Abstract: A heat transfer device is provided for conducting heat from a heat source. The heat transfer device generally includes an evaporator for generating a vapor, a condenser in fluid communication with the evaporator, and a vapor flow restrictor interposed between the evaporator and the condenser, wherein the vapor flow restrictor can increase vapor pressure in at least a portion of the evaporator relative to vapor pressure in the condenser.

Abstract: A heat-transfer device and system for conducting heat from a heat source. The heat-transfer device can include an evaporator having one or more reinforcement elements occupying respective recesses defined in a body of the evaporator, wherein the reinforcement elements are more resistant to deformation under clamp load than the material of the evaporator body, while still having desirable heat conductivity. In some embodiments, the heat-transfer system includes a plurality of serially coupled evaporators for generating a respective vapor; at least one reinforcement element interposed between adjacent evaporators; and a condenser in fluid communication with the evaporator.

Abstract: A heat transfer device is provided for conducting heat from a heat source. The heat transfer device generally includes an evaporator for generating a vapor, a condenser in fluid communication with the evaporator, and a vapor flow restrictor interposed between the evaporator and the condenser, wherein the vapor flow restrictor can increase vapor pressure in at least a portion of the evaporator relative to vapor pressure in the condenser.

Abstract: A heat transfer device is provided for conducting heat from a heat source. The heat transfer device generally includes an evaporator for generating a vapor, a condenser in fluid communication with the evaporator, and a vapor flow restrictor interposed between the evaporator and the condenser, wherein the vapor flow restrictor can increase vapor pressure in at least a portion of the evaporator relative to vapor pressure in the condenser.

Abstract: A backing plate for joining a heat removal device to a heat source. The backing plate can include a planar plate region having a first face and a second face opposite the first face. The backing plate can also include at least one boss projecting from the first face and having an opening therein for receiving a fastener.

Abstract: A heat-transfer device and system for conducting heat from a heat source. The heat-transfer device can include an evaporator having one or more reinforcement elements occupying respective recesses defined in a body of the evaporator, wherein the reinforcement elements are more resistant to deformation under clamp load than the material of the evaporator body, while still having desirable heat conductivity. In some embodiments, the heat-transfer system includes a plurality of serially coupled evaporators for generating a respective vapor; at least one reinforcement element interposed between adjacent evaporators; and a condenser in fluid communication with the evaporator.

Abstract: A heat transfer device is provided for conducting heat from a heat source. The heat transfer device generally includes an evaporator for generating a vapor, a condenser in fluid communication with the evaporator, and a vapor flow restrictor interposed between the evaporator and the condenser, wherein the vapor flow restrictor can increase vapor pressure in at least a portion of the evaporator relative to vapor pressure in the condenser.

Abstract: A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a structural column for air heat exchange fins. The channel in the base plate is parallel to an edge. An additional channel or ridge is provided, also parallel to the edge, for receiving a clamp or spring clip to urge the base plate against the heat source. The base plate is inexpensively extruded with the parallel channels, ridges, etc., extending across the width of the base plate parallel to the edge. The heat sink has a minimum number of inexpensive parts yet is highly thermally efficient.

Abstract: A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a structural column for air heat exchange fins. The channel in the base plate is parallel to an edge. An additional channel or ridge is provided, also parallel to the edge, for receiving a clamp or spring clip to urge the base plate against the heat source. The base plate is inexpensively extruded with the parallel channels, ridges, etc., extending across the width of the base plate parallel to the edge. The heat sink has a minimum number of inexpensive parts yet is highly thermally efficient.

Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

Abstract: A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.

Abstract: A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a structural column for air heat exchange fins. The channel in the base plate is parallel to an edge. An additional channel or ridge is provided, also parallel to the edge, for receiving a clamp or spring clip to urge the base plate against the heat source. The base plate is inexpensively extruded with the parallel channels, ridges, etc., extending across the width of the base plate parallel to the edge. The heat sink has a minimum number of inexpensive parts yet is highly thermally efficient.

Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

Abstract: The apparatus is an assembly of cooling fins attached to pipes or heat pipes. The fins are formed into a corrugated configuration of troughs and peaks with large sections of the peaks removed to permit air flow along the depths of the troughs as well as along the lengths of the troughs. Holes are also formed into the fins to accept and grip a pipe or heat pipe. The preferred embodiment has holes surrounded by split collars formed into each fin, with the collars aligned to accept and grip the pipe.

Abstract: The apparatus is an assembly of cooling fins attached to pipes or heat pipes. The fins are formed into a corrugated configuration of troughs and peaks with large sections of the peaks removed to permit air flow along the depths of the troughs as well as along the lengths of the troughs. Holes are also formed into the fins to accept and grip a pipe or heat pipe. The preferred embodiment has holes surrounded by split collars formed into each fin, with the collars aligned to accept and grip the pipe.

Abstract: The invention is an integrated circuit cooler in which a heat spreader is mounted atop a weight sensitive integrated circuit package, and at least one heat pipe is attached to the heat spreader and to a cooling fin assembly remote from the heat spreader. To accommodate to the tolerances, the potential tilt of the installed integrated circuit package, and the weight of the fins, the heat spreader is mounted on the integrated circuit package using springs on posts attached to the circuit mounting board, and the heat pipe has an annealed section of the casing located between the heat spreader and the fins to relieve the potential stress on the thermal connection or the integrated circuit package. Another feature of the assembly is that the fins are mounted on the heat pipe using only spring clamps formed into the fins.

Abstract: An apparatus is a heat conducting connection between a heat pipe and a structure such as an integrated circuit heat sink. The heat sink contains a groove with extension tabs protruding above edges of the groove so that the tabs can be bent over to hold the heat pipe in the groove which is dimensioned to give a clearance space around the heat pipe. When the tabs are bent down far enough to deform the heat pipe or a heat conductive hardening material is used to fill the clearance space, the heat pipe is fixed in place. If the tabs are bent down to barely contact the heat pipe and a heat conductive non-hardening material is used to fill the clearance space, the heat pipe can still be rotated within the groove.

Abstract: The apparatus is a device for transferring heat across the hinged joint between the two sections of the case of a laptop computer. Two simple heat pipe cylinders are inserted into parallel cylindrical holes in a heat conductive block. One cylinder is bonded within its hole, and the other cylinder is permitted to rotate within its hole. The axis of the rotatable cylinder is located in line with the axis of the mechanical hinges which permit the panels to pivot relative to each other. A heat producing device in one panel can be then attached to one heat pipe, and a heat sink on the other panel can be attached to the other heat pipe. The heat transfer between the heat source and the heat sink is essentially that of a heat pipe except for the very short heat conductive path through the solid block and the one rotating joint.

Abstract: The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.