Abstract: A photoresist composition includes 5% to 50% by weight of an alkali-soluble resin, 0.5% to 30% by weight of a quinone diazide compound, 0.1% to 15 % by weight of a curing agent, and a remainder of an organic solvent. A method of forming a metal pattern includes coating a photoresist composition on a base substrate having a metal layer, and forming a first photoresist film. The photoresist composition includes 5% to 50% by weight of an alkali-soluble resin, 0.5% to 30% by weight of a quinone diazide compound, 0.1% to 15% by weight of a curing agent, and a remainder of an organic solvent. The first photoresist film is patterned, and forms a first photo pattern. The base substrate having the first photo pattern is heated, and forms a first baked pattern. The metal layer is patterned using the first baked pattern, and forms a metal pattern.

Abstract: In one example, a photoresist composition includes about 1 to about 70 parts by weight of a first binder resin including a repeat unit represented by the following Chemical Formula 1, about 1 to about 70 parts by weight of a second binder resin including a repeat unit represented by the following Chemical Formula 2, about 0.5 to about 10 parts by weight of a photo-acid generator, about 1 to about 20 parts by weight of a cross-linker and about 10 to about 200 parts by weight of a solvent. The photoresist composition may improve the heat resistance and adhesion ability of a photoresist pattern. wherein R1 and R2 independently represent an alkyl group having 1 to 5 carbon atoms, and n and m independently represent a natural number.

Abstract: A thin film transistor substrate includes; a substrate, an organic layer disposed on the substrate and including a trench formed by etching a predetermined region of an upper portion of the organic layer, a gate electrode disposed in the trench, an insulating layer disposed on the organic layer and the gate electrode, a semiconductor layer disposed on the insulating layer, a source electrode disposed on the semiconductor layer, and a drain electrode disposed on the semiconductor layer and spaced apart from the source electrode.

Abstract: A method of forming an interconnection line and a method of manufacturing a thin film transistor substrate are provided in accordance with one or more embodiments of the present invention. The method of forming an interconnection line in accordance with one or more embodiments of the present invention includes preparing a substrate, forming a lower organic layer and an upper organic layer on the substrate in lamination, forming trenches in parts of the upper organic layer and the lower organic layer, forming a lower interconnection layer in the trenches formed in parts of the lower organic layer, removing the upper organic layer, and filling the trenches formed in parts of the lower organic layer with an upper interconnection layer.

Abstract: A photoresist resin composition, a method for forming a pattern and a method for manufacturing a display panel using the photoresist resin composition are disclosed. The photoresist resin composition includes an alkali soluble resin, a photoresist compound, and a solvent, wherein the alkali soluble resin includes a first polymer resin represented by the following Chemical Formula 1, wherein, of R1, R2, R3, R4, R5 and R6, at least one is a hydroxyl group, at least two are methyl groups and any remaining groups are hydrogen, and of R7, R8, R9, R10 and R11, at least one is a hydroxyl group, at least two are methyl groups and any remaining groups are hydrogen.

Abstract: A photoresist composition includes about 10 to about 70% by weight of a binder resin including a phenol-based polymer, about 0.5 to about 10% by weight of a photo-acid generator, about 1 to about 20% by weight of a cross-linker, about 0.1 to about 5% by weight of a dye and about 10 to about 80% by weight of a solvent. The photoresist composition may be applied to, for example, a method of manufacturing a TFT substrate.

Abstract: A photoresist composition includes; a novolac resin prepared from a phenol compound, wherein the m-cresol constitutes about 70% to about 85% by weight of the weight of the phenol compound, a diazide compound, and an organic solvent.

Abstract: A method of planarizing a substrate. An organic layer is formed on a base substrate to cover a metal line formed on the base substrate. A portion of the organic layer is removed to form a pre-planarization layer exposing the metal layer, so that a surface of the base substrate having the metal line is planarized. The pre-planarization layer is cured to flow toward a side surface of the metal line to form a planarization layer making contact with the side surface of the metal line. Therefore, a stepped portion between the base substrate and the metal line can be minimized or substantially eliminated, thereby increasing the surface uniformity of a subsequent layer, thereby improving the reliability of the manufacturing process.

Abstract: A printed circuit board has an opening, and a multi-layer ceramic capacitor is disposed inside the opening and is coupled to the printed circuit board. The multi layer ceramic capacitor is coupled to the printed circuit board in a manner that a center of gravity of the multi-layer ceramic capacitor is at substantially the same level as a center of gravity of the printed circuit board.

Abstract: A photoresist composition includes a novolac resin having where each of R1, R2, R3, and R4 is an alkyl group having a hydrogen atom or between one through six carbon atoms and n is an integer ranging from zero through three; and a mercapto compound having Z1-SH, or SH-Z2-SH, where each of Z1 and Z2 is an alkyl group or an alkyl group having one through twenty carbon atoms, a sensitizer, and a solvent.

Abstract: Disclosed is a liquid crystal display including a liquid crystal panel that includes a plurality of liquid crystal cells for controlling light transmission, a common electrode driving circuit for providing a common voltage signal to a common electrode provided in the liquid crystal panel and a first signal driving circuit for providing a first signal to a transparent electrode provided in the liquid crystal panel. The first signal and the common voltage signal have the same frequency and amplitude, but are out of phase with each other. The transparent electrode is designed to cancel an acoustic noise generated by the application of the common voltage signal. The liquid crystal panel includes two substrates that face each other. In one embodiment, the common electrode and the transparent electrode are formed in the same substrate, and in another embodiment, the common electrode and the transparent electrode are formed in different substrates.

Abstract: A thin film transistor array panel for a flat panel display includes a substrate, a first signal line formed on the substrate, a second signal line intersecting and insulated from the first signal line, a switching element having a first terminal connected to the first signal line, a second terminal connected to the second signal line, and a third terminal, a pixel electrode connected to the third terminal of the switching element, and first and second light blocking members extending parallel to the second signal line, each being disposed on an opposite side of and partially overlapping an respective edge of the second signal line, an interval between the first and second light blocking members being in a range of from more than 1.5 ?m to less than 4 ?m. The array panel prevents light leakage from the display and improves its transmittance, aperture ratio and color reproducibility.

Abstract: A photoresist composition comprises about 0.5 to about 20 parts by weight of a photo-acid generator, about 10 to about 70 parts by weight of a novolac resin containing a hydroxyl group, about 1 to about 40 parts by weight of a cross-linker that comprises an alkoxymethylmelamine compound, and about 10 to about 150 parts by weight of a solvent.

Abstract: In one example, a photoresist composition includes about 1 to about 70 parts by weight of a first binder resin including a repeat unit represented by the following Chemical Formula 1, about 1 to about 70 parts by weight of a second binder resin including a repeat unit represented by the following Chemical Formula 2, about 0.5 to about 10 parts by weight of a photo-acid generator, about 1 to about 20 parts by weight of a cross-linker and about 10 to about 200 parts by weight of a solvent. The photoresist composition may improve the heat resistance and adhesion ability of a photoresist pattern. wherein R1 and R2 independently represent an alkyl group having 1 to 5 carbon atoms, and n and m independently represent a natural number.

Abstract: A photo mask is provided. The mask includes: a transmitting area and a translucent area, wherein the translucent area includes a plurality of light blocking portions blocking light, and wherein the light blocking portions have a plurality of areas blocking different amounts of light. By using this type of photo mask, a substantially flat layer of photoresist film can be deposited even on top of an uneven surface. The flat photoresist film reduces processing cost and enhances the reliability of the panel manufacturing process.

Abstract: A display substrate includes a first metal pattern, a first insulating layer, a first electrode, and a second metal pattern. The first metal pattern includes a gate line and a signal line. The first insulating layer is disposed on a substrate having the first metal pattern formed thereon. A first opening passes through the first insulating layer to partially expose the signal line. The first electrode is disposed on the first insulating layer corresponding to a unit pixel. The second metal pattern includes a connection electrode contacting the first electrode and the signal line through the first opening and a data line.

Abstract: A method for manufacturing a thin film transistor array panel using a photo mask is provided. The photo mask includes: a transmitting area and a translucent area, wherein the translucent area includes a plurality of light blocking portions blocking light, and wherein the light blocking portions have a plurality of areas blocking different amounts of light. By using this type of photo mask, a substantially flat layer of photoresist film can be deposited even on top of an uneven surface to manufacture a thin film transistor array panel. The flat photoresist film reduces processing cost and enhances the reliability of the panel manufacturing process.

Abstract: A method of manufacturing a thin film transistor array panel, including: forming gate lines on a substrate; forming a gate insulating layer on the gate lines; forming semiconductor layers on the gate insulating layer; forming data lines and drain electrodes on the semiconductor layers; depositing a passivation layer on the data lines and the drain electrodes; forming a first photoresist layer including a first portion and a second portion that is thinner than the first portion on the passivation layer; forming a first preliminary contact hole exposing the data lines by etching the passivation layer by using the first photoresist layer as a mask; removing the second portion of the first photoresist; forming a first contact hole by expanding the first preliminary contact hole and opening portions by etching the passivation layer by using the first portion of the first photoresist layer as a mask; depositing a conductor layer; and forming pixel electrodes in the opening portions and a first contact assistant mem

Abstract: A display panel includes a substrate, signal lines, a thin film transistor, a pixel electrode and a dummy opening. The substrate has a display area and a peripheral area surrounding the display area. The signal lines are disposed on the substrate and intersect each other to define a unit pixel. The thin film transistor is electrically connected to the signal lines and disposed at the unit pixel. The pixel electrode is electrically connected to the thin film transistor. The pixel electrode is formed in the unit pixel. The dummy opening is disposed at the peripheral area and spaced apart from the signal lines.

Abstract: A photoresist composition includes about 100 parts by weight of resin mixture including novolak resin and acryl resin and about 10 parts to about 50 parts by weight of naphthoquinone diazosulfonic acid ester. A weight-average molecular weight of the novolak resin is no less than about 30,000. A weight-average molecular weight of the acryl resin is no less than about 20,000. A content of the acryl resin is about 1% to about 15% by weight based on a total weight of the resin mixture. When a photoresist film formed using the photoresist composition is heated, a profile variation of the photoresist composition is relatively small. Therefore, a residual photoresist film has a uniform thickness, and a short circuit and/or an open defect in a TFT substrate may be reduced.