Abstract: A chip burn-in system maintains the temperature of IC-chips near a set point, while the IC-chips undergo large step increases and large step decreases in power dissipation as they are tested. The system includes a hot fluid circuit in which a hot fluid circulates from a reservoir through heat exchangers and back to the reservoir, and in which the heat exchangers exchange heat by conduction between the hot fluid and the IC-chips. To keep the temperature of the fluid in the reservoir nearly constant, the system includes an electric heater which operates with a fast response to add heat to the fluid returning to the reservoir as a function of one control signal; and an analog valve which operates with a slow response to add a cold fluid to the reservoir as a function of another control signal.

Abstract: An electromechanical apparatus for testing IC-chips 12c includes a sliding springy mechanism 15a-15g which squeezes a chip holding subassembly 12a-12d between a temperature regulating subassembly 14a-14d and a power converter subassembly 13a-13c. Vertically moveable actuators 16a, with slots 16a-1, impart motion to joints 15e within the sliding springy mechanism 15a-15g. The joints 15e slide on a rail 15a to thereby open and close arms 15a, 15b; and that causes the substrates 14c, 12c to be lowered and raised, respectively. When the substrates 14c, 12c are raised, temperature regulating components 12c engage IC-chips 12c, and electrical contacts 12d engage electrical contacts 13b, with a force that is nearly constant despite the presence of several dimensional tolerances.

Abstract: An electromechanical apparatus for testing integrated chips includes a chip holding subassembly, a power converter subassembly, and a temperature regulating subassembly, which are squeezed together in multiple sets, by respective pressing mechanisms. One benefit which is achieved with this electromechanical apparatus is that by pressing the temperature regulating subassembly against the chip holding subassembly, heat can be added/removed from the chips by conduction; and thus the temperature of the chips can be regulated accurately. Another benefit which is achieved with this electromechanical apparatus is that by pressing the power converter subassembly against the chip holding subassembly, the distance between the chips that are tested and the power supplies for those chips is made small. Consequently, the chip voltages can easily be kept constant while the chip power dissipation changes rapidly as the chips are tested.

Abstract: An electromechanical apparatus for testing chips includes a pivoting springy mechanism which squeezes a chip holding subassembly between a temperature regulating subassembly and a power converter subassembly. This mechanism is comprised of a first arm that has a first pivotal joint, and a second arm that is coupled by a second pivotal joint to the first arm. An actuator is coupled to the first arm, and the actuator pivots the first arm from an open position to a closed position. In the open position, the angle between the arms is large; and the subassemblies are spaced apart. In the closed position, the angle between the arms is small but variable within a predetermined range; and the subassemblies are pressed together. This range of angles occurs due to various manufacturing tolerances and due to variable length stops that adjust the force with which the temperature regulating subassembly is pressed against the chip holding subassembly.

Abstract: A method of assembling a pressed joint between an integrated circuit module and a temperature regulating unit includes the steps of: 1) providing the integrated circuit module with a contact surface of a first material and providing the temperature regulating unit with a contact surface of a second material; 2) coating the contact surface of the temperature regulating unit with a metal alloy which adheres in a solid state to the second material but not the first material; 3) heating the metal alloy to a slurry/liquid state; and 4) squeezing the slurry/liquid alloy between the contact surfaces on the integrated circuit module and the temperature regulating unit.

Abstract: A mechanical assembly for regulating the temperature of a chip is comprised of a heat exchanger which has a face for mating with a planar surface on the chip. A frame is coupled to the heat exchanger such that the face of the heat exchanger is exposed and can contact the planar surface of the chip. And, the face of the heat exchanger has a shape which makes contact with the entire planar surface on the chip except for each of its corners. One particular embodiment of the heat exchanger has four grooves which extend from the face and which respectively align with the corners of the chip. Due to those grooves, initial contact between the face on the heat exchanger and the planar surface on the chip occurs on an edge of the chip which is spaced-apart from a corner. Consequently, the chance of breaking the tip of a corner off of the chip is reduced.

Abstract: A mechanical assembly for regulating the temperature of an integrated circuit chip is comprised of a frame which has at least two spaced-apart spring supports. Respective leaf springs extend from each of the spring supports towards each other. And, a heat exchanger lies in the space between the spring supports, attaches to all of the leaf springs, and has a face for mating with the chip. With this assembly, the heat exchanger exerts a very small force at its initial point of contact on the chip; the length of the leaf springs do not add to the profile of the assembly; no slippage occurs between the heat exchanger and the chip; and, the leaf springs prevent the heat exchanger from twisting and becoming offset relative to the chip.

Abstract: A mechanical assembly for regulating the temperature of an integrated circuit chip is comprised of a frame which has two spaced-apart spring supports. A single leaf spring extends from one of the spring supports to the other. A heat exchanger contacts the leaf spring at one point, pushes the leaf spring against the spring supports, and has a face for mating with the chip. And, a stop is provided between the heat exchanger and the frame, which keeps the heat exchanger on the leaf spring. With this assembly the heat exchanger exerts a very small force at its initial point of contact on the chip; the length of the single leaf spring does not add to the profile of the assembly; no slippage occurs between the heat exchanger and the chip; and, the stop prevents the heat exchanger from twisting and becoming offset relative to the chip.

Abstract: An electromechanical assembly, having a pressed joint with a low thermal resistance which is residue free when disassembled, includes: 1) an integrated circuit module having a contact surface of a first material; 2) a temperature regulating unit having a contact surface of a second material which faces the contact surface of the first material and which is separated therefrom by a gap; and, 3) a film of a metal alloy, which substantially fills the gap, and which is limited to an alloy that adheres in a solid state to the second material but not the first material. Preferred alloys for filling the gap include combinations of two or more metals which are selected from the group of lead, tin, bismuth, cadmium, indium, and antimony. Preferred first materials for the contact surface on the integrated circuit module to which the alloy does not adhere include silicon dioxide, aluminum nitrite, silicon and ceramic.

Abstract: An electromechanical subassembly is comprised of a carrier having a body with a planar surface and multiple holes that extend from the planar surface into the body. A plurality of springy contacts are held in the holes; and they extend, in an uncompressed state, past the planar surface. The plurality of springy contacts include contacts of a first type which each exert a relatively small opposing force when compressed to the planar surface, and contacts of a second type which each exert a substantially larger opposing force when compressed to the planar surface.

Abstract: An electromechanical module with pressed electrical connections includes the following components: 1) a printed circuit board having a first array of I/O pads; 2) a substrate having a second array of I/O pads that are aligned with and face the first array of I/O pads; 3) compressible electrical contacts which lie between the first and second array of I/O pads; 4) a thin springy plate having a central section which presses against the printed circuit board in line with the first array of I/O pads, and having a springy periphery that extends in a quiescent state away; from the printed circuit board; and 5) a compressing means which compresses the electrical contacts by forcing the substrate towards the printed circuit board while bending the springy periphery of the thin-springy plate towards the substrate. When the plate is in a state where the electrical contacts are fully compressed, the thin-springy plate is relatively flat; and thus, the module has a low profile.

Abstract: An electromechanical module is comprised of an electronic component that is attached to a substrate which is bendable. Multiple springy contacts touch respective I/O pads on the substrate. A compressing mechanism compresses the springy contacts against the I/O pads with forces that bend the substrate. The bending of substrate is reduced by including contacts of a first type, each of which exert a relatively small force against its respective I/O pad; and contacts of a second type, each of which exert a substantially larger force against its respective I/O pad.

Abstract: A temperature control system includes an electro-mechanical subassembly having an enhanced thermal interface, which comprises: an electronic device which has a face that dissipates heat; a heat exchange member which has a face that mates with the heat dissipating face of the electronic device; and, a film of liquid, lying between the mating faces of the heat exchange member and the electronic device, which evaporates without leaving any residue at a temperature that is too low to damage the electronic device. Due to the presence of the liquid film, the thermal resistance between the mating faces of the heat exchange member and the electronic device is reduced by over 1000% from which it otherwise is when film is deleted.

Abstract: A temperature control system comprises: an electric heater that has a first face which contacts an electronic device, and a second face which is opposite the first face; a heat sink, coupled to the second face of the heater, which absorbs heat from the electronic device through the heater's second face; respective temperature sensors coupled to the heater and the heat sink; and an estimator circuit, coupled to the temperature sensors. The estimator circuit estimates the temperature of the electronic device as a function of the sensed heater and heat sink temperatures, and that enables the device temperature to be regulated even through the device does not have a temperature sensor. By electrically controlling just the heater power, heat flow to/from the electronic device is quickly adjusted; and that in turn quickly regulates the device temperature.

Abstract: A temperature control system comprises: an electric heater that has a first face which makes contact with an electronic device, and a second face which is opposite the first face; a heat sink, coupled to the second face of the heater, which absorbs heat from the electronic device through the heater's second face; and a temperature sensor, coupled to the electronic device which senses the device temperature T.sub.d. A control circuit is coupled to the device temperature sensor and to the heater; and it decreases the power to the heater when the sensed temperature of the electronic device is above the set point, and vice-versa. When the heater temperature T.sub.h is less than T.sub.d, then heat flows from the electronic device through the heater to the heat sink; and the rate of heat flow increases as T.sub.d -T.sub.h increases. When T.sub.h is more than T.sub.d, then heat flows to the electronic device from the heater; and the rate of heat flow increases as T.sub.h -T.sub.d increases.