Abstract: The present disclosure describes a semiconductor wafer testing environment for routing signals used for testing integrated circuits formed onto a semiconductor wafer. The semiconductor wafer testing environment includes a semiconductor wafer tester to control overall operation and/or configuration of the semiconductor wafer testing environment and a semiconductor wafer prober to test the integrated circuits formed onto the semiconductor wafer. The semiconductor wafer prober includes a probe card having a transmission line coupler formed onto a flexible substrate. The transmission line coupler includes multiple transmission line coupling blocks that extend radially from a central point of the flexible substrate in a circular manner.

Abstract: An electronic device includes circuitry configured to determine an antenna operation mode for one or more antenna arrays. The circuitry is further configured to control the one or more antenna arrays to operate in a combined antenna mode via a Wilkinson combiner. The circuitry is also configured to control the one or more antenna arrays to operate in an isolated antenna mode via a single-pole, multi-throw switch.

Abstract: The present disclosure describes a semiconductor wafer testing environment for routing signals used for testing integrated circuits formed onto a semiconductor wafer. The semiconductor wafer testing environment includes a semiconductor wafer tester to control overall operation and/or configuration of the semiconductor wafer testing environment and a semiconductor wafer prober to test the integrated circuits formed onto the semiconductor wafer. The semiconductor wafer prober includes a probe card having a transmission line coupler formed onto a flexible substrate. The transmission line coupler includes multiple transmission line coupling blocks that extend radially from a central point of the flexible substrate in a circular manner.

Abstract: An electronic device includes circuitry configured to determine an antenna operation mode for one or more antenna arrays. The circuitry is further configured to control the one or more antenna arrays to operate in a combined antenna mode via a Wilkinson combiner. The circuitry is also configured to control the one or more antenna arrays to operate in an isolated antenna mode via a single-pole, multi-throw switch.

Abstract: A dongle transceiver a substrate, a transceiver circuit, a transmit/receive switch, a MIMO antenna structure, and a decoupling module. The transceiver circuit is on at least one of the first and second sides of the substrate and is coupled to the transmit/receive switch. The MIMO antenna structure is on at least one of the first and second sides of the substrate. The decoupling module is on at least one of the first and second sides of the substrate, couples the MIMO antenna structure to the transmit/receive switch, and electrically isolates antennas of the MIMO antenna structure.

Abstract: Embodiments described herein provide enhanced integrated circuit (IC) devices. In an embodiment, an IC device includes a substrate, an IC die coupled to a surface of the substrate, a first wirelessly enabled functional block located, on the IC die, the first wirelessly enabled functional block being configured to wirelessly communicate with a second wirelessly enabled functional block located on the substrate, and a ground ring configured to provide electromagnetic shielding for the first and second wirelessly enabled functional blocks.

Abstract: A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.

Abstract: A receiver includes an antenna array, an angular positioning module, a low noise amplifier module, and a down conversion module. The antenna array is operable to receive an inbound wireless signal. The angular positioning module is operable to: receive a plurality of received inbound wireless signals from the antenna array. An angular position of a source of the inbound wireless signal is determined from at least some of the plurality of received inbound wireless signals based on a first radiation pattern and a second radiation pattern of the plurality of received inbound wireless signals; and output a representation of the inbound wireless signal. The low noise amplifier module is operably coupled to amplify the representation of the inbound wireless signal to produce an amplified inbound wireless signal. The down conversion module is operably coupled to convert the amplified inbound wireless signal into a baseband or near baseband signal.

Abstract: Embodiments described herein provide enhanced integrated circuit (IC) devices. In an embodiment, an IC device includes a substrate, an IC die coupled to a surface of the substrate, a first wirelessly enabled functional block located, on the IC die, the first wirelessly enabled functional block being configured to wirelessly communicate with a second wirelessly enabled functional block located on the substrate, and a ground ring configured to provide electromagnetic shielding for the first and second wirelessly enabled functional blocks.

Abstract: Methods and systems for estimating an angle of arrival are provided. In an embodiment, a system for estimating angle of arrival includes a snapshot determining module configured to receive a signal from each antenna of an antenna array and to generate a snapshot vector including values based on the signals and an angle of arrival processing module configured to estimate an angle of arrival for the electromagnetic signal relative to the antenna array based on the snapshot vector. Each signal is representative of an electromagnetic signal incident on a respective antenna of the antenna array and each value is representative of a phase of a respective signal.

Abstract: A receiver includes an antenna array, an angular positioning module, a low noise amplifier module, and a down conversion module. The antenna array is operable to receive an inbound wireless signal. The angular positioning module is operable to: receive a plurality of received inbound wireless signals from the antenna array. An angular position of a source of the inbound wireless signal is determined from at least some of the plurality of received inbound wireless signals based on a first radiation pattern and a second radiation pattern of the plurality of received inbound wireless signals; and output a representation of the inbound wireless signal. The low noise amplifier module is operably coupled to amplify the representation of the inbound wireless signal to produce an amplified inbound wireless signal. The down conversion module is operably coupled to convert the amplified inbound wireless signal into a baseband or near baseband signal.

Abstract: A receiver includes an antenna array, an angular positioning module, a low noise amplifier module, and a down conversion module. The antenna array is operable to receive an inbound wireless signal. The angular positioning module is operable to: receive a plurality of received inbound wireless signals from the antenna array; determine angular position of a source of the inbound wireless signal from at least some of the plurality of received inbound wireless signals based on a first radiation pattern and a second radiation pattern of the plurality of received inbound wireless signals; and output a representation of the inbound wireless signal. The low noise amplifier module is operably coupled to amplify the representation of the inbound wireless signal to produce an amplified inbound wireless signal. The down conversion module is operably coupled to convert the amplified inbound wireless signal into a baseband or near baseband signal.

Abstract: Embodiments described herein provide enhanced integrated circuit (IC) devices. In an embodiment, an IC device includes a substrate, an IC die coupled to a surface of the substrate, a first wirelessly enabled functional block located, on the IC die, the first wirelessly enabled functional block being configured to wirelessly communicate with a second wirelessly enabled functional block located on the substrate, and a ground ring configured to provide electromagnetic shielding for the first and second wirelessly enabled functional blocks.

Abstract: A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.

Abstract: An integrated circuit (IC) device arrangement includes a substrate, an IC die coupled to the substrate, an antenna coupled to the IC die, and a first wirelessly enabled functional block coupled to the IC die. The wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block coupled to the substrate. The antenna is configured to communicate with another antenna coupled to another device.

Abstract: A transceiver is provided for wireless communication. The transceiver can include a bias source, a transformer including a primary side and a secondary side, and a switching device. During a receive mode, the primary side of the transformer is configured to receive a first signal from a first port. During a transmission mode, the primary side is configured to transmit a second signal from a second port. The switching device is configured to couple the first port to the bias source during transmission of the second signal and to couple the second port to the bias source during receipt of the first signal. The bias source can be, for example, ground.

Abstract: A receiver includes an antenna array, a plurality of phase shifters, a matrix module, a low noise amplifier module, and a down conversion module. The antenna array is coupled to receive an inbound wireless signal. The plurality of phase shifters is coupled to the antenna array and to produce a plurality of phase shifted inbound wireless signals. The matrix module is coupled to beamform the plurality of phase shifted inbound wireless signals to produce a plurality of beamformed and phase shifted inbound wireless signals having a radiation pattern that is aligned with an angular position of a source of the inbound wireless signal with respect to the receiver.

Abstract: An integrated circuit (IC) device is provided. The IC device includes a substrate, an IC die coupled to the substrate, and a first wirelessly enabled functional block formed on the IC die. The first wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block formed on the substrate.

Abstract: A receiver includes an antenna array, a plurality of phase shifters, a matrix module, a low noise amplifier module, and a down conversion module. The antenna array is operably coupled to receive an inbound wireless signal. The plurality of phase shifters is operably coupled to the antenna array and to produce a plurality of phase shifted inbound wireless signals. The matrix module is operably coupled to beamform the plurality of phase shifted inbound wireless signals to produce a plurality of beamformed and phase shifted inbound wireless signals. The low noise amplifier module is operably coupled to amplify one or more of the plurality of beamformed and phase shifted inbound wireless signals to produce one or more amplified inbound signals. The down conversion module is operably coupled to convert the one or more amplified inbound wireless signals into one or more baseband or near baseband signals.

Abstract: A dongle transceiver a substrate, a transceiver circuit, a transmit/receive switch, a MIMO antenna structure, and a decoupling module. The transceiver circuit is on at least one of the first and second sides of the substrate and is coupled to the transmit/receive switch. The MIMO antenna structure is on at least one of the first and second sides of the substrate. The decoupling module is on at least one of the first and second sides of the substrate, couples the MIMO antenna structure to the transmit/receive switch, and electrically isolates antennas of the MIMO antenna structure.