Patents by Inventor Jesse Jones
Jesse Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12271864Abstract: An electronic indication of a nil pick is received. Item information associated with the desired product, sales data concerning the desired product, supply chain information associated with the desired product, and a perpetual inventory (PI) value of the desired product are stored. An adjustment to the PI of the desired product is blocked when a predetermined event occurs at the retail store, or when information that contradicts the validity of the nil pick is received from the retail store. When the adjustment to the PI of the desired product is not blocked, an amount of the adjustment is determined based upon one or more of: the item information associated with the product, the sales data concerning the product, and the supply chain information associated with the desired product.Type: GrantFiled: October 12, 2023Date of Patent: April 8, 2025Assignee: Walmart Apollo, LLCInventors: Greg A. Bryan, Cristy C. Brooks, David Blair Brightwell, Benjamin D. Enssle, Matthew A. Jones, Jesse L. Eaton
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Publication number: 20250112136Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Inventors: Bohan SHAN, Jesse JONES, Zhixin XIE, Bai NIE, Shaojiang CHEN, Joshua STACEY, Mitchell PAGE, Brandon C. MARIN, Jeremy D. ECTON, Nicholas S. HAEHN, Astitva TRIPATHI, Yuqin LI, Edvin CETEGEN, Jason M. GAMBA, Jacob VEHONSKY, Jianyong MO, Makoyi WATSON, Shripad GOKHALE, Mine KAYA, Kartik SRINIVASAN, Haobo CHEN, Ziyin LIN, Kyle ARRINGTON, Jose WAIMIN, Ryan CARRAZZONE, Hongxia FENG, Srinivas Venkata Ramanuja PIETAMBARAM, Gang DUAN, Dingying David XU, Hiroki TANAKA, Ashay DANI, Praveen SREERAMAGIRI, Yi LI, Ibrahim EL KHATIB, Aaron GARELICK, Robin MCREE, Hassan AJAMI, Yekan WANG, Andrew JIMENEZ, Jung Kyu HAN, Hanyu SONG, Yonggang Yong LI, Mahdi MOHAMMADIGHALENI, Whitney BRYKS, Shuqi LAI, Jieying KONG, Thomas HEATON, Dilan SENEVIRATNE, Yiqun BAI, Bin MU, Mohit GUPTA, Xiaoying GUO
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Publication number: 20250112140Abstract: Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a core with a first width, and the core comprises a glass layer. In an embodiment, a via is provided through a thickness of the core, where the via is electrically conductive. In an embodiment, a first layer is provided over the core, where the first layer comprises a second width that is smaller than the first width. In an embodiment, a second layer is provided under the core, where the second layer comprises a third width that is smaller than the first width.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Inventors: Rahul BHURE, Mitchell PAGE, Joseph PEOPLES, Jieying KONG, Nicholas S. HAEHN, Astitva TRIPATHI, Bainye Francoise ANGOUA, Yosef KORNBLUTH, Daniel ROSALES-YEOMANS, Joshua STACEY, Aaditya Anand CANDADAI, Yonggang Yong LI, Tchefor NDUKUM, Scott COATNEY, Gang DUAN, Jesse JONES, Srinivas Venkata Ramanuja PIETAMBARAM, Dilan SENEVIRATNE, Matthew ANDERSON
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Publication number: 20250105119Abstract: Embodiments disclosed herein include glass cores with vias that are lined by a self-healing liner. In an embodiment, an apparatus comprises a substrate that comprises a solid glass layer with an opening through a thickness of the substrate. In an embodiment, a liner is in contact with a sidewall of the opening, where the liner comprises a polymer matrix with capsules distributed through the polymer matrix. In an embodiment, each capsule comprises a shell, and a core within the shell. In an embodiment, the core comprises an organic material. In an embodiment, a via is in the opening and in contact with the liner, and the via is electrically conductive.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Inventors: Yuqin LI, Jesse JONES, Sandrine LTEIF, Srinivas V. PIETAMBARAM, Suresh Tanaji NARUTE, Pramod MALATKAR, Gang DUAN, Khaled AHMED
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Publication number: 20240331075Abstract: Embodiments provide techniques, including systems and methods, for identifying and matching requestors and providers. For example, embodiments can display an identification pattern that is unique for a matched requestor and provider to allow the providers and requestors to quickly, easily, and accurately validate one another's identities prior to a service being provided. In some embodiments, the identification element may be presented on a provider communication device to clearly display graphics associated with an identification element to all requestors in an area so that the requestors may easily identify a matched provider.Type: ApplicationFiled: June 10, 2024Publication date: October 3, 2024Inventors: Ethan Duncan Eyler, Taggart Matthiesen, Martin Conte Mac Donell, Jesse Jones McMillin, Sebastian Rolf Johan Brannstrom, Christopher Kuh, Sang Ik Lee, Nicholas Robert Barrett, Sean Patrick Murphy, Edward Stephen Lowe
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Publication number: 20240243066Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.Type: ApplicationFiled: March 29, 2024Publication date: July 18, 2024Inventors: Kristof DARMAWIKARTA, Hiroki TANAKA, Robert MAY, Sameer PAITAL, Bai NIE, Jesse JONES, Chung Kwang Christopher TAN
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Patent number: 12020341Abstract: Embodiments provide techniques, including systems and methods, for identifying and matching requestors and providers. For example, embodiments can display an identification pattern that is unique for a matched requestor and provider to allow the providers and requestors to quickly, easily, and accurately validate one another's identities prior to a service being provided. In some embodiments, the identification element may be presented on a provider communication device to clearly display graphics associated with an identification element to all requestors in an area so that the requestors may easily identify a matched provider.Type: GrantFiled: April 17, 2020Date of Patent: June 25, 2024Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Taggart Matthiesen, Martin Conte MacDonell, Jesse Jones McMillin, Sebastian Rolf Johan Brannstrom, Christopher Kuh, Sang Ik Lee, Nicholas Robert Barrett, Sean Patrick Murphy, Edward Stephen Lowe
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Publication number: 20240200963Abstract: The present disclosure is directed toward systems and methods for an augmented reality transportation system. For example, the systems and methods described herein present an augmented reality environment for a driver or a passenger including augmented reality elements to mark specific locations within a display of real-world surroundings. Additionally, the systems and methods described herein analyze historical information to determine placements for augmented reality elements. The systems and methods also enable a user to share an augmented reality or virtual reality environment with another user.Type: ApplicationFiled: March 5, 2024Publication date: June 20, 2024Inventors: Ethan Duncan Eyler, Martin Conte Mac Donell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson Jr., Mark David Teater
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Publication number: 20240178145Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.Type: ApplicationFiled: February 6, 2024Publication date: May 30, 2024Inventors: Kristof DARMAWIKARTA, Hiroki TANAKA, Robert MAY, Sameer PAITAL, Bai NIE, Jesse JONES, Chung Kwang Christopher TAN
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Publication number: 20240088052Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG, Dingying XU, Rahul MANEPALLI, Sameer PAITAL, Kristof DARMAWIKARTA, Yonggang LI, Meizi JIAO, Chong ZHANG, Matthew TINGEY, Jung Kyu HAN, Haobo CHEN
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Patent number: 11929330Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.Type: GrantFiled: April 4, 2022Date of Patent: March 12, 2024Assignee: Intel CorporationInventors: Kristof Darmawikarta, Hiroki Tanaka, Robert May, Sameer Paital, Bai Nie, Jesse Jones, Chung Kwang Christopher Tan
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Patent number: 11927455Abstract: The present disclosure is directed toward systems and methods for an augmented reality transportation system. For example, the systems and methods described herein present an augmented reality environment for a driver or a passenger including augmented reality elements to mark specific locations within a display of real-world surroundings. Additionally, the systems and methods described herein analyze historical information to determine placements for augmented reality elements. The systems and methods also enable a user to share an augmented reality or virtual reality environment with another user.Type: GrantFiled: September 1, 2021Date of Patent: March 12, 2024Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Martin Conte MacDonell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, Jr., Mark David Teater
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Patent number: 11923312Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: GrantFiled: March 27, 2019Date of Patent: March 5, 2024Assignee: Intel CorporationInventors: Bai Nie, Gang Duan, Srinivas Pietambaram, Jesse Jones, Yosuke Kanaoka, Hongxia Feng, Dingying Xu, Rahul Manepalli, Sameer Paital, Kristof Darmawikarta, Yonggang Li, Meizi Jiao, Chong Zhang, Matthew Tingey, Jung Kyu Han, Haobo Chen
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Publication number: 20220223527Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.Type: ApplicationFiled: April 4, 2022Publication date: July 14, 2022Inventors: Kristof DARMAWIKARTA, Hiroki TANAKA, Robert MAY, Sameer PAITAL, Bai NIE, Jesse JONES, Chung Kwang Christopher TAN
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Patent number: 11322444Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.Type: GrantFiled: March 23, 2018Date of Patent: May 3, 2022Assignee: Intel CorporationInventors: Kristof Darmawikarta, Hiroki Tanaka, Robert May, Sameer Paital, Bai Nie, Jesse Jones, Chung Kwang Christopher Tan
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Publication number: 20210396539Abstract: The present disclosure is directed toward systems and methods for an augmented reality transportation system. For example, the systems and methods described herein present an augmented reality environment for a driver or a passenger including augmented reality elements to mark specific locations within a display of real-world surroundings. Additionally, the systems and methods described herein analyze historical information to determine placements for augmented reality elements. The systems and methods also enable a user to share an augmented reality or virtual reality environment with another user.Type: ApplicationFiled: September 1, 2021Publication date: December 23, 2021Inventors: Ethan Duncan Eyler, Martin Conte Mac Donell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, JR., Mark David Teater
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Patent number: 11118930Abstract: The present disclosure is directed toward systems and methods for an augmented reality transportation system. For example, the systems and methods described herein present an augmented reality environment for a driver or a passenger including augmented reality elements to mark specific locations within a display of real-world surroundings. Additionally, the systems and methods described herein analyze historical information to determine placements for augmented reality elements. The systems and methods also enable a user to share an augmented reality or virtual reality environment with another user.Type: GrantFiled: July 14, 2017Date of Patent: September 14, 2021Assignee: LYFT, INC.Inventors: Ethan Duncan Eyler, Martin Conte MacDonell, Taggart Matthiesen, Jesse Jones McMillin, Robert Earl Rasmusson, Jr., Mark David Teater
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Patent number: D946471Type: GrantFiled: August 24, 2020Date of Patent: March 22, 2022Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Alejandro Salvador Garcia, Peter Rex Luedtke, Jesse Jones McMillin, Rasmus Breitholtz, Stijn Jagers, Sang Ik Lee, Zachary London, Victoria Slaker
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Patent number: D946472Type: GrantFiled: August 24, 2020Date of Patent: March 22, 2022Assignee: Lyft, Inc.Inventors: Ethan Duncan Eyler, Alejandro Salvador Garcia, Peter Rex Luedtke, Jesse Jones McMillin, Rasmus Breitholtz, Stijn Jagers, Sang Ik Lee, Zachary London, Victoria Slaker
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Patent number: D967266Type: GrantFiled: November 19, 2019Date of Patent: October 18, 2022Assignee: Lyft, Inc.Inventors: Jesse Jones McMillin, Ethan Duncan Eyler, Sang Ik Lee, Christopher Kuh, Nicholas Robert Barrett, Sean Patrick Murphy
