Patents by Inventor Jesus Alfonso Castaneda
Jesus Alfonso Castaneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10873138Abstract: A system and apparatus is provided to reduce signal routing, area and signal loss in double-pole, double-throw (DPDT) switch implementations in wireless and millimeter-wave front ends. A cyclic staggered arrangement of receivers, transmitters and antenna ports connecting with DPDT switches reduce signal cross-over and allow for compact, low-loss multi-antenna configurations.Type: GrantFiled: April 25, 2018Date of Patent: December 22, 2020Assignee: Avago Technologies International Sales Pte. LimitedInventors: Bevin George Perumana, Seunghwan Yoon, Bagher Afshar, Saikat Sarkar, Ehsan Adabi Firouzjaei, Michael John Inglis Boers, Jesus Alfonso Castaneda, Tirdad Sowlati
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Publication number: 20180241137Abstract: A system and apparatus is provided to reduce signal routing, area and signal loss in double-pole, double-throw (DPDT) switch implementations in wireless and millimeter-wave front ends. A cyclic staggered arrangement of receivers, transmitters and antenna ports connecting with DPDT switches reduce signal cross-over and allow for compact, low-loss multi-antenna configurations.Type: ApplicationFiled: April 25, 2018Publication date: August 23, 2018Applicant: Avago Technologies General IP (Singapore) Pte. Ltd .Inventors: Bevin George Perumana, Seunghwan Yoon, Bagher Afshar, Saikat Sarkar, Ehsan Adabi Firouzjaei, Michael John Inglis Boers, Jesus Alfonso Castaneda, Tirdad Sowlati
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Patent number: 10013285Abstract: Disclosed herein are systems, apparatuses, and methods for locating wireless-enabled components, and applications thereof. Such an apparatus includes a wireless-enabled component (WEC), which may be a functional block of an integrated circuit (IC), an IC, or a device that includes an IC. The WEC includes a functional module (e.g., a processing resource or a memory resource) and an antenna element coupled to the functional module. The antenna element is configured to (i) transmit a search signal to locate a proximally situated WEC and (ii) transmit a communication signal to communicate with the proximally situated WEC. The antenna element may be a phased array, an electrically steered phased array, a mechanically steered phased array, a directional antenna, a mechanically steered directional antenna, an RF antenna, an optical antenna, and/or any combination thereof.Type: GrantFiled: September 8, 2010Date of Patent: July 3, 2018Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Arya Reza Behzad, Michael Boers, Jesus Alfonso Castaneda, Ahmadreza Reza Rofougaran, Sam Zhao
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Patent number: 9985357Abstract: A system and apparatus is provided to reduce signal routing, area and signal loss in double-pole, double-throw (DPDT) switch implementations in wireless and millimeter-wave front ends. A staggered arrangement of receivers, transmitters and antenna ports connecting with DPDT switches reduce signal cross-over and allow for compact, low-loss multi-antenna configurations.Type: GrantFiled: December 13, 2013Date of Patent: May 29, 2018Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTDInventors: Bevin George Perumana, Seunghwan Yoon, Bagher Afshar, Saikat Sarkar, Ehsan Adabi Firouzjaei, Michael John Inglis Boers, Jesus Alfonso Castaneda, Tirdad Sowlati
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Patent number: 9891951Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.Type: GrantFiled: April 7, 2015Date of Patent: February 13, 2018Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Ahmadreza (Reza) Rofougaran, Arya Reza Behzad, Sam Ziqun Zhao, Jesus Alfonso Castaneda, Michael Boers
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Patent number: 9793963Abstract: Aspects of the subject disclosure may include, for example, an integrated circuit that includes at least one die having transceiver circuitry that generates outbound signals that convey outbound data and that receives inbound signals that convey inbound data. A first array of antenna elements arranged along the top portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a first portion of the outbound signals as first wireless transmissions and/or generate at least a first portion of the inbound signals from first wireless receptions. A second array of antenna elements arranged along the bottom portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a second portion of the outbound signals as second wireless transmissions and/or to generate at least a second portion of the inbound signals from second wireless receptions. Other embodiments are disclosed.Type: GrantFiled: November 25, 2014Date of Patent: October 17, 2017Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE.Inventors: Alfred Grau Besoli, Nicolaos Georgiou Alexopoulos, Jesus Alfonso Castaneda, Chryssoula Angelakis Kyriazidou
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Patent number: 9772880Abstract: Embodiments of the present invention are directed to a wireless bus for intra-chip and inter-chip communication having adaptable links and routes among wireless-enabled components (WECs) of the wireless bus. Links and routes may be adapted according to one or more of, among other factors, the relative position of WECs, available capabilities (e.g., communication capabilities) at WECs, availability of resources at WECs, and the physical environment.Type: GrantFiled: September 8, 2010Date of Patent: September 26, 2017Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.Inventors: Ahmadreza (Reza) Rofougaran, Arya Reza Behzad, Sam Ziqun Zhao, Jesus Alfonso Castaneda, Michael Boers
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Patent number: 9612871Abstract: Embodiments of the present invention are directed to a wireless resource borrowing environment enabled by a wireless bus comprising a plurality of wireless-enabled components (WECs). In an embodiment, the WECs use the wireless bus to share resource information (including resource availability information) among each others. For example, a WEC may share with other WECs information regarding its processing and memory resources. The WEC may then use the shared resource information to identify resources at other WECs that it may borrow to perform certain tasks. In an embodiment, resource borrowing is performed according to a cost-based method which optimizes resource borrowing according to a cost function. The cost function may be designed to optimize resource borrowing according to any combination of one or more factors, including power consumption, processing speed, delay, interference, error rate, reliability, load at the lender WEC, computing capability at the lender WEC, etc.Type: GrantFiled: September 8, 2010Date of Patent: April 4, 2017Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Ahmadreza (Reza) Rofougaran, Arya Reza Behzad, Sam Ziqun Zhao, Jesus Alfonso Castaneda, Michael Boers
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Patent number: 9570420Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.Type: GrantFiled: September 29, 2011Date of Patent: February 14, 2017Assignee: Broadcom CorporationInventors: Jesus Alfonso Castaneda, Arya Reza Behzad, Ahmadreza Rofougaran, Sam Ziqun Zhao, Michael Boers
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Patent number: 9459921Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.Type: GrantFiled: February 6, 2015Date of Patent: October 4, 2016Assignee: Broadcom CorporationInventors: Ahmadreza (Reza) Rofougaran, Arya Reza Behzad, Michael Boers, Jesus Alfonso Castaneda, Sam Ziqun Zhao
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Wireless bus for intra-chip and inter-chip communication, including embodiments with adaptable links
Patent number: 9361158Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.Type: GrantFiled: February 13, 2015Date of Patent: June 7, 2016Assignee: Broadcom CorporationInventors: Ahmadreza (Reza) Rofougaran, Arya Reza Behzad, Sam Ziqum Zhao, Jesus Alfonso Castaneda, Michael Boers -
Patent number: 9318785Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.Type: GrantFiled: September 29, 2011Date of Patent: April 19, 2016Assignee: Broadcom CorporationInventors: Ahmadreza Rofougaran, Arya Reza Behzad, Sam Ziqun Zhao, Jesus Alfonso Castaneda, Michael Boers
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Patent number: 9286121Abstract: Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly.Type: GrantFiled: March 11, 2013Date of Patent: March 15, 2016Assignee: Broadcom CorporationInventors: Ahmadreza Rofougaran, Arya Reza Behzad, Sam Ziqun Zhao, Jesus Alfonso Castaneda, Michael Boers
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Patent number: 9209508Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.Type: GrantFiled: September 29, 2011Date of Patent: December 8, 2015Assignee: Broadcom CorporationInventors: Ahmadreza Rofougaran, Arya Reza Behzad, Sam Ziqun Zhao, Jesus Alfonso Castaneda, Michael Boers
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Publication number: 20150282235Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.Type: ApplicationFiled: April 7, 2015Publication date: October 1, 2015Applicant: Broadcom CorporationInventors: Ahmadreza (Reza) ROFOUGARAN, Arya Reza BEHZAD, Sam Ziqun ZHAO, Jesus Alfonso CASTANEDA, Michael BOERS
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Publication number: 20150276856Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.Type: ApplicationFiled: June 10, 2015Publication date: October 1, 2015Applicant: Broadcom CorporationInventors: Jesus Alfonso Castaneda, Arya Reza Behzad, Ahmadreza Rofougaran, Sam Ziqun Zhao, Michael Boers
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Publication number: 20150223275Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.Type: ApplicationFiled: February 6, 2015Publication date: August 6, 2015Applicant: Broadcom CorporationInventors: Ahmadreza (Reza) ROFOUGARAN, Arya Reza Behzad, Michael Boers, Jesus Alfonso Castaneda, Sam Ziqun Zhao
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Patent number: 9075105Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.Type: GrantFiled: September 29, 2011Date of Patent: July 7, 2015Assignee: Broadcom CorporationInventors: Jesus Alfonso Castaneda, Arya Reza Behzad, Ahmadreza Rofougaran, Sam Ziqun Zhao, Michael Boers
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WIRELESS BUS FOR INTRA-CHIP AND INTER-CHIP COMMUNICATION, INCLUDING EMBODIMENTS WITH ADAPTABLE LINKS
Publication number: 20150162958Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.Type: ApplicationFiled: February 13, 2015Publication date: June 11, 2015Applicant: Broadcom CorporationInventors: Ahmadreza (Reza) Rofougaran, Arya Reza Behzad, Sam Ziqum Zhao, Jesus Alfonso Castaneda, Michael Boers -
Patent number: 9046576Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.Type: GrantFiled: July 17, 2013Date of Patent: June 2, 2015Assignee: Broadcom CorporationInventors: Arya Reza Behzad, Ahmadreza Rofougaran, Sam Ziqun Zhao, Jesus Alfonso Castaneda, Michael Boers