Abstract: An apparatus for forming a thin film pattern according to an aspect of the invention may include: an unwinding roll and a winding roll running a sheet; a rotary drum having an elastic layer provided on a circumferential surface thereof, and disposed between the winding roll and the unwinding roll to run the sheet along the circumferential surface; a source containing unit accommodating a deposition source and mounted such that the deposition source is evaporated and the evaporated deposition source moves toward the sheet located on the rotary drum; a shutter selectively preventing the movement of the deposition source toward the rotary drum from the source containing unit; a mask having a pattern defining a pattern of a thin film to be deposited onto the sheet and making tight contact with the sheet located on the rotary drum during thin-film deposition; and a tensioning unit pressurizing the sheet in a direction of the rotary drum to allow the sheet to run after the thin-film deposition and separating the sh

Abstract: A conductive metal paste composition including conductive metal particles including first metal particles having a particle size of less than 100 nm, and second metal particle of particle size greater than 100 nm, and a surface coated with a capping material; a binder; and a solvent, a method of manufacturing the same, and an electrode and a conductive circuit of an electronic device using the same. The paste composition containing two or more kinds of conductive metal particles with different particle sizes can secure high conductivity compared to a conventional metal pastes during low temperature or short-time medium and high temperature sintering.

Abstract: There are disclosed a nanocomposite powder for an inner electrode of a multilayer ceramic electronic device and a manufacturing method thereof. The nanocomposite powder for an inner electrode of a multilayer ceramic electronic device includes a first metal particle having electrical conductivity, and a second metal coating layer formed on a top surface or a bottom surface of the first metal particle and having a higher melting point than that of the first metal particle.

Abstract: Provided are a flexible printed circuit board (PCB), which can contribute to the reduction of damage to wiring layers and wiring defects regardless of a decrease in the width of wiring layers and can thus contribute to the miniaturization of various products, a method of fabricating the flexible PCB, and a display device having the flexible PCB. The flexible PCB includes a base film, one or more first pad patterns formed on the base film, one or more second pad patterns formed on the base film and connected to the one or more first pad patterns, a cover film formed on the one or more first pad patterns and the base film and exposing the one or more second patterns, and a plurality of expanded portions corresponding to the boundaries between the one or more first pad patterns and the one or more second pad patterns and having a greater width than the one or more first pad patterns and the one or more second pad patterns.

Abstract: There are disclosed a method of manufacturing fine metal powder and fine metal powder manufactured by using the same. The method of manufacturing fine metal powder includes forming a pattern having a predetermined size and shape on a base substrate, forming a metal film on the pattern, and separating the metal film from the pattern to obtain individual metal particles having a predetermined size and shape. The fine metal powder manufactured by the method has a uniform shape and a uniform particle size distribution. The fine metal powder is in the form of flakes, having a large ratio of particle diameter to thickness.

Abstract: There are provided an apparatus and method for manufacturing a board for the production of a metal flake. The apparatus includes: a base board supplying part; a patterning part forming a pattern layer on a base board supplied from the base board supplying part; a coating part forming a sacrificial layer on the base board having the pattern layer formed thereon, the sacrificial layer being decomposable by a solvent; and a base board recovering part recovering the base board having the sacrificial layer formed thereon.

Abstract: Disclosed are a method of manufacturing ultra fine metal powder used for an electrode for an MLCC and ultra fine metal powder manufactured by the same. The method of manufacturing ultra fine metal powder includes: preparing a master mold in which a pattern is formed; forming a sacrificial layer by applying a polymer material on the pattern; forming a metal layer on the sacrificial layer; and forming individual ultra fine metal powder by removing the sacrificial layer and separating the metal layer from the master mold.

Abstract: An apparatus for forming a thin film pattern according to an aspect of the invention may include: an unwinding roll and a winding roll running a sheet; a rotary drum having an elastic layer provided on a circumferential surface thereof, and disposed between the winding roll and the unwinding roll to run the sheet along the circumferential surface; a source containing unit accommodating a deposition source and mounted such that the deposition source is evaporated and the evaporated deposition source moves toward the sheet located on the rotary drum; a shutter selectively preventing the movement of the deposition source toward the rotary drum from the source containing unit; a mask having a pattern defining a pattern of a thin film to be deposited onto the sheet and making tight contact with the sheet located on the rotary drum during thin-film deposition; and a tensioning unit pressurizing the sheet in a direction of the rotary drum to allow the sheet to run after the thin-film deposition and separating the sh

Abstract: An apparatus for forming a thin film pattern according to an aspect of the invention may include: a vacuum chamber including a mask loading part and a film forming part having a window openable or closable with respect to the mask loading part; an unwinding roll and a winding roll disposed in the film forming part and running a sheet; a source containing unit accommodating a deposition source and mounted such that the deposition source is evaporated to deposit a thin film on the sheet located on the evaporation area; at least one mask having a pattern defining a pattern of the thin film to be deposited on the sheet, and arranged in the mask loading part; a mask moving unit moving the at least one mask arranged in the mask loading part toward a deposition position of the film forming part or moving the mask in a reverse direction; and a shutter unit selectively preventing a movement of the deposition source evaporated toward the mask from the source containing unit.

Abstract: Provided are a flexible printed circuit board (PCB), which can contribute to the reduction of damage to wiring layers and wiring defects regardless of a decrease in the width of wiring layers and can thus contribute to the miniaturization of various products, a method of fabricating the flexible PCB, and a display device having the flexible PCB. The flexible PCB includes a base film, one or more first pad patterns formed on the base film, one or more second pad patterns formed on the base film and connected to the one or more first pad patterns, a cover film formed on the one or more first pad patterns and the base film and exposing the one or more second patterns, and a plurality of expanded portions corresponding to the boundaries between the one or more first pad patterns and the one or more second pad patterns and having a greater width than the one or more first pad patterns and the one or more second pad patterns.

Abstract: A vacuum deposition apparatus and a control method thereof can form very precise internal electrode patterns at a very high rate in a roll-to-roll manufacturing process, which is used for mass production of chip components such as a Multi-Layer Ceramic Capacitor (MLCC).

Abstract: The present invention relates to a green sheet for multi-layered electronics parts and a manufacturing method of a green chip using the same. The present invention provides a green sheet for multi-layered electronics parts including a green sheet; and an internal electrode formed on the green sheet and having a gap formed therein. Further, the present invention provides the manufacturing method of the green chip using the green sheet for the multi-layered electronics parts.

Abstract: Provided is a shadow mask including a substrate; a mask that is formed to have an opening for transferring a thin film onto the substrate in a desired shape; and a delamination-preventing polymer layer formed on the mask.

Abstract: A display device and manufacturing method thereof suitable for providing a slim and lightweight display device with a low manufacturing cost includes a display panel having first and second substrates opposing each other, a first sensor electrode on the first substrate, a third substrate spaced apart from the first substrate, a second sensor electrode on a backside of a third substrate to come into contact with the first sensor electrode upon a user's touch, a contact electrode on each of the second and third substrates, and a short-circuit point between the contact electrodes on the second and third substrates to connect together the contact electrodes.