Abstract: A method of manufacturing a light emitting diode (LED) includes forming a first material layer on a substrate, forming a second material layer on the first material layer, forming a photomask pattern on the second material layer, performing a first etching on the second material layer and a portion of the first material layer by using the photomask pattern as an etch mask, removing the photomask pattern, and forming a plurality of isolated structures by performing a second etching on the remaining portion of the first material layer until a top surface of the substrate is exposed.

Abstract: A semiconductor light emitting device includes a substrate formed of a first material; and a convex portion protruding from the substrate and including: a first layer formed of the first material as that of the substrate; and a second layer formed of a second material different from the first material and disposed on the first layer. A second height of the second layer is greater than a first height of the first layer.

Abstract: Disclosed are a packet output controlling method and a network device using the same. A packet output controlling method according to the present invention, as a method for processing flow in a plurality (N, where N is a natural number of 2 or greater) of flow tables connected by a pipeline, may comprise the steps of: passing a packet input into a flow from a first table to an N?1st table from among a plurality of tables; processing an output-dedicated Nth table (egress table) guided by the N?1st table with respect to the packet after the packet passes the N?1st table; and outputting the packet after processing the Nth table. Accordingly, the flexible control of a final output is made possible through various operations using output port information.

Abstract: In a refrigerator door in which a decoration member is mounted to a door frame using a foam material, the foam material fills a space formed between the decoration member mounted to a front side of the door frame and a rear panel mounted to a rear side of the door frame. Accordingly, the decoration member can be fixed to the door frame through direct contact with the foam material.

Abstract: A method and device for processing an address resolution protocol (ARP) in a software-defined networking (SDN) environment is disclosed. The method includes receiving, by a first network device, an ARP request packet from a first terminal so that the first terminal communicates with a second terminal and transmitting, by the first network device, an ARP response message including MAC address information of the second terminal to the first terminal as a response to the ARP request packet. Accordingly, a load of the controller can be reduced by sharing and processing an ARP proxy function with the network device in the SDN environment.

Abstract: There is provided a susceptor. The susceptor includes: a body having a first surface, a second surface opposite the first surface, and an outer side surface connecting the first surface and the second surface; at least one pocket recessed from the first surface to accommodate at least one wafer therein, respectively; at least one tunnel respectively located below the pocket and extending from a center of the body to the outer side surface; at least one connecting channel each of which connects each of the pocket to each of the tunnel; and a supply line connected to the tunnel at the center of the body and supplying a gas from an outside in order for the gas to flow from the center of the body to the outer side surface.

Abstract: Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.

Abstract: A method of forming a semiconductor layer is provided. The method includes forming a plurality of nanorods on a substrate and forming a lower semiconductor layer on the substrate so as to expose at least portions of the nanorods. The nanorods are removed so as to form voids in the lower semiconductor layer, and an upper semiconductor layer is formed on an upper portion of the lower semiconductor layer and the voids.

Abstract: Disclosed are methods for managing transactions in a software defined network (SDN). A method performed in a controller may comprise generating a group message for modifying flow entries of a plurality of flow tables related to each other in a switch; and transmitting the group message to the switch. Thus, a plurality of flow tables having relevance to each other can be simultaneously modified so that modifications on a plurality of switches can be synchronized, and consistency of them can be guaranteed.

Abstract: Disclosed is a method for changing a role over control authorization performed in a communication apparatus. The method may comprise receiving, from a second controller, a role-request message requesting a role change of the second controller to a master controller; transmitting a role status request message for confirmation of the role change of the second controller to a first controller which is a previous master controller; and determining whether to accept the role change of the second controller according to a role status response message received from the first controller. Therefore, reliability may be guaranteed when a role of master controller is changed.

Abstract: Provided is a semiconductor light emitting diode having a textured structure formed on a substrate. In a method of manufacturing the semiconductor light emitting diode, a metal layer is formed on the substrate, and a metal oxide layer having holes is formed by anodizing the metal layer. The metal oxide layer itself can be used as a textured structure pattern, or the textured structure pattern can be formed by forming holes in the substrate or a material layer under the metal oxide layer corresponding to the holes of the metal oxide layer. The manufacture of the semiconductor light emitting diode is completed by sequentially forming a first semiconductor layer, an active layer, and a second semiconductor layer on the textured structure pattern.

Abstract: The present invention relates to microbial variants producing homo-succinic acid at high yields and a method for producing homo-succinic acid using the same, more particularly, to a microbial variant constructed by disrupting a lactate dehydro-genase-encoding gene (idhA) and an acetate kinase-encoding gene (ackA), as well as a method for producing homo-succinic acid at high concentration, which comprises culturing such variants using glucose as a carbon source in anaerobic conditions.

Abstract: A refrigerator includes a main body provided with storage chambers having doors, one of the doors being provided with an opening, the opening having at least one stepped plane; a rack installed in the storage chamber at a height corresponding to that of the lower end of the opening; a sub door to open and close the opening; and a connection member to prevent a height difference between a rear surface of the sub door and the opening. The connection member is configured to slide relative to the sub door to cover the at least one stepped plane, whereby the connection member closes the at least one stepped plane when the sub door is closed, and opens the at least one stepped plane when the sub door is opened so that the rear surface of the sub door and the connection member form substantially a level plane with the rack.

Abstract: An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.

Abstract: A method of manufacturing a semiconductor light emitting device, includes sequentially growing a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate to form a light emitting layer. The forming of the light emitting layer includes a first growth process, a second growth process and a transfer process. The first growth process uses a first susceptor having a mounting surface with a first curvature. The second growth process uses a second susceptor having a mounting surface with a second curvature different from the first curvature. The transfer process transfers the substrate from the first susceptor to the second susceptor between the first and second growth processes.

Abstract: An illumination apparatus includes a light source unit comprising at least one light source module comprising a plurality of light-emitting device chips and a lead frame on which the light-emitting device chips are mounted and which connects the mounted light-emitting device chips; a diffusion cover having an interior space in which the light source module is accommodated and diffusing light emitted from the light source module; and an installation portion formed adjacent to the diffusion cover to install the light source module.

Abstract: The disclosure is related to providing an online bartering service. The online bartering service may include registering a trading coupon of first user equipment in response to a registration request from the first user equipment, providing information on a list of candidate coupons to the first user equipment based on information on the trading coupon of the first user equipment, receiving a trading offer message with information on a selected candidate coupon from the first user equipment and transmitting the trading offer message to second user equipment having the selected candidate coupon, and automatically processing a difference between the trading coupon and the selected candidate coupon in connection with associated virtual accounts upon receiving a trading acceptance message from the second user equipment.

Abstract: A method of manufacturing a semiconductor light emitting device, includes: forming a plurality of concave portions on a substrate; injecting silica particles into the plurality of concave portions; and forming a semiconductor layer on the substrate, the semiconductor layer including voids formed in portions of the semiconductor layer, the portions being located above the plurality of concave portions.

Abstract: The present invention relates to a light emitting apparatus. According to one aspect of the present invention, the light emitting device comprises: a plurality of light emitting devices including a blue light emitting device emitting blue light and a UV light emitting device emitting ultraviolet light; and a wavelength conversion part arranged in the path of the light emitted from the plurality of light emitting devices, and provided with fluorescent substances to convert the wavelengths of the light emitted from the plurality of light emitting devices, wherein a fluorescent substance excited by and mixed with the blue light to obtain white light is arranged on a first area corresponding to the blue light emitting device, and at least a blue fluorescent substance is arranged on a second area corresponding to the UV light emitting device.

Abstract: A method of forming a semiconductor layer is provided. The method includes forming a plurality of nanorods on a substrate and forming a lower semiconductor layer on the substrate so as to expose at least portions of the nanorods. The nanorods are removed so as to form voids in the lower semiconductor layer, and an upper semiconductor layer is formed on an upper portion of the lower semiconductor layer and the voids.