Abstract: The apparatus is a heat sink for an integrated circuit chip which uses heat pipe cooling to remove the heat. The heat sink is a heat conductive structure such as a bowl which is associated with the integrated circuit socket, with the heat conductive structure held against the integrated circuit. A heat pipe is attached to the structure by using an extension from the heat conductive structure and wrapping the extension around a simple cylindrical heat pipe. One embodiment uses spring clips to attach the heat sink to the socket, and another version uses attachment screws through tabs which are formed from the material around a bowl shaped heat conductive structure.

Abstract: The invention is an apparatus for attaching a heat pipe to an integrated circuit or other surface. The heat pipe is held against the flat surface by a heat conducting clamp constructed as a "U" cross section with flanges on the ends of the "U" section, and both the heat pipe and the clamp are held onto the integrated circuit or other surface with heat conductive tape which has adhesive on both its faces. The heat pipe itself can be deformed so that its contact surface also is flat and yields better heat transfer with the integrated circuit.

Abstract: The apparatus is a cooling device for an integrated circuit chip which includes a heat conductive pad for contact with the top surface of the chip and for attachment to a heat pipe to dispose of the heat. One surface of the pad is flat and contacts the circuit chip while the opposite surface of the pad is attached to a simple cylindrical heat pipe. The pad includes extensions from its sides to which a holding fixture applies force so that the pad is held tightly against the chip. The holding fixture is held on the mounting board by screws while the top of the pad which is attached to the heat pipe protrudes through a hole in the holding fixture. A finned heat exchanger is attached to an end of the heat pipe remote from the conductive pad.

Abstract: A heat pipe which maintains a controlled temperature gradient over its length. An annular heat pipe is constructed to have a core area which is a working furnace and to have the heat input at one end and a heat sink at the other end of the annular structure. The core is surrounded by an annular vapor space with a restricted cross section. The reduced vapor space creates a temperature gradient over the length of the furnace, and this gradient is variable and controllable depending upon the quantity of heat being transferred from the heat source to the heat sink.

Abstract: A heat pipe with limited heat transfer capabilities in one direction. The heat pipe, which transfers heat in one direction in normal fashion, also transfers heat in the reverse direction, but only up to a prescribed point, beyond which the reverse heat flow cuts off. It operates because of the use of a limited liquid filling and at least one artery which is closed at the normal evaporator end and open ended at the normal condenser end.