Patents by Inventor Jeonghoon Oh

Jeonghoon Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210011610
    Abstract: A method of executing an application in a touch device is provided. The method includes displaying an execution screen of a first application as a full screen, receiving an input of an execution event for executing a second application, configuring a multi-window in a split scheme when the execution event is released on a specific window, and independently displaying screens of the first application and the second application through respective split windows.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 14, 2021
    Inventors: Daesik HWANG, Hyesoon JEONG, Jeonghoon KIM, Dongjun LEE, Jonghwa OH
  • Publication number: 20200398399
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 24, 2020
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Patent number: 10832931
    Abstract: An electrostatic chuck for retaining a substrate is provided herein. In some embodiments, an electrostatic chuck for retaining a substrate may include a susceptor including an electrically conductive susceptor base having one or more cooling channels formed in an upper surface thereof; a raised central support disposed over the one or more cooling channels; and a dielectric top plate disposed on the raised central support, wherein the dielectric top plate has an embossed top surface, and wherein the dielectric top plate and raised central support include a plurality of holes to facilitate delivery of a cooling gas one or more cooling channels to a backside of the substrate when disposed on the embossed top surface of the dielectric top plate.
    Type: Grant
    Filed: April 27, 2015
    Date of Patent: November 10, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chethan Mangalore, Arumuga Balan, Jeonghoon Oh
  • Publication number: 20200294778
    Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.
    Type: Application
    Filed: June 2, 2020
    Publication date: September 17, 2020
    Inventors: Brian T. WEST, Michael S. COX, Jeonghoon OH
  • Publication number: 20200282506
    Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.
    Type: Application
    Filed: May 22, 2020
    Publication date: September 10, 2020
    Inventors: Eric LAU, Chih Chung CHOU, Charles C. GARRETSON, Jeonghoon OH, King Yi HEUNG
  • Patent number: 10766117
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: September 8, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20200246935
    Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module having a platen, and a platen temperature control system. The platen temperature control system includes a PID controller, a fluid controller, and a heat exchanger. The flow controller is configured to control an amount of fluid provided from the heat exchanger to a channels of the platen in response to instructions provided by the PID controller.
    Type: Application
    Filed: January 24, 2020
    Publication date: August 6, 2020
    Inventors: Jeonghoon OH, Jamie Stuart LEIGHTON, Van H. NGUYEN, Roger M. JOHNSON
  • Publication number: 20200223028
    Abstract: A flexible membrane for a carrier head of a chemical mechanical polisher includes a main portion, an annular outer portion, and three annular flaps. The main portion has a substrate mounting surface with a radius R. The annular outer portion extends upwardly from an outer edge of the main portion and has a lower edge connected to the main portion and an upper edge. The three annular flaps include a first annular flap joined to an inner surface of the main portion at a radial position between 75% and 95% of R, a second inwardly-extending annular flap joined to the annular outer portion at a position between the lower edge and the upper edge, and a third inwardly-extending annular flap joined to the upper edge of the annular outer portion.
    Type: Application
    Filed: January 13, 2020
    Publication date: July 16, 2020
    Inventors: Jeonghoon Oh, Jamie Leighton
  • Patent number: 10714321
    Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: July 14, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Brian T. West, Michael S. Cox, Jeonghoon Oh
  • Patent number: 10702971
    Abstract: A flexible membrane for use in a carrier head has a generally circular main portion with a lower surface, an annular outer portion for connection to a base assembly, and an annular flap extending from the main portion on a side opposite the lower surface for connection to the base assembly. At least one surface of the flap has a surface texture to prevent adhesion.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: July 7, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Tsz-Sin Siu, Hung Chih Chen, Andrew J. Nagengast, Steven M. Zuniga, Thomas B. Brezoczky
  • Publication number: 20200206866
    Abstract: A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially outward from the platen to support an outer polishing pad. The annular flange has an inner edge secured to and rotatable with the platen and vertically fixed relative to the top surface of the platen. The annular flange is vertically deflectable such that an outer edge of the annular flange is vertically moveable relative to the inner edge. An actuator applies pressure to an underside of the annular flange in an angularly limited region, and a carrier head holds a substrate in contact with the polishing pad and is movable to selectively position a portion of the substrate over the outer polishing pad.
    Type: Application
    Filed: December 16, 2019
    Publication date: July 2, 2020
    Inventors: Jay Gurusamy, Steven M. Zuniga, Jeonghoon Oh
  • Publication number: 20200114487
    Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.
    Type: Application
    Filed: December 6, 2019
    Publication date: April 16, 2020
    Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
  • Publication number: 20200114489
    Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.
    Type: Application
    Filed: December 9, 2019
    Publication date: April 16, 2020
    Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
  • Publication number: 20200109508
    Abstract: An electronic apparatus includes a main body including a nut portion; a plurality of level-adjustable foots placed at a lower side of the main body, configured to support the main body, adjustable in height to level the main body, and including a bolt portion inserted in and screw-coupled to the nut portion; and an elastic member configured to elastically press one of the bolt portion and the main body toward the main body or the level-adjustable foot to make a first thread of the bolt portion and a second thread of the nut portion corresponding to the first thread be in contact with each other.
    Type: Application
    Filed: October 3, 2019
    Publication date: April 9, 2020
    Applicant: Samsung Electronics Co., Ltd,
    Inventors: Minhwan OH, Jeonghoon KANG, Eunkyeong KWAK
  • Patent number: 10610994
    Abstract: A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: April 7, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Eric Lau, Hui Chen, King Yi Heung, Chih Chung Chou, Edwin C. Suarez, Garrett Ho Yee Sin, Charles C. Garretson, Jeonghoon Oh
  • Publication number: 20200086456
    Abstract: Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.
    Type: Application
    Filed: August 27, 2019
    Publication date: March 19, 2020
    Inventors: Dmitry SKLYAR, Jeonghoon OH, Gerald J. ALONZO, Jonathan DOMIN, Steven M. ZUNIGA, Jay GURUSAMY
  • Patent number: 10589399
    Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: March 17, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Edwin C. Suarez, Jason Garcheung Fung, Eric Lau, King Yi Heung, Ashwin Murugappan Chockalingam, Daniel Redfield, Charles C. Garretson, Thomas H. Osterheld
  • Patent number: 10562147
    Abstract: A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
  • Patent number: 10532441
    Abstract: A flexible membrane for a carrier head of a chemical mechanical polisher includes a main portion, an annular outer portion, and three annular flaps. The main portion has a substrate mounting surface with a radius R. The annular outer portion extends upwardly from an outer edge of the main portion and has a lower edge connected to the main portion and an upper edge. The three annular flaps include a first annular flap joined to an inner surface of the main portion at a radial position between 75% and 95% of R, a second inwardly-extending annular flap joined to the annular outer portion at a position between the lower edge and the upper edge, and a third inwardly-extending annular flap joined to the upper edge of the annular outer portion.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 14, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Jamie Leighton
  • Publication number: 20200001427
    Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.
    Type: Application
    Filed: June 21, 2019
    Publication date: January 2, 2020
    Inventors: Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang, Jeonghoon Oh, Rajeev Bajaj, Andrew Siordia