Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.

Abstract: An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.

Abstract: A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array.

Abstract: Various embodiments provide systems and methods measuring the temperature of a device using a semiconductor temperature sensor, such as a diode. This invention allows the use of an uncalibrated diode to be used as a temperature sensor by applying a sinusoidally varying forcing current to the diode and measuring the rate of change of the voltage across the diode. Embodiments advantageously provide for a rapid, responsive temperature measuring, substantially eliminating the effect of lead resistance associated with the temperature sensor.

Abstract: An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: Various embodiments provide systems and methods measuring the temperature of a device using a semiconductor temperature sensor, such as a diode. This invention allows the use of an uncalibrated diode to be used as a temperature sensor by applying a sinusoidally varying forcing current to the diode and measuring the rate of change of the voltage across the diode. Embodiments advantageously provide for a rapid, responsive temperature measuring, substantially eliminating the effect of lead resistance associated with the temperature sensor.

Abstract: A mechanical assembly for regulating the temperature of an IC-chip in an IC-module includes: a) a heat-exchanger having a first face for contacting a second face on the IC-module; and b) a gimbal, coupled to the heat-exchanger, for tilting and pressing the first face flatly against the second face, as the first and second faces are moved from a spaced-apart position to an engaged position at which the IC-chip temperature is regulated. In addition, the mechanical assembly further includes an output tube, coupled to an output port on the heat-exchanger, which has two ends that move relative to each other as the first and second faces move from the spaced-apart position to the engaged position; and, this output tube is coiled into a weak spring which is characterized by a stiffness matrix that is limited by a predetermined acceptance criterion.

Abstract: A dual feedback control system maintains the temperature of an IC-chip near a set-point while the IC-chip dissipates a varying amount of electrical power. The first feedback circuit sends electrical power to an electric heater with a variable magnitude that compensates for changes in the IC-chip power. The second feedback circuit passes a liquid refrigerant to an evaporator, which is connected to the heater, with a variable flow rate that reduces electrical power usage in the heater over that which occurs if the flow rate is fixed.

Abstract: A heat-exchanger in a chip tester includes an electric heater and a heatsink which are joined together with a layer of an attach material. The operational period of this heat-exchanger is extended by a method which includes the steps of: 1) testing chips in the chip tester in a manner that puts the heat-exchanger through multiple temperature changes which keep the layer in a solid state and which induce stress-cracks in the layer; 2) subjecting the layer to a crack-healing temperature cycle in which the layer is melted at least partially and re-solidified; and thereafter, 3) repeating the testing step.

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Further, at least one window is provided in the container such that it passes energy by electromagnetic radiation from a radiation source to the IC-module, but blocks the liquid coolant.

Abstract: A chip tester includes a heat-exchanger which regulates the temperature of an integrated circuit chip that is being tested by pressing against the chip. The heat-exchanger incorporates an electric heater and a heatsink that are joined together with a layer of attach material. The layer of attach material is limited to one that can be melted, at least partially, at a predetermined temperature, and re-solidified, multiple times. A spacer is in the heat-exchanger which stays solid at the predetermined temperature and which keeps the layer of attach material at a constant thickness.

Abstract: The temperature of multiple integrated circuit modules is regulated by a heat exchanger which is sequentially squeezed against, and separated from, a respective uneven contact surface on each of the modules. The heat exchanger has a face of a malleable metal that stays in a solid state and deforms while the squeezing occurs. The surface of the malleable metal has a coating of a release agent that prevents the malleable metal from sticking to the contact surface.

Abstract: An integrated circuit chip can be thermally destroyed in a tester due to a defective pressed joint with a temperature regulating component. A method which prevents such destruction begins with the step of pressing the chip against the temperature regulating component within the tester. While the pressing step is occurring, thermal power is sent to the temperature regulating component with a magnitude that undergoes an abrupt change. Then, during a time interval that begins with the abrupt change in thermal power, a temperature change is sensed in either the temperature regulating component, or the chip. Thereafter, electrical power is applied to the chip in the tester only if the temperature change, which is sensed by the sensing step, meets a predetermined criteria.

Abstract: An integrated circuit chip can be thermally destroyed in a tester due to a defective pressed joint with a temperature regulating component. A method which prevents such destruction begins with the step of maintaining the chip at one temperature while forcing the temperature regulating component to a different temperature, when the chip and the temperature regulating component are spaced apart in the tester. Next, the chip at its one temperature and the temperature regulating component at its different temperature are pressed together. Then a temperature change is sensed in either the chip or the temperature regulating component, during a time interval that begins when the temperature regulating component and the chip initially press together. Thereafter, electrical power is applied to the chip in the tester only if the temperature change, which is sensed by the sensing stop, meets a predetermined criteria.

Abstract: A heat exchanger, for regulating the temperature of multiple integrated circuit modules, is fabricated by constructing a face on a hollow jacket such that the face consists essentially of a malleable metal with a coating of a release agent. In one embodiment, the malleable metal is fabricated as a foil which is attached to the jacket by an adhesive, and the coating is fabricated as a powder of the release agent which is rubbed into the surface of the foil.

Abstract: An electromechanical apparatus for testing IC chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly which are squeezed together in multiple sets by respective pressing mechanisms; and this apparatus uses a generic structure for both the chip holding subassembly and the power converter subassembly. This generic structure is comprised of a planer substrate having first and second faces that are opposite to each other and are surrounded by an edge that is free of any electrical edge connectors. To use the above generic subassembly as the chip holding subassembly, an electrical components on the first face of the substrate include sockets which hold the chips that are tested. To use the above generic subassembly as the power converter subassembly, the electrical components on the first face of the substrate include electrical power converters for the chips that are tested.

Abstract: An electromechanical apparatus for testing IC chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly which are squeezed together in multiple sets by respective pressing mechanisms; and this apparatus uses a generic structure for both the chip holding subassembly and the power converter subassembly. This generic structure is comprised of a planer substrate having first and second faces that are opposite to each other and are surrounded by an edge that is free of any electrical edge connectors. Distributed on the first face of the substrate are a plurality of electrical components that are used in testing the chips; and, distributed on the second face of the substrate are a plurality of electrical contacts which are connected through the substrate to the electrical components on the first face. These electrical contacts get pressed against mating contacts, and they carry all electrical power and all electrical signals for the chips that are tested.

Abstract: A temperature control system comprises a reservoir that is holding a hot fluid; a heat exchanger, for an electronic component, coupled to an input conduit that carries the hot fluid from the reservoir into the heat exchanger; an output conduit coupled to the heat exchanger, that carries the hot fluid from the heat exchanger back to the reservoir; a first temperature sensor, coupled to the input conduit; and a second temperature sensor, coupled to the output conduit. A heater is coupled to the output conduit which adds heat to the hot fluid in the output conduit in response to a heater control signal; and a cooler is coupled to the reservoir which adds cold fluid to the reservoir in response to a cooler control signal. A temperature controller generates the heater control signal and the cooler control signal as respective functions of both sensed temperatures.