Abstract: A transceiver is provided for wireless communication. The transceiver can include a bias source, a transformer including a primary side and a secondary side, and a switching device. During a receive mode, the primary side of the transformer is configured to receive a first signal from a first port. During a transmission mode, the primary side is configured to transmit a second signal from a second port. The switching device is configured to couple the first port to the bias source during transmission of the second signal and to couple the second port to the bias source during receipt of the first signal. The bias source can be, for example, ground.

Abstract: Methods and systems for estimating an angle of arrival are provided. In an embodiment, a system for estimating angle of arrival includes a snapshot determining module configured to receive a signal from each antenna of an antenna array and to generate a snapshot vector including values based on the signals and an angle of arrival processing module configured to estimate an angle of arrival for the electromagnetic signal relative to the antenna array based on the snapshot vector. Each signal is representative of an electromagnetic signal incident on a respective antenna of the antenna array and each value is representative of a phase of a respective signal.

Abstract: A chip comprises and operational section and an input/output section. The operational section includes a controller. The input/output (I/O) section is coupled to the operational section. The I/O section comprises a transformer and a switching device. The transformer includes a primary side connected to first and second I/O ports and a secondary side connected to the operational section. The switching device is coupled to the controller and between the first and second I/O ports and a bias port, such that, under control of the controller, the switching device connects one of the first and second I/O ports to the bias port.

Abstract: An integrated circuit (IC) low noise amplifier includes an on-chip balun and an on-chip differential amplifier. The on-chip balun is coupled to convert a single-ended signal into a differential signal. The on-chip differential amplifier is coupled to amplify the differential signal.

Abstract: A receiver includes an antenna array, an angular positioning module, a low noise amplifier module, and a down conversion module. The antenna array is operable to receive an inbound wireless signal. The angular positioning module is operable to: receive a plurality of received inbound wireless signals from the antenna array; determine angular position of a source of the inbound wireless signal from at least some of the plurality of received inbound wireless signals based on a first radiation pattern and a second radiation pattern of the plurality of received inbound wireless signals; and output a representation of the inbound wireless signal. The low noise amplifier module is operably coupled to amplify the representation of the inbound wireless signal to produce an amplified inbound wireless signal. The down conversion module is operably coupled to convert the amplified inbound wireless signal into a baseband or near baseband signal.

Abstract: A receiver includes an antenna array, a plurality of phase shifters, a matrix module, a low noise amplifier module, and a down conversion module. The antenna array is operably coupled to receive an inbound wireless signal. The plurality of phase shifters is operably coupled to the antenna array and to produce a plurality of phase shifted inbound wireless signals. The matrix module is operably coupled to beamform the plurality of phase shifted inbound wireless signals to produce a plurality of beamformed and phase shifted inbound wireless signals. The low noise amplifier module is operably coupled to amplify one or more of the plurality of beamformed and phase shifted inbound wireless signals to produce one or more amplified inbound signals. The down conversion module is operably coupled to convert the one or more amplified inbound wireless signals into one or more baseband or near baseband signals.

Abstract: An apparatus and method for allowing two different signal paths to be coupled to a multi-tap transformer balun. The multi-tap transformer has a first port, which is coupled to a single antenna, and two or more differential secondary ports. Each port has one or more taps, which are optimized separately for each of the signal paths, allowing each of the two or more signal paths to operate in different frequency bands. Use of the method of the invention can decrease the number of external components and integrated circuit package pins, and reduce the area required for each signal path on an integrated circuit die, a printed circuit board, or the like.

Abstract: A Radio Frequency (RF) structure services an antenna having a characteristic impedance and includes a differential Power Amplifier (PA), a differential Low Noise Amplifier (LNA), and a balun transformer. The differential PA has a differential PA output with a PA differential output impedance. The differential LNA has a differential LNA input with an LNA differential input impedance. The balun transformer has a singled ended winding coupled to the antenna, a differential winding having a first pair of tap connections coupled to the differential PA output and a second pair of tap connections coupled to the differential LNA input, and a turns ratio of the single ended winding and the differential winding. The turns ratio and the first pair of tap connections impedance match the PA differential output impedance to the characteristic impedance of the antenna. The turns ratio and the second pair of tap connections impedance match the LNA differential input impedance to the characteristic impedance of the antenna.

Abstract: A multi-level power amplifier architecture using a multi-tap transformer implemented on a single CMOS integrated circuit wireless communications device is described. By providing a multi-tap transformer for coupling a plurality of power amplifiers to a shared output impedance, such as an antenna, power transmission may be made at different levels while maintaining efficiency. With a multi-tap transformer having “N” taps featuring “N” different impedance levels, each tap may be connected to an amplifier cell which delivers power into the transformer at the tap for coupling to the output load. Any one of the “N” amplifier cells can be turned on at once along with any combination of the “N” amplifier cells.

Abstract: A chip comprises and operational section and an input/output section. The operational section includes a controller. The input/output (I/O) section is coupled to the operational section. The I/O section comprises a transformer and a switching device. The transformer includes a primary side connected to first and second I/O ports and a secondary side connected to the operational section. The switching device is coupled to the controller and between the first and second I/O ports and a bias port, such that, under control of the controller, the switching device connects one of the first and second I/O ports to the bias port.

Abstract: A low profile Planar Inverted-F Antenna (PIFA) comprises a radiating strip, an inductive tuning portion, a vertical feed portion, and a retracted ground plane. The radiating strip is approximately parallel to the ground plane and is suspended above the ground plane by the feed element at a certain distance. Further, the radiating strip, in part or entirely, overhangs the ground plane. In this way, the radiating strip may be suspended very close to the ground plane, but yet exhibits a large bandwidth.

Abstract: An impedance transformer includes a first winding and a second winding. The first winding includes a first plurality of winding components, wherein each of the first plurality of winding components is on a corresponding layer of a first set of layers of a supporting substrate. The second winding includes a second plurality of winding components, wherein each of the second plurality of winding components is on a corresponding layer of a second set of layers of the supporting substrate and the first and second sets of layers are interleaved. The first winding has a first impedance within a desired frequency range and the second winding has a second impedance within the desired frequency range, where the first and second impedances are based on at least one of spacing, trace width, and trace length of the first and second plurality of winding components.

Abstract: A chip comprises and operational section and an input/output section. The operational section includes a controller. The input/output (I/O) section is coupled to the operational section. The I/O section comprises a transformer and a switching device. The transformer includes a primary side connected to first and second I/O ports and a secondary side connected to the operational section. The switching device is coupled to the controller and between the first and second I/O ports and a bias port, such that, under control of the controller, the switching device connects one of the first and second I/O ports to the bias port.

Abstract: An integrated circuit (IC) low noise amplifier includes an on-chip balun and an on-chip differential amplifier. The on-chip balun is coupled to convert a single-ended signal into a differential signal. The on-chip differential amplifier is coupled to amplify the differential signal.

Abstract: A Radio Frequency (RF) structure services an antenna having a characteristic impedance and includes a differential Power Amplifier (PA), a differential Low Noise Amplifier (LNA), and a balun transformer. The differential PA has a differential PA output with a PA differential output impedance. The differential LNA has a differential LNA input with an LNA differential input impedance. The balun transformer has a singled ended winding coupled to the antenna, a differential winding having a first pair of tap connections coupled to the differential PA output and a second pair of tap connections coupled to the differential LNA input, and a turns ratio of the single ended winding and the differential winding. The turns ratio and the first pair of tap connections impedance match the PA differential output impedance to the characteristic impedance of the antenna. The turns ratio and the second pair of tap connections impedance match the LNA differential input impedance to the characteristic impedance of the antenna.

Abstract: An integrated circuit (IC) low noise amplifier includes an on-chip balun and an on-chip differential amplifier. The on-chip balun is operably coupled to convert a single-ended signal into a differential signal. The on-chip differential amplifier is operably coupled to amplify the differential signal.

Abstract: An integrated RF front-end architecture is disclosed. Such an integrated RF front-end architecture includes a multi-tap balun, a low noise amplifier and a power amplifier core. The multi-tap balun includes a single-ended primary winding and a symmetrical multi-tap secondary winding, wherein the single-ended primary winding is operably coupled to an antenna. The low noise amplifier is coupled to a first set of taps of the symmetrical multi-tap secondary winding. The power amplifier core is coupled to a second set of taps of the symmetrical multi-tap secondary winding and can be a two stage amplifier having a driver stage and an output stage. The multi-tap balun, low noise amplifier and power amplifier core can be on-chip components or can be fabricated to be discrete components on a printed circuit board.

Abstract: Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.

Abstract: A multi-level power amplifier architecture using a multi-tap transformer implemented on a single CMOS integrated circuit wireless communications device is described. By providing a multi-tap transformer for coupling a plurality of power amplifiers to a shared output impedance, such as an antenna, power transmission may be made at different levels while maintaining efficiency. With a multi-tap transformer having “N” taps featuring “N” different impedance levels, each tap may be connected to an amplifier cell which delivers power into the transformer at the tap for coupling to the output load. Any one of the “N” amplifier cells can be turned on at once along with any combination of the “N” amplifier cells.

Abstract: An apparatus and method for allowing two different signal paths to be coupled to a multi-tap transformer balun. The multi-tap transformer has a first port, which is coupled to a single antenna, and two or more differential secondary ports. Each port has one or more taps, which are optimized separately for each of the signal paths, allowing each of the two or more signal paths to operate in different frequency bands. Use of the method of the invention can decrease the number of external components and integrated circuit package pins, and reduce the area required for each signal path on an integrated circuit die, a printed circuit board, or the like.