Abstract: The present invention relates to a novel method of producing 3-hydroxypropionic acid from glycerol, and more particularly to a method of producing 3-hydroxypropionic acid by culturing in a glycerol-containing medium a mutant microorganism obtained by amplifying an aldehyde dehydrogenase-encoding gene in a microorganism having the abilities to produce coenzyme B12 and produce 3-hydroxypropionic acid using glycerol as a carbon source. The present invention enables the fermentation of glycerol even under microaerobic or aerobic conditions without having to add coenzyme B12. Thus, the invention will be very suitable for the development of biological processes for producing large amounts of 3-hydroxypropionic acid.

Abstract: Provided is a method of producing 1,3-propanediol by culturing a recombinant strain in which the glycerol oxidative pathway had been blocked, and more particularly a method of producing 1,3-propanediol by two-step culture of a recombinant strain in which the oxidative pathway that produces byproducts in the glycerol metabolic pathway had been blocked. When the recombinant strain in which the glycerol oxidative pathway that produces byproducts had been blocked is cultured in two steps, 1,3-propanediol can be produced with improved yield without producing products that result in an increase in purification costs.

Abstract: A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chip, which is mounted on the substrate and electrically connected with the substrate by bonding means, a heat slug which is adhered to the semiconductor chip and formed of a thermally conductive material, and a heat spreader partially exposed to the outside of the semiconductor package, and which is formed on the heat slug to be spaced a buffer gap apart from the heat slug.

Abstract: A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chip, which is mounted on the substrate and electrically connected with the substrate by bonding means, a heat slug which is adhered to the semiconductor chip and formed of a thermally conductive material, and a heat spreader partially exposed to the outside of the semiconductor package, and which is formed on the heat slug to be spaced a buffer gap apart from the heat slug.

Abstract: A ball grid array package utilizing a layer of an elastic insulating material to protect conductive ball lands from deformation during subsequent processing and use of the resulting device and a method of manufacturing the same are disclosed. The elastic insulating layer preferably has a modulus of elasticity no greater than about 20 MPa or less to absorb and or distribute mechanical stress applied to conductive ball lands directly or through solder ball joints or other structures and thereby improve the solder joint reliability (SJR) of the resulting device.

Abstract: A semiconductor package in which heat is easily dissipated and a semiconductor chip is not damaged during a molding process, and a method of manufacturing the same. The semiconductor package with a heat dissipating structure includes a substrate, a semiconductor chip, which is mounted on the substrate and electrically connected with the substrate by bonding means, a heat slug which is adhered to the semiconductor chip and formed of a thermally conductive material, and a heat spreader partially exposed to the outside of the semiconductor package, and which is formed on the heat slug to be spaced a buffer gap apart from the heat slug.

Abstract: A ball grid array package utilizing a layer of an elastic insulating material to protect conductive ball lands from deformation during subsequent processing and use of the resulting device and a method of manufacturing the same are disclosed. The elastic insulating layer preferably has a modulus of elasticity no greater than about 20 MPa or less to absorb and or distribute mechanical stress applied to conductive ball lands directly or through solder ball joints or other structures and thereby improve the solder joint reliability (SJR) of the resulting device.

Abstract: A portable battery charger having at least one charging pocket for recharging a battery pack mounted on a mobile station or a separate battery pack, comprising a charger housing including a pair of inside walls facing each other, a ceiling connecting the inside walls, at least one opening side, a mounting space enclosed by the inside walls and the ceiling, and a printed circuit board providing at least one pair of electrical contacts; a charging unit having front and rear surfaces, a pair of side surfaces, and at least one top surface detachably mounted in the mounting housing for independently recharging the mobile station while traveling; a guide structure for horizontally or vertically mounting the charging unit in the charger housing; and an electrical connection device for electrically connecting the charging unit with the charger housing.

Abstract: A lead-on-chip semiconductor device package is formed by attaching a lead frame to the chip with a discontinuous adhesive layer. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive material having a certain viscosity. Although the liquid adhesive is continuously applied to top surfaces of the inner leads as well as gaps between adjacent inner leads, the adhesive layer is formed only on the top surfaces of the inner leads while the liquid adhesive falls through the gaps. Thermoplastic or thermosetting resins may be used as the liquid adhesive.

Abstract: A multichip package device includes a lead frame having supporting portions and lead portions for electrically connecting the multichip package with an external electronic device. The multichip package is formed by depositing first and second inner insulation layers on lower and upper surfaces of the lead frame, respectively. Via holes are then formed through the first and the second inner insulation layers. First and second metallization layers are deposited and patterned on lower and upper surfaces of the first and the second inner insulation layers, respectively. First and second outer insulation layers are then deposited on lower and upper surfaces of the first and the second patterned metallization layers, respectively. A plurality of chips, each having an active surface on which a plurality of bonding pads are formed, are attached to lower and upper surfaces of the first and second outer insulation layers.

Abstract: A lead-on-chip package manufacturing method includes an insulating liquid adhesive depositing step on lead attaching regions formed on an active surface of a semiconductor on a wafer. The adhesive deposition may be accomplished by a screen printing method in which the adhesive is forced through hole patterns of a metal screen, or by a dispensing method in which a liquid adhesive is dispensed from needles of a dispensing head that is movable over the wafer surface and is aligned with the wafer. The dispensing technique may be applied to a plurality of chips in step-by-step fashion, or in a simultaneous manner by using a multi-needled dispensing head.

Abstract: A method for manufacturing a semiconductor package, including providing a lead frame in which die pad and side rail areas of the lead frame are mechanically interconnected to, and electrically isolated from each other so that the exposed bottom surface of the die pad does not become coated with a metal plating film during surface treatment for coating outer leads of the lead frame.