Patents by Inventor Jesse Jones
Jesse Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240095672Abstract: An analysis of the scans is performed to determine whether the selected item was moved from the back room to the shelf, then returned from the shelf to the back room. The analysis also determines a re-bin time when the selected product was returned to the back room. An adjustment to the PI is blocked when last PI adjustment time is later than the re-bin time. An adjustment to the PI is also blocked when an audit indicator is received at the interface indicating that the retail store is under an audit. An adjusted PI value is determined when the analysis indicates that the selected item was moved from the back room to the shelf, then returned from the shelf, the adjusted PI value being at least one more than the shelf capacity value.Type: ApplicationFiled: November 29, 2023Publication date: March 21, 2024Inventors: Greg A. Bryan, Cristy C. Brooks, David Blair Brightwell, Benjamin D. Enssle, Matthew A. Jones, Jesse L. Eaton
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Publication number: 20240088052Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG, Dingying XU, Rahul MANEPALLI, Sameer PAITAL, Kristof DARMAWIKARTA, Yonggang LI, Meizi JIAO, Chong ZHANG, Matthew TINGEY, Jung Kyu HAN, Haobo CHEN
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Patent number: 11929330Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.Type: GrantFiled: April 4, 2022Date of Patent: March 12, 2024Assignee: Intel CorporationInventors: Kristof Darmawikarta, Hiroki Tanaka, Robert May, Sameer Paital, Bai Nie, Jesse Jones, Chung Kwang Christopher Tan
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Patent number: 11927455Abstract: The present disclosure is directed toward systems and methods for an augmented reality transportation system. For example, the systems and methods described herein present an augmented reality environment for a driver or a passenger including augmented reality elements to mark specific locations within a display of real-world surroundings. Additionally, the systems and methods described herein analyze historical information to determine placements for augmented reality elements. The systems and methods also enable a user to share an augmented reality or virtual reality environment with another user.Type: GrantFiled: September 1, 2021Date of Patent: March 12, 2024Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Martin Conte MacDonell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, Jr., Mark David Teater
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Patent number: 11923312Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: GrantFiled: March 27, 2019Date of Patent: March 5, 2024Assignee: Intel CorporationInventors: Bai Nie, Gang Duan, Srinivas Pietambaram, Jesse Jones, Yosuke Kanaoka, Hongxia Feng, Dingying Xu, Rahul Manepalli, Sameer Paital, Kristof Darmawikarta, Yonggang Li, Meizi Jiao, Chong Zhang, Matthew Tingey, Jung Kyu Han, Haobo Chen
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Publication number: 20220223527Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.Type: ApplicationFiled: April 4, 2022Publication date: July 14, 2022Inventors: Kristof DARMAWIKARTA, Hiroki TANAKA, Robert MAY, Sameer PAITAL, Bai NIE, Jesse JONES, Chung Kwang Christopher TAN
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Patent number: 11322444Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.Type: GrantFiled: March 23, 2018Date of Patent: May 3, 2022Assignee: Intel CorporationInventors: Kristof Darmawikarta, Hiroki Tanaka, Robert May, Sameer Paital, Bai Nie, Jesse Jones, Chung Kwang Christopher Tan
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Publication number: 20210396539Abstract: The present disclosure is directed toward systems and methods for an augmented reality transportation system. For example, the systems and methods described herein present an augmented reality environment for a driver or a passenger including augmented reality elements to mark specific locations within a display of real-world surroundings. Additionally, the systems and methods described herein analyze historical information to determine placements for augmented reality elements. The systems and methods also enable a user to share an augmented reality or virtual reality environment with another user.Type: ApplicationFiled: September 1, 2021Publication date: December 23, 2021Inventors: Ethan Duncan Eyler, Martin Conte Mac Donell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, JR., Mark David Teater
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Patent number: 11118930Abstract: The present disclosure is directed toward systems and methods for an augmented reality transportation system. For example, the systems and methods described herein present an augmented reality environment for a driver or a passenger including augmented reality elements to mark specific locations within a display of real-world surroundings. Additionally, the systems and methods described herein analyze historical information to determine placements for augmented reality elements. The systems and methods also enable a user to share an augmented reality or virtual reality environment with another user.Type: GrantFiled: July 14, 2017Date of Patent: September 14, 2021Assignee: LYFT, INC.Inventors: Ethan Duncan Eyler, Martin Conte MacDonell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, Jr., Mark David Teater
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Patent number: 10991159Abstract: The present disclosure is directed toward systems and methods for a virtual reality transportation system. In particular, the systems and methods described herein present a virtual reality experience including a virtual environment for display to a passenger including virtual inertial interactions that correspond to real-world inertial forces that a passenger experiences while riding in a vehicle. Additionally, the systems and methods described herein analyze historical sensory data to predict inertial forces that the passenger will experience while riding in the vehicle. The systems and methods also generate a virtual sensory view for display to a passenger to represent what an autonomous transportation vehicle sees by way of a sensor suite used for navigation.Type: GrantFiled: July 6, 2020Date of Patent: April 27, 2021Assignee: LYFT, INC.Inventors: Ethan Duncan Eyler, Martin Conte MacDonell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, Jr., Mark David Teater
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Publication number: 20200364931Abstract: The present disclosure is directed toward systems and methods for a virtual reality transportation system. In particular, the systems and methods described herein present a virtual reality experience including a virtual environment for display to a passenger including virtual inertial interactions that correspond to real-world inertial forces that a passenger experiences while riding in a vehicle. Additionally, the systems and methods described herein analyze historical sensory data to predict inertial forces that the passenger will experience while riding in the vehicle. The systems and methods also generate a virtual sensory view for display to a passenger to represent what an autonomous transportation vehicle sees by way of a sensor suite used for navigation.Type: ApplicationFiled: July 6, 2020Publication date: November 19, 2020Inventors: Ethan Duncan Eyler, Martin Conte Mac Donell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, JR., Mark David Teater
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Publication number: 20200320656Abstract: Embodiments provide techniques, including systems and methods, for identifying and matching requestors and providers. For example, embodiments can display an identification pattern that is unique for a matched requestor and provider to allow the providers and requestors to quickly, easily, and accurately validate one another's identities prior to a service being provided. In some embodiments, the identification element may be presented on a provider communication device to clearly display graphics associated with an identification element to all requestors in an area so that the requestors may easily identify a matched provider.Type: ApplicationFiled: April 17, 2020Publication date: October 8, 2020Inventors: Ethan Duncan Eyler, Taggart Matthiesen, Martin Conte Mac Donell, Jesse Jones McMillin, Sebastian Rolf Johan Brannstrom, Christopher Kuh, Sang Ik Lee, Nicholas Robert Barrett, Sean Patrick Murphy, Edward Stephen Lowe
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Publication number: 20200312771Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: ApplicationFiled: March 27, 2019Publication date: October 1, 2020Inventors: Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG, Dingying XU, Rahul MANEPALLI, Sameer PAITAL, Kristof DARMAWIKARTA, Yonggang LI, Meizi JIAO, Chong ZHANG, Matthew TINGEY, Jung Kyu HAN, Haobo CHEN
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Patent number: 10706620Abstract: The present disclosure is directed toward systems and methods for a virtual reality transportation system. In particular, the systems and methods described herein present a virtual reality experience including a virtual environment for display to a passenger including virtual inertial interactions that correspond to real-world inertial forces that a passenger experiences while riding in a vehicle. Additionally, the systems and methods described herein analyze historical sensory data to predict inertial forces that the passenger will experience while riding in the vehicle. The systems and methods also generate a virtual sensory view for display to a passenger to represent what an autonomous transportation vehicle sees by way of a sensor suite used for navigation.Type: GrantFiled: July 15, 2019Date of Patent: July 7, 2020Assignee: LYFT, INC.Inventors: Ethan Duncan Eyler, Martin Conte MacDonell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, Mark David Teater
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Patent number: D894049Type: GrantFiled: February 10, 2019Date of Patent: August 25, 2020Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Alejandro Salvador Garcia, Peter Rex Luedtke, Jesse Jones McMillin, Rasmus Breitholtz, Stijn Jagers, Sang Ik Lee, Zachary London, Victoria Slaker
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Patent number: D894050Type: GrantFiled: February 10, 2019Date of Patent: August 25, 2020Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Alejandro Salvador Garcia, Peter Rex Luedtke, Jesse Jones McMillin, Rasmus Breitholtz, Stijn Jagers, Sang Ik Lee, Zachary London, Victoria Slaker
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Patent number: D921120Type: GrantFiled: November 12, 2019Date of Patent: June 1, 2021Assignee: Lyft, Inc.Inventors: Steven James Martisauskas, Carlos Ellis Whitt, Jisi Guo, Jesse Jones McMillin, Rasmus Breitholtz, Sang Ik Lee
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Patent number: D946471Type: GrantFiled: August 24, 2020Date of Patent: March 22, 2022Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Alejandro Salvador Garcia, Peter Rex Luedtke, Jesse Jones McMillin, Rasmus Breitholtz, Stijn Jagers, Sang Ik Lee, Zachary London, Victoria Slaker
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Patent number: D946472Type: GrantFiled: August 24, 2020Date of Patent: March 22, 2022Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Alejandro Salvador Garcia, Peter Rex Luedtke, Jesse Jones McMillin, Rasmus Breitholtz, Stijn Jagers, Sang Ik Lee, Zachary London, Victoria Slaker
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Patent number: D967266Type: GrantFiled: November 19, 2019Date of Patent: October 18, 2022Assignee: Lyft, Inc.Inventors: Jesse Jones McMillin, Ethan Duncan Eyler, Sang Ik Lee, Christopher Kuh, Nicholas Robert Barrett, Sean Patrick Murphy