with the external electrode; an insulator film formed on a surface of the conductive pattern; and a magnetic layer formed on the insulator film so as to cover an upper surface and a lateral surface of the conductive pattern.
    Type: Application
    Filed: November 26, 2013
    Publication date: April 16, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju-Hwan Yang, Sang-Moon Lee, Jeong-Min Cho, Young-Do Kweon, Won-Chul Sim
  • Publication number: 20140321010
    Abstract: The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with the present invention includes a base, a plurality of electrodes arranged on the base separated from each other, a function layer supplied on a separation space between the electrodes and a composite insulating layer on which inorganic particles are dispersed on a resin with covering the electrodes and the function layer on the base.
    Type: Application
    Filed: April 25, 2014
    Publication date: October 30, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Min CHO, Kyong Bok MIN, Jin Hyuck YANG, Young Seuck YOO, Hong Ryul LEE
  • Publication number: 20140320251
    Abstract: Disclosed herein is a thin film chip device, including: a substrate; a circuit layer disposed on the substrate and having coil patterns; and a functional layer formed on the circuit layer and having an embossed shape.
    Type: Application
    Filed: April 23, 2014
    Publication date: October 30, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Hyuck YANG, Young Seuck YOO, Jeong Min CHO, Ji Hoon PARK, Kyong Bok MIN, Young Do KWEON, Jong Yun LEE
  • Publication number: 20140285303
    Abstract: Disclosed herein are a thin film common mode filter and a method of manufacturing the same. The thin film common mode filter according to the exemplary embodiment of the present invention includes a magnetic substrate made of a magnetic ceramic material; and coil patterns formed on the magnetic substrate, wherein external electrodes connected with the coil patterns are sequentially stacked and insulating layers formed on and beneath the coil pattern are made of a composite of ferrite powder and thermosetting resin.
    Type: Application
    Filed: March 24, 2014
    Publication date: September 25, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Min CHO, Won Chul SIM, Ho Jin YUN, Ju Hwan YANG, Young Seuck YOO
  • Publication number: 20140218150
    Abstract: Disclosed herein is a common mode filter including: a body element including an insulating member enclosing a coil electrode pattern and a magnetic member disposed on one surface or both surfaces of the insulating member; and an insulating layer disposed on at least one side of the body element, thereby increasing an interlayer adhesion between the respective components configuring the common mode filter.
    Type: Application
    Filed: October 11, 2013
    Publication date: August 7, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Min CHO, Sung Kwon WI, Chan YOON, Ho Jin YUN, Young Seuck YOO
  • Publication number: 20140062615
    Abstract: Disclosed herein is a thin film type common mode filter including: a base substrate made of an insulating material; a first insulating layer formed on the base substrate; a coil-shaped internal electrode formed on the first insulating layer; a second insulating layer formed on the internal electrode; an external electrode terminal having a vertical section connected to a side surface of the internal electrode and a horizontal section extended from an upper end of the vertical section toward a horizontal direction to thereby form a parallel surface spaced apart from the internal electrode by a predetermined distance; and a ferrite resin layer formed between the horizontal section of the external electrode terminal and the internal electrode.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 6, 2014
    Inventors: YOUNG SEUCK YOO, KANG HEON HUR, YOUNG GHYU AHN, CHAN YOON, SUNG KWON WI, JEONG MIN CHO, GEON SE CHANG, YOUNG DO KWEON
  • Publication number: 20130300527
    Abstract: The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern.
    Type: Application
    Filed: March 13, 2013
    Publication date: November 14, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Suk KIM, Sung Kwon WI, Ju Hwan YANG, Won Chul SIM, Jeong Bok KWAK, Jeong Min CHO, Young Seuck YOO, Sang Moon LEE
  • Publication number: 20130133827
    Abstract: Disclosed is a method for manufacturing a joint of a metallic sheet and a polymer composite. In the method, a metallic sheet and a polymer composite are prepared. Oil components are removed from bonding surfaces of the metallic sheet and the composite using a solvent. An adhesive is applied to the bonding surfaces. The metallic sheet and the polymer composite are bonded to form the joint. The joint is heated while fixing the joint to primarily cure the adhesive by about 60% to about 80% at a predetermined temperature. The joint is heated to secondarily cure the adhesive fully at a higher second temperature than the predetermined first temperature.
    Type: Application
    Filed: February 7, 2012
    Publication date: May 30, 2013
    Applicant: HYUNDAI MOTOR COMPANY
    Inventor: Jeong Min Cho
  • Publication number: 20130129409
    Abstract: Disclosed is a device and method for joining a composite and a metallic material which can stably join a composite and a metallic plate while improving the joint strength thereof. The device includes a fastening end formed at the center of the end face of the first joint end of the composite to protrude integrally, and a fastening slot formed at the center of the end face of the second joint end of the metallic material. The fastening end of the composite is fitted and fastened in the fastening slot of the metallic material, a female screw is inserted along the thickness direction through the fitted and fastened part between the fastening end and the fastening slot, and a male screw is fitted in and fastened to the female screw.
    Type: Application
    Filed: February 6, 2012
    Publication date: May 23, 2013
    Applicant: HYUNDAI MOTOR COMPANY
    Inventors: Jeong Min Cho, Young Ho Choi
  • Publication number: 20130130028
    Abstract: Disclosed is a method for preparing a precursor fiber for a carbon fiber. The precursor fiber of fine denier according to the present invention is used to prepare a carbon fiber having excellent tensile strength and compressive strength by a conventional single component spinneret using a superdrawing process to prepare a high strength and high elastic carbon fiber with a reduction in stabilization time.
    Type: Application
    Filed: February 14, 2012
    Publication date: May 23, 2013
    Applicant: HYUNDAI MOTOR COMPANY
    Inventors: Young-Ho Choi, Jeong Min Cho, Do Suck Han, Chi-Hoon Choi
  • Publication number: 20130071718
    Abstract: Disposed is a heat dissipation plate, which is an interface plate interposed between a plurality of battery cells, can respond to changes in volume of the battery cells, and can effectively dissipate heat accumulated in the battery cells, and a battery module having the same. To this end, the heat dissipation plate includes a porous metal foam plate formed by foaming and having a plate shape. A sheet plate is stacked on both sides of the metal foam plate. When the battery cells expand, the metal foam plate is compressed by the expansion of the battery cells, thereby responding to changes in volume of the battery cells and improving heat dissipation performance by air cooling due to increased specific surface area.
    Type: Application
    Filed: December 7, 2011
    Publication date: March 21, 2013
    Applicant: Hyundai Motor Company
    Inventors: Jeong Min CHO, Gun Goo LEE, Na Ry SHIN, Jin Woo KWAK