Abstract: A curved human interface device is manufactured by thermoforming a stack. The stack comprises a front substrate formed of a transparent, first thermoplastic material; an OLED display configured to display an image through the front substrate; and a thermomechanical buffer layer formed of a transparent, second thermoplastic material arranged between the front substrate and the OLED display. Heat is applied to the stack for causing a temperature of the front substrate and buffer layer to increase to a respective processing temperature at which the first and second thermoplastic materials become pliable. The stack is thermoformed while the thermoplastic materials are pliable to form the curved human interface device. The second thermoplastic material has a lower stiffness at the respective processing temperature than the first thermoplastic material.

Abstract: The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

Abstract: An electronic device (100) comprises a stretchable substrate (30) with a flap (30f) formed by a cut (40) in the substrate (30). The flap (30f) is disconnected by the cut (40) from a surrounding main section (30m) of the substrate (30) except on one side. The flap (30f) is exclusively connected to the main section (30m) via a connected section (30c) of the substrate (30) between two ends (40a, 40b) of the cut (40). An electronic component (10) is disposed on the flap (30f) with electrical contacts (11,12) connected to conductive tracks (21,22) disposed on the substrate (30). The conductive tracks (21,22) extend between the component (10) disposed on the flap (30f), and other parts (10r) of the electronic device (100) outside the flap (30f) via the connected section (30c). The flap (30f) with the component (10) is disposed in a pocket formed by surrounding lamination layers (31,32).

Abstract: A heart monitoring system (100) comprises an array of force-sensitive resistors (10) spanning a sensor surface (50). Each resistor (10) is configured to change a respective resistance value (R) in accordance with an amount of static pressure (P) exerted on the sensor surface (50) at a respective location of the force-sensitive resistor (10) by a subject (200). An array of piezoelectric transducers (20) is interspersed among the array of force-sensitive resistors (10). Each transducer (20) is configured to generate 10 a respective time-dependent electrical signal (S) in accordance with respective vibrations (F) exerted on the sensor surface (50) at a respective location of the transducer (20) by the subject (200). A controller (30) is configured to determine a heart rate (H1) of the subject (200) based on a combination of the measured resistance values (R) of the force-sensitive 15 resistors (10) and the time-dependent electrical signals (S) of the piezoelectric transducers (20).

Abstract: A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

Abstract: An electronic device (100) comprises an electronics substrate (10) with at least one light emitting device (12), a cover substrate (20) with a graphical pattern including at least one window (22), and a thermoplastic layer (30) there between. A multilayer laminate (40) of the device (100) is formed by combining the electronics substrate (10) and the cover substrate (20) by lamination with protruding electronic components (11,12) facing the thermoplastic layer (30). At least the thermoplastic layer (30) is heated to a lamination temperature (T1) for increasing a plasticity of the thermoplastic material (30m). The electronic components (11,12) are pushed by the lamination into the heated thermoplastic layer (30) for embedding the electronic components (11,12) in the thermoplastic material (30m).

Abstract: A method and apparatus for transferring components. A first substrate is provided with the components. A second substrate is provided with an adhesive layer comprising a hot melt adhesive material. The components on the first substrate are contacted with the adhesive layer on the second substrate while the adhesive layer is melted. The adhesive layer is allowed to solidify to form an adhesive connection between the components and the second substrate. The first and second substrates are moved apart to transfer the components. At least a subset of the components is transferred from the second substrate to a third substrate by radiating light onto the adhesive layer to form a jet of melted material carrying the components.

Abstract: The present disclosure concerns a pressure sensor, comprising at least two adjacent electrically conductive leads disposed in a pattern on a face of a first elastomeric carrier; and an electrically resistive layer formed of a electrically resistive composite material for shunting the at least two adjacent electrically conductive leads, said electrically conducting layer disposed on a face of a second elastomeric carrier. The first and second carriers are stacked across a spacer such that the at least two adjacent electrically conductive leads faces the electrically resistive layer across a gap defined by the spacer. The gap is formed by a pocket between the carriers.

Abstract: The present disclosure concerns a core body temperature sensor for measuring the core body temperature of a body in a non-invasive way via applying the core body temperature sensor to a surface of the bod. The core body temperature sensor comprises: at least a first thermistor pair of opposing thermistors across a first thermal insulator and a second thermistor pair, adjacent to the first thermistor pair, of opposing thermistors across a second thermal insulator, and a means to measure blood perfusion. The core body temperature sensor is an essential planar sandwich structure formed of the at least first and second thermistor pairs across the respective first and second thermal insulators sandwiched between opposing carriers. The present disclosure further concerns a method for determining a core body temperature and a method for the manufacturing of a core body temperature sensor.

Abstract: A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

Abstract: Illuminating sections of a light guide with LEDs leads to unwanted light bleeding to other parts of the light guide. Furthermore typically LEDs are placed at a large distance from the area that couples out light from this LED due to a spike in intensity close to the LED. In order to avoid this spike being visible in the lit area the distance is increased which results in unwanted areal increase of the overall system. The present provides a layout to overcome these challenges.

Abstract: A wearable system is for mounting against the skin of a subject. It comprises a flexible circuit board sandwiched (e.g. laminated) between a top layer and a base layer. The flexible circuit board has a meander section between end pads. The base layer and the top layer are bonded together by a bonding layer which has a meander opening around the meander section. This means the stretchability of the meander section is not inhibited by the lamination process.

Abstract: A screen (1) is provided comprising at least a first and a second elongate guidance element (27, 28) extending in a first direction (D1) and a structured foil (10) with a front surface and a back surface, having a variable length (L) in a first direction (D1) carried by the elongate guidance elements. The screen has slat shaped portions (11a1+11a2, 11b1+11b2) and connection portions (12ab, 2ab?) bridging the slat shaped portions. The slat shaped portions, which extend in a second direction (D2) transverse to the first direction are provided with photovoltaic elements (20) that are connectable to external terminals for supply of electric energy. The slate shaped portions are slidably coupled with the guidance elements, to allow them to slide in said first direction along said guidance elements.

Abstract: An electronic device (100) comprises a stretchable substrate (30) with a flap (30f) formed by a cut (40) in the substrate (30). The flap (30f) is disconnected by the cut (40) from a surrounding main section (30m) of the substrate (30) except on one side. The flap (30f) is exclusively connected to the main section (30m) via a connected section (30c) of the substrate (30) between two ends (40a, 40b) of the cut (40). An electronic component (10) is disposed on the flap (30f) with electrical contacts (11,12) connected to conductive tracks (21,22) disposed on the substrate (30). The conductive tracks (21,22) extend between the component (10) disposed on the flap (30f), and other parts (10r) of the electronic device (100) outside the flap (30f) via the connected section (30c). The flap (30f) with the component (10) is disposed in a pocket formed by surrounding lamination layers (31,32).

Abstract: Illuminating sections of a light guide with LEDs leads to unwanted light bleeding to other parts of the light guide. Furthermore typically LEDs are placed at a large distance from the area that couples out light from this LED due to a spike in intensity close to the LED. In order to avoid this spike being visible in the lit area the distance is increased which results in unwanted areal increase of the overall system. The present provides a layout to overcome these challenges.

Abstract: The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

Abstract: The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6).

Abstract: According to one aspect, the invention provides a method of providing conductive structures between two foils in a multi-foil system. The system comprises at least two foils, from which at least one foil comprises a terminal. The method comprises the steps of (in any order) providing at least one solid state adhesive layer, patterning adhesive layer with through-holes; filling the through-holes with conductive material, so as to form the conductive structure, connected to the terminal; and bonding the at least two foils. One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.

Abstract: A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.

Abstract: A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.