Patents by Inventor Jeroen van den Brand
Jeroen van den Brand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10304797Abstract: An apparatus and method for soldering chips to a substrate. A substrate and two or more different chips having different heating properties are provided. A solder material is disposed between the chips and the substrate. A flash lamp generates a light pulse for heating the chips, wherein the solder material is at least partially melted by contact with the heated chips. A masking device is disposed between the flash lamp and the chips causing different light intensities in different areas of the light pulse passing the masking device thereby heating the chips with different light intensities. This may compensate the different heating properties to reduce a spread in temperature between the chips as a result of the heating by the light pulse.Type: GrantFiled: April 26, 2016Date of Patent: May 28, 2019Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNOInventors: Gari Arutinov, Edsger Constant Pieter Smits, Jeroen van den Brand
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Publication number: 20190027461Abstract: A substrate (3) and two or more different chips (1a, 1b) having different heating properties (e.g. caused by different dimensions (surface area and/or thickness), heat capacity (C1, C2), absorptivity, conductivity, number and/or size of solder bonds) are provided. A solder material (2) is disposed between the chips (1a, 1b) and the substrate (3). A flash lamp (5) generates a light pulse (6) for heating the chips (1a, 1b), wherein the solder material (2) is at least partially melted by contact with the heated chips (1a, 1b). A masking device (7) is disposed between the flash lamp (5) and the chips (1a, 1b) causing different light intensities (1a, 1b) in different areas (6a, 6b) of the light pulse (6) passing the masking device (7), thereby heating the chips (1a, 1b) with different light intensities (1a, 1b). This may compensate the different heating properties to reduce a spread in temperature between the chips (1a, 1b) as a result of the heating by the light pulse (6).Type: ApplicationFiled: April 26, 2016Publication date: January 24, 2019Inventors: Gari Arutinov, Edsger Constant Pieter Smits, Jeroen van den Brand
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Publication number: 20180363366Abstract: A screen (1) is provided comprising at least a first and a second elongate guidance element (27, 28) extending in a first direction (D1) and a structured foil (10) with a front surface and a back surface, having a variable length (L) in a first direction (D1) carried by the elongate guidance elements. The screen has slat shaped portions (11a1+11a2, 11b1+11b2) and connection portions (12ab, 2ab?) bridging the slat shaped portions. The slat shaped portions, which extend in a second direction (D2) transverse to the first direction are provided with photovoltaic elements (20) that are connectable to external terminals for supply of electric energy. The slate shaped portions are slidably coupled with the guidance elements, to allow them to slide in said first direction along said guidance elements.Type: ApplicationFiled: December 16, 2016Publication date: December 20, 2018Inventors: Johannes Andreas Maria Ammerlaan, Hieronymus Antonius Josephus r Andriessen, Gerardus Titus van Heck, Jeroen van den Brand, Harmannus Franciscus Maria Schoo
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Publication number: 20180020541Abstract: A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.Type: ApplicationFiled: January 26, 2016Publication date: January 18, 2018Inventors: Margaretha Maria de Kok, Gerardus Titus van Heck, Jeroen van den Brand, Arachchige Tharindu Niroshan Athauda, Vivek Vashdev Ramchandani, Mudiyanselage Praneeth Maheeka Weerasekara
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Patent number: 9859247Abstract: A method is provided for assembly of a micro-electronic component, in which a conductive die bonding material is used. This material includes a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer A laser beam is impinged on the dynamic release layer, adjacent to the die bonding material layer, in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated, to cover a selected part of the pad structure with a transferred conductive die bonding material. The laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly, adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.Type: GrantFiled: November 8, 2013Date of Patent: January 2, 2018Assignees: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO, IMEC vzwInventors: Edsger Constant Pieter Smits, Sandeep Menon Perinchery, Jeroen Van den Brand, Rajesh Mandamparambil, Harmannus Franciscus Maria Schoo
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Patent number: 9480151Abstract: An assembly of a plurality of tiles (1) with a carrier (40), wherein the tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier, and the tiles overlay according to a fish scale pattern.Type: GrantFiled: January 31, 2011Date of Patent: October 25, 2016Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijkonderzoek TNOInventors: Margaretha Maria De Kok, Jeroen Van Den Brand, Gerardus Titus Van Heck
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Patent number: 9450205Abstract: An opto-electric device includes an opto-electric layer structure having an anode and a cathode layer and an opto-electric layer arranged between the anode and cathode layers, and having a light-transmission side. A dual electrically conductive layer structure is arranged at a side of the opto-electric layer structure opposite the light-transmission side, the dual electrically conductive layer structure having a first and a second electrically conductive layer mutually insulated by a first electrically insulating layer. A second electrically insulating layer is arranged between the light emitting layer structure and the dual electrically conductive layer structure, wherein the first electrically conductive layer is electrically connected by at least a first transverse electrical conductor with the anode layer and the second electrically conductive layer is electrically connected by at least a second transverse electrical conductor with the cathode layer.Type: GrantFiled: February 15, 2013Date of Patent: September 20, 2016Assignee: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNOInventors: Jeroen van den Brand, Joanne Sarah Wilson, Antonius Maria Bernardus van Mol, Dorothee Christine Hermes, Edward Willem Albert Young
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Patent number: 9437510Abstract: An opto-electrical device is provided that comprises a cover (10), a barrier structure (20), an opto-electrical structure (30) and a plurality of transverse electrical conductors (40).Type: GrantFiled: March 1, 2011Date of Patent: September 6, 2016Assignees: Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek TNO, Koninklijke Philips Electronics N.V.Inventors: Jeroen van den Brand, Herbert Lifka, Edward Willem Albert Young
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Patent number: 9402306Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.Type: GrantFiled: January 31, 2011Date of Patent: July 26, 2016Assignee: Nederlandse Organisatie voor toegepast-natuurewetenschappelijk onderzoek TNOInventors: Jeroen Van Den Brand, Gerardus Titus Van Heck, Margaretha Maria De Kok
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Publication number: 20160211473Abstract: The invention relates to a bendable electrically interconnecting foil for making flexible electronic circuits, more in particular circuits comprising rigid electronic components such as integrated circuits. The foil comprises a flexible substrate and stretchable conductive tracks for connecting the electronic components. Between the substrate and the tracks a resilient layer is situated. The invention further relates to an electronic circuit comprising the bendable electrically interconnecting foil.Type: ApplicationFiled: September 4, 2014Publication date: July 21, 2016Inventors: Daan Anton VAN DEN ENDE, Roel Henry Louis KUSTERS, Jeroen VAN DEN BRAND
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Patent number: 9338894Abstract: A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of placing the component (30) on a first main side (11) of the substrate, applying a machine vision step to estimate a position of the electric contacts, depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, calculating partitioning lines depending on the estimated position of the electric contacts, partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.Type: GrantFiled: December 2, 2011Date of Patent: May 10, 2016Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNOInventors: Jeroen Van Den Brand, Roel Henry Louis Kusters, Andreas Heinrich Dietzel
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Publication number: 20150375487Abstract: Roll-to-roll apparatus and method for manufacturing a product comprising a target substrate provided with at least one foil shaped component Abstract A roll-to-roll apparatus is disclosed for manufacturing a product comprising a target substrate (TS) provided with at least one foil shaped component (CP).Type: ApplicationFiled: February 12, 2014Publication date: December 31, 2015Inventors: Jeroen VAN DEN BRAND, Gari ARUTINOV, Edsger Constant Pieter SMITS, Andreas Heinrich DIETZEL
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Publication number: 20150367560Abstract: The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6).Type: ApplicationFiled: December 17, 2013Publication date: December 24, 2015Inventors: Jeroen van den Brand, Ashok Sridhar, Anja Henckens, Gunther Dreezen
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Patent number: 9174425Abstract: The invention relates to an apparatus for laminating a first and a second sheet with a plane carrier (10) and a drum shaped carrier (20) for carrying a respective sheet. The apparatus has a first main operational mode wherein the drum shaped carrier (20) is at distance from a first carrier surface (12) of the plane carrier (10) in said third direction (Z), and a second main operational mode wherein the drum shaped carrier (20) is close to first carrier surface to bring the first and the second sheet (1, 2) in contact with each other. In the first main operational mode the drum shaped carrier (20) is virtually rolled over the first carrier surface (12) and the sheets are mutually aligned. In the second operational mode the sheets are laminated.Type: GrantFiled: November 19, 2010Date of Patent: November 3, 2015Assignee: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNOInventors: Jeroen Van Den Brand, Andreas Heinrich Dietzel, Sander Christiaan Broers, Milan Saalmink
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Publication number: 20150294951Abstract: A method is provided for assembly of a micro-electronic component comprising the steps of: providing a conductive die bonding material comprising of a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer; and impinging a laser beam on the dynamic release layer adjacent to the die bonding material layer; in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated to cover a selected part of the pad structure with a transferred conductive die bonding material; and wherein the laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.Type: ApplicationFiled: November 8, 2013Publication date: October 15, 2015Inventors: Edsger Constant Pieter Smits, Sandeep Menon Perinchery, Jeroen Van Den Brand, Rajesh Mandamparambil, Harmannus Franciscus Maria Schoo
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Patent number: 9078361Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.Type: GrantFiled: January 31, 2011Date of Patent: July 7, 2015Assignee: Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNOInventors: Gerardus Titus Van Heck, Margaretha Maria De Kok, Jeroen Van Den Brand
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Patent number: 8980025Abstract: An apparatus is provided for laminating a first and a second sheet (1, 2) comprising—a chamber (10) having a first, a second and a third compartment (11, 12, 13 resp.) subsequently arranged along a first axis (Z), each compartment having a port (21, 22, 23 resp.Type: GrantFiled: November 1, 2010Date of Patent: March 17, 2015Assignee: Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek TnoInventors: Jeroen Van Den Brand, Sander Christiaan Broers, Milan Saalmink, Andreas Heinrich Dietzel, Andreas Tanda
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Publication number: 20150008474Abstract: An opto-electric device includes an opto-electric layer structure having an anode and a cathode layer and an opto-electric layer arranged between the anode and cathode layers, and having a light-transmission side. A dual electrically conductive layer structure is arranged at a side of the opto-electric layer structure opposite the light-transmission side, the dual electrically conductive layer structure having a first and a second electrically conductive layer mutually insulated by a first electrically insulating layer. A second electrically insulating layer is arranged between the light emitting layer structure and the dual electrically conductive layer structure, wherein the first electrically conductive layer is electrically connected by at least a first transverse electrical conductor with the anode layer and the second electrically conductive layer is electrically connected by at least a second transverse electrical conductor with the cathode layer.Type: ApplicationFiled: February 15, 2013Publication date: January 8, 2015Inventors: Jeroen van den Brand, Joanne Sarah Wilson, Antonius Maria Bernardus van Mol, Dorothee Christine Hermes, Edward Willem Albert Young
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Patent number: 8815030Abstract: A laminating apparatus (200) for laminating a substrate foil (SF) with a laminating foil (LF) comprises a first and a second facility (210, 214) for providing the substrate foil and the laminating foil respectively, a recognition facility (224, 225) for determining a location of at least one feature of at least one (LF) of the laminating foil and the substrate foil and an alignment facility (252, 253) for aligning the at least one (LF) of the foils, a separation facility (240) for separating a portion (SF1; LF1) of the at least one of the foils after it is controlled by the alignment facility, a laminating facility (250, 252) for laminating the separated portion of the at least one of the foil against the other one of the foils.Type: GrantFiled: March 13, 2009Date of Patent: August 26, 2014Assignee: Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNOInventors: Jeroen van den Brand, Andreas Heinrich Dietzel, Ike de Vries
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Patent number: 8759884Abstract: An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer. The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).Type: GrantFiled: July 7, 2009Date of Patent: June 24, 2014Assignees: Nederlandse Organisatie voor toegepast—natuurwetenschappelijk onderzoek TNO, Koninklijke Philips Electronics N.V.Inventors: Jeroen van den Brand, Andreas Heinrich Dietzel, Edward Willem Albert Young, Herbert Lifka, Erik Dekempeneer