Patents by Inventor Jeonghoon Oh

Jeonghoon Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Textured small pad for chemical mechanical polishing
    Patent number: 10589399
    Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: March 17, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Edwin C. Suarez, Jason Garcheung Fung, Eric Lau, King Yi Heung, Ashwin Murugappan Chockalingam, Daniel Redfield, Charles C. Garretson, Thomas H. Osterheld
  • Polishing system with annular platen or polishing pad for substrate monitoring
    Patent number: 10562147
    Abstract: A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: February 18, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
  • Three-zone carrier head and flexible membrane
    Patent number: 10532441
    Abstract: A flexible membrane for a carrier head of a chemical mechanical polisher includes a main portion, an annular outer portion, and three annular flaps. The main portion has a substrate mounting surface with a radius R. The annular outer portion extends upwardly from an outer edge of the main portion and has a lower edge connected to the main portion and an upper edge. The three annular flaps include a first annular flap joined to an inner surface of the main portion at a radial position between 75% and 95% of R, a second inwardly-extending annular flap joined to the annular outer portion at a position between the lower edge and the upper edge, and a third inwardly-extending annular flap joined to the upper edge of the annular outer portion.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 14, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Jeonghoon Oh, Jamie Leighton
  • Temperature Control of Chemical Mechanical Polishing
    Publication number: 20200001426
    Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system. The temperature control system includes a plurality of thermal control modules positioned above the polishing pad at a plurality of different radial positions to heat or cool a plurality of regions of the polishing pad. Each thermal control module is configured to independently heat or cool a radial region of the polishing pad.
    Type: Application
    Filed: June 21, 2019
    Publication date: January 2, 2020
    Inventors: Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang, Jeonghoon Oh, Rajeev Bajaj, Andrew Siordia
  • Temperature Control of Chemical Mechanical Polishing
    Publication number: 20200001427
    Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.
    Type: Application
    Filed: June 21, 2019
    Publication date: January 2, 2020
    Inventors: Hari Soundararajan, Shou-Sung Chang, Haosheng Wu, Jianshe Tang, Jeonghoon Oh, Rajeev Bajaj, Andrew Siordia
  • Retaining ring having inner surfaces with features
    Patent number: 10500695
    Abstract: Some implementations of a retaining ring has an inner surface having a first portion formed of multiple planar facets and a second portion that adjoins the first portion along a boundary and includes a frustoconical surface that is sloped downwardly from outside in. Some implementations of the retaining ring have a crenellated or serpentine inner surface, and/or an inner surface with alternating region of different surface properties or different tilt angles.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: December 10, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Steven Mark Reedy, Simon Yavelberg, Jeonghoon Oh, Steven M. Zuniga, Andrew J. Nagengast, Samuel Chu-Chiang Hsu, Gautam Shashank Dandavate
  • Acoustic emission monitoring and endpoint for chemical mechanical polishing
    Patent number: 10478937
    Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, and an in-situ acoustic emission monitoring system including an acoustic emission sensor supported by the platen, a waveguide configured to extending through at least a portion of the polishing pad, and a processor to receive a signal from the acoustic emission sensor. The in-situ acoustic emission monitoring system is configured to detect acoustic events caused by deformation of the substrate and transmitted through the waveguide, and the processor is configured to determine a polishing endpoint based on the signal.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: November 19, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Jianshe Tang, David Masayuki Ishikawa, Benjamin Cherian, Jeonghoon Oh, Thomas H. Osterheld
  • Local area polishing system and polishing pad assemblies for a polishing system
    Patent number: 10434623
    Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: October 8, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Eric Lau, Hui Chen, King Yi Heung, Wei-Cheng Lee, Chih Chung Chou, Edwin C. Suarez, Garrett Ho Yee Sin, Charles C. Garretson, Jeonghoon Oh
  • RETAINING RING FOR CMP
    Publication number: 20190291238
    Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.
    Type: Application
    Filed: June 7, 2019
    Publication date: September 26, 2019
    Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, JR., Wei-Cheng Lee, Jeonghoon Oh
  • Monitoring of Vibrations During Chemical Mechanical Polishing
    Publication number: 20190283204
    Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 19, 2019
    Inventors: Boguslaw A. Swedek, Dominic J. Benvegnu, Chih Chung Chou, Nicholas Wiswell, Thomas H. Osterheld, Jeonghoon Oh
  • REINFORCEMENT RING FOR CARRIER HEAD WITH FLEXIBLE MEMBRANE
    Publication number: 20190210181
    Abstract: A reinforcement ring can be placed in a carrier head to abut an inner surface of a perimeter potion of a flexible membrane. The reinforcement ring has a substantially vertical cylindrical portion, a flange projecting outwardly from the bottom of the cylindrical portion, and a lip projecting outwardly from a top of the cylindrical portion. The flange projects outwardly farther than the lip.
    Type: Application
    Filed: March 14, 2019
    Publication date: July 11, 2019
    Inventors: Jeonghoon Oh, Jamie Leighton
  • Gas cooled substrate support for stabilized high temperature deposition
    Patent number: 10344375
    Abstract: Embodiments of the present disclosure provides apparatus and method for stabilizing substrate temperature by flowing a flow of cooling gas to an inlet of cooling channels in a substrate support, receiving the flow of cooling gas from an outlet of the cooling channel using a heat exchanger, and releasing the cooling gas to an immediate environment, such as a cleanroom or a minienvironment.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: July 9, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Brian West, Michael S. Cox, Jeonghoon Oh
  • Retaining ring for CMP
    Patent number: 10322492
    Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: June 18, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Andrew J. Nagengast, Christopher Heung-Gyun Lee, Thomas Li, Anand N. Iyer, Jie Diao, Huanbo Zhang, Erik S. Rondum, Wei-Cheng Lee, Jeonghoon Oh
  • METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAINING RINGS UTILIZED IN CHEMICAL MECHANICAL POLISHING PROCESSES
    Publication number: 20190105754
    Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
    Type: Application
    Filed: December 5, 2018
    Publication date: April 11, 2019
    Inventors: David Masayuki ISHIKAWA, Jeonghoon OH, Garrett Ho Yee SIN, Charles C. GARRETSON, Huanbo ZHANG, Chia-Ling PAI, Niraj PRASAD, Julio David MUZQUIZ
  • Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
    Patent number: 10252397
    Abstract: A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: April 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: David Masayuki Ishikawa, Jeonghoon Oh, Garrett Ho Yee Sin, Charles C. Garretson, Huanbo Zhang, Chia-Ling Pai, Niraj Prasad, Julio David Muzquiz
  • RETAINING RING DESIGN
    Publication number: 20190099857
    Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.
    Type: Application
    Filed: October 2, 2018
    Publication date: April 4, 2019
    Inventors: Jeonghoon OH, Charles C. GARRETSON, Eric LAU, Andrew NAGENGAST, Steven M. ZUNIGA, Edwin C. SUAREZ, Huanbo ZHANG, Brian J. BROWN
  • Methods for the continuous processing of substrates
    Patent number: 10236198
    Abstract: Methods of processing a plurality of substrates using a processing chamber with bottom and top openings and a plurality of processing slots are provided. A substrate positioned on a carrier is loaded into a first end of a processing chamber body through the bottom opening. The carrier is moved through a plurality of processing slots to a top opening at a second end of the chamber body and then removed from the processing chamber through the top opening.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: March 19, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Banqiu Wu, Nag B. Patibandla, Toshiaki Fujita, Ralf Hofmann, Pravin K. Narwankar, Jeonghoon Oh, Srinivas Satya, Li-Qun Xia
  • METHOD OF IDENTIFYING AND TRACKING ROLL TO ROLL POLISHING PAD MATERIALS DURING PROCESSING
    Publication number: 20190030677
    Abstract: Implementations described herein generally relate to methods and apparatus for polishing substrates, more particularly, to methods and apparatus for identifying and/or tracking polishing material in a roll-to-roll polishing system. In one implementation, a method of polishing a substrate is provided. The method comprises advancing a polishing material across a surface of a platen. The polishing material has a polishing surface and an opposing backside surface and the backside surface has a pattern of identifying features formed thereon. The method further comprises sensing the movement of the pattern of identifying features past a detector assembly. The method further comprises controlling a position of the polishing material relative to the platen based on data received from the sensed movement of the pattern of identifying features.
    Type: Application
    Filed: July 17, 2018
    Publication date: January 31, 2019
    Inventors: Jeonghoon OH, David J. LISCHKA, Erik RONDUM, Jay GURUSAMY, Robert D. TOLLES, Steven M. ZUNIGA, Steven M. REEDY, Wai- Ming KAN
  • SPUTTERING TARGET WITH BACKSIDE COOLING GROOVES
    Publication number: 20180342378
    Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.
    Type: Application
    Filed: July 30, 2018
    Publication date: November 29, 2018
    Inventors: Brian T. WEST, Michael S. COX, Jeonghoon OH
  • SPIRAL AND CONCENTRIC MOVEMENT DESIGNED FOR CMP LOCATION SPECIFIC POLISH (LSP)
    Publication number: 20180250788
    Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.
    Type: Application
    Filed: February 8, 2018
    Publication date: September 6, 2018
    Inventors: Eric LAU, Chih Chung CHOU, Charles C. GARRETSON, Jeonghoon OH, King Yi HEUNG