Patents by Inventor Jerry M. Chow

Jerry M. Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11349060
    Abstract: A device includes a first substrate formed of a first material that exhibits a threshold level of thermal conductivity. The threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates. In an embodiment, the device also includes a second substrate disposed in a recess of the first substrate, the second substrate formed of a second material that exhibits a second threshold level of thermal conductivity. The second threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum circuit operates. In an embodiment, at least one qubit is disposed on the second substrate. In an embodiment, the device also includes a transmission line configured to carry a microwave signal between the first substrate and the second substrate.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 31, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Patryk Gumann, Salvatore Bernardo Olivadese, Jerry M. Chow
  • Patent number: 11329356
    Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 10, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Jay M. Gambetta, Jerry M. Chow
  • Patent number: 11289637
    Abstract: A qubit includes a substrate, and a first capacitor structure having a lower portion formed on a surface of the substrate and at least one first raised portion extending above the surface of the substrate. The qubit further includes a second capacitor structure having a lower portion formed on the surface of the substrate and at least one second raised portion extending above the surface of the substrate. The first capacitor structure and the second capacitor structure are formed of a superconducting material. The qubit further includes a junction between the first capacitor structure and the second capacitor structure. The junction is disposed at a predetermined distance from the surface of the substrate and has a first end in contact with the first raised portion and a second end in contact with the second raised portion.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: March 29, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Jerry M. Chow, Hanhee Paik
  • Publication number: 20220059749
    Abstract: Lattice arrangements for quantum qubits are described. A lattice arrangement can comprise adjacent structures having vertices connected by edges. The qubits can be positioned on the vertices. A qubit in the lattice arrangement directly connects to not more than three other qubits, or connects to another qubit via a coupling qubit on an edge between two qubits on a vertex. The adjacent structures can comprise hexagons, dodecagons or octagons. A superconducting qubit lattice can comprise superconducting target qubits and superconducting control qubits. The superconducting qubit lattice can comprise adjacent structures having vertices connected by edges, with target qubits positioned on the vertices and control qubits positioned on the edges. Logic operations between adjacent superconducting target and control qubits can be implemented by driving the superconducting control qubit at or near the frequency of the superconducting target qubit.
    Type: Application
    Filed: November 1, 2021
    Publication date: February 24, 2022
    Inventors: Jerry M. Chow, Easwar Magesan, Matthias Steffen, Jay M. Gambetta, Maika Takita
  • Patent number: 11244241
    Abstract: Devices and/or computer-implemented methods to facilitate a cross-resonance operation in a dispersive regime of a qubit frequency space are provided. According to an embodiment, a device can comprise a first qubit having a first operating frequency and a first anharmonicity. The device can further comprise a second qubit that couples to the first qubit to perform a cross-resonance operation. The second qubit having a second operating frequency and a second anharmonicity. A detuning between the first operating frequency and the second operating frequency is larger than the first anharmonicity and the second anharmonicity.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: February 8, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jay Michael Gambetta, Jerry M. Chow, Easwar Magesan, Abhinav Kandala, Zlatko K. Minev
  • Publication number: 20220021096
    Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.
    Type: Application
    Filed: December 21, 2020
    Publication date: January 20, 2022
    Applicant: International Business Machines Corporation
    Inventors: SALVATORE B. OLIVADESE, PATRYK GUMANN, JERRY M. CHOW
  • Patent number: 11227229
    Abstract: A quantum computing device is formed using a first chip and a second chip, the first chip having a first substrate, a first set of pads, and a set of Josephson junctions disposed on the first substrate. The second chip has a second substrate, a second set of pads disposed on the second substrate opposite the first set of pads, and a second layer formed on a subset of the second set of pads. The second layer is configured to bond the first chip and the second chip. The subset of the second set of pads corresponds to a subset of the set of Josephson junctions selected to avoid frequency collision between qubits in a set of qubits. A qubit is formed using a Josephson junction from the subset of Josephson junctions and another Josephson junction not in the subset being rendered unusable for forming qubits.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: January 18, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Sami Rosenblatt
  • Patent number: 11195773
    Abstract: In an embodiment, a quantum device includes an interposer layer comprising a set of vias. In an embodiment, the quantum device includes a dielectric layer formed on a first side of the interposer, the dielectric layer including a set of transmission lines communicatively coupled to the set of vias. In an embodiment, the quantum device includes a plurality of qubit chips coupled to an opposite side of the interposer layer, each qubit chip of the plurality of qubit chips including: a plurality of qubits on a first side of the qubit chip and a plurality of protrusions on a second side of the qubit chip. In an embodiment, the quantum device includes a heat sink thermally coupled with the plurality of qubit chips, the heat sink comprising a plurality of recesses aligned with the plurality of protrusions of the plurality of qubit chips.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: December 7, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jae-Woong Nah, Hanhee Paik, Jerry M. Chow
  • Patent number: 11189435
    Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a switch device that shifts frequency of a resonator in a quantum device are provided. According to an embodiment, a device can comprise a readout resonator coupled to a qubit. The device can further comprise a switch device formed across the readout resonator that shifts frequency of the readout resonator based on position of the switch device. According to another embodiment, a device can comprise a bus resonator coupled to a plurality of qubits. The device can further comprise a switch device formed across the bus resonator that shifts frequency of the bus resonator based on position of the switch device.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: November 30, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Firat Solgun, Jerry M. Chow
  • Patent number: 11170317
    Abstract: In a system including a cross-resonance gate having a superconducting control qubit and having a superconducting target qubit coupled through a bus resonator, echo pulses are generated at a first frequency and directed to the control qubit, wherein the first frequency is on resonance with the control qubit. Cross-resonance pulses are generated at a second frequency on resonance with the target qubit and applied to the control qubit, wherein the generating and applying the cross-resonance pulses induce rotations on the target qubit through an interaction that is mediated by the bus resonator. Cancellation pulses are generated at the second frequency and applied to the target qubit. Sets of Hamiltonian tomographies may be measured to determine appropriate amplitudes and phases of the cross-resonance and cancellation pulses.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: November 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Jerry M. Chow, Jay M. Gambetta, Easwar Magesan, Sarah E. Sheldon
  • Patent number: 11165009
    Abstract: Lattice arrangements for quantum qubits are described. A lattice arrangement can comprise adjacent structures having vertices connected by edges. The qubits can be positioned on the vertices. A qubit in the lattice arrangement directly connects to not more than three other qubits, or connects to another qubit via a coupling qubit on an edge between two qubits on a vertex. The adjacent structures can comprise hexagons, dodecagons or octagons. A superconducting qubit lattice can comprise superconducting target qubits and superconducting control qubits. The superconducting qubit lattice can comprise adjacent structures having vertices connected by edges, with target qubits positioned on the vertices and control qubits positioned on the edges. Logic operations between adjacent superconducting target and control qubits can be implemented by driving the superconducting control qubit at or near the frequency of the superconducting target qubit.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: November 2, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Easwar Magesan, Matthias Steffen, Jay M. Gambetta, Maika Takita
  • Publication number: 20210234085
    Abstract: A method for adjusting a resonance frequency of a qubit in a quantum mechanical device includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit comprising capacitor pads; and removing substrate material from the backside of the substrate at an area opposite the at least one qubit to alter a capacitance around the at least one qubit so as to adjust a resonance frequency of the at least one qubit.
    Type: Application
    Filed: January 24, 2020
    Publication date: July 29, 2021
    Inventors: Douglas M. Gill, Martin O. Sandberg, Vivekananda P. Adiga, Jason S. Orcutt, Jerry M. CHOW
  • Publication number: 20210175026
    Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a switch device that shifts frequency of a resonator in a quantum device are provided. According to an embodiment, a device can comprise a readout resonator coupled to a qubit. The device can further comprise a switch device formed across the readout resonator that shifts frequency of the readout resonator based on position of the switch device. According to another embodiment, a device can comprise a bus resonator coupled to a plurality of qubits. The device can further comprise a switch device formed across the bus resonator that shifts frequency of the bus resonator based on position of the switch device.
    Type: Application
    Filed: December 10, 2019
    Publication date: June 10, 2021
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Firat Solgun, Jerry M. Chow
  • Patent number: 11004896
    Abstract: According to an embodiment of the present invention, a system for non-invasively characterizing a qubit device includes a characterization probe chip. The characterization probe chip includes a substrate and a characterization resonator formed on a first surface of the substrate. The characterization resonator includes a superconducting stripline, and a superconducting antenna coupled to an end of the superconducting stripline, the superconducting antenna positioned to align with a qubit on the qubit device being characterized. The characterization probe chip also includes and a superconducting ground plane formed on a second surface of the substrate, the second surface opposing the first surface. In operation, the superconducting antenna is configured to capacitively couple the characterization resonator to the qubit aligned with the superconducting antenna for characterization of the qubit.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: May 11, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Hanhee Paik, Jerry M. Chow
  • Publication number: 20210134880
    Abstract: According to an embodiment of the present invention, a system for non-invasively characterizing a qubit device includes a characterization probe chip. The characterization probe chip includes a substrate and a characterization resonator formed on a first surface of the substrate. The characterization resonator includes a superconducting stripline, and a superconducting antenna coupled to an end of the superconducting stripline, the superconducting antenna positioned to align with a qubit on the qubit device being characterized. The characterization probe chip also includes and a superconducting ground plane formed on a second surface of the substrate, the second surface opposing the first surface. In operation, the superconducting antenna is configured to capacitively couple the characterization resonator to the qubit aligned with the superconducting antenna for characterization of the qubit.
    Type: Application
    Filed: November 6, 2019
    Publication date: May 6, 2021
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Hanhee Paik, Jerry M. Chow
  • Publication number: 20210119313
    Abstract: The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Salvatore Bernardo Olivadese, Patryk Gumann, Jay M. Gambetta, Jerry M. Chow
  • Publication number: 20210119104
    Abstract: Techniques for forming quantum circuits, including connections between components of quantum circuits, are presented. A trench can be formed in a dielectric material, by removing a portion of the dielectric material and a portion of conductive material layered on top of the dielectric material, to enable creation of circuit components of a circuit. The trench can define a regular nub or compensated nub to facilitate creating electrical leads connected to the circuit components on a nub. The compensated nub can comprise recessed regions to facilitate depositing material during evaporation to form the leads. For compensated nub implementation, material can be evaporated in two directions, with oxidation performed in between such evaporations, to contact leads and form a Josephson junction. For regular nub implementation, material can be evaporated in four directions, with oxidation performed in between the third and fourth evaporations, to contact leads and form a Josephson junction.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Inventors: Vivekananda P. Adiga, Martin O. Sandberg, Jerry M. Chow
  • Publication number: 20210111471
    Abstract: A microstrip that is usable in a quantum application (q-microstrip) includes a ground plane, a polyimide film disposed over the ground plane at a first surface of the polyimide film, and a conductor formed on a second side of the polyimide film such that the first surface is substantially opposite to the second surface. A material of the conductor provides greater than a threshold thermal conductivity (TH) with a structure of a dilution fridge stage (stage).
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Applicant: International Business Machines Corporation
    Inventors: SALVATORE B. OLIVADESE, PATRYK GUMANN, JERRY M. CHOW
  • Publication number: 20210111329
    Abstract: A quantum computing device is formed using a first chip and a second chip, the first chip having a first substrate, a first set of pads, and a set of Josephson junctions disposed on the first substrate. The second chip has a second substrate, a second set of pads disposed on the second substrate opposite the first set of pads, and a second layer formed on a subset of the second set of pads. The second layer is configured to bond the first chip and the second chip. The subset of the second set of pads corresponds to a subset of the set of Josephson junctions selected to avoid frequency collision between qubits in a set of qubits. A qubit is formed using a Josephson junction from the subset of Josephson junctions and another Josephson junction not in the subset being rendered unusable for forming qubits.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Applicant: International Business Machines Corporation
    Inventors: Jerry M. Chow, Sami Rosenblatt
  • Patent number: 10978769
    Abstract: A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: April 13, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Salvatore B. Olivadese, Patryk Gumann, Jerry M. Chow