Abstract: Aspects of the subject disclosure may include, for example, an integrated circuit that includes at least one die having transceiver circuitry that generates outbound signals that convey outbound data and that receives inbound signals that convey inbound data. A first array of antenna elements arranged along the top portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a first portion of the outbound signals as first wireless transmissions and/or generate at least a first portion of the inbound signals from first wireless receptions. A second array of antenna elements arranged along the bottom portion of the IC package operate in conjunction with the transceiver circuitry to transmit at least a second portion of the outbound signals as second wireless transmissions and/or to generate at least a second portion of the inbound signals from second wireless receptions. Other embodiments are disclosed.

Abstract: Disclosed herein are systems, apparatuses, and methods for wirelessly coupling functional resources. Such a system includes a plurality of co-located, wireless-enabled functional units of a first type and a plurality of co-located, wireless-enabled functional units of a second type. At least one of the wireless-enabled functional units of the first type is wirelessly coupled with one or more of the wireless-enabled functional units of the second type. The wireless-enabled functional units of the first type may be wireless-enabled processing units, and the wireless-enabled functional units of the second type may be wireless-enabled memory units. In an example, the plurality of wireless-enabled functional units of the first type are co-located on a first chip, and the plurality of wireless-enabled functional units of the second type are co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.

Abstract: A system and apparatus is provided to reduce signal routing, area and signal loss in double-pole, double-throw (DPDT) switch implementations in wireless and millimeter-wave front ends. A staggered arrangement of receivers, transmitters and antenna ports connecting with DPDT switches reduce signal cross-over and allow for compact, low-loss multi-antenna configurations.

Abstract: Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract: Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

Abstract: Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract: Disclosed herein are systems, apparatuses, and methods for establishing wireless communications among a plurality of wireless-enabled components (WECs), and applications thereof. Such a system includes a plurality of WECs, each configured to transmit and receive over a wireless bus. The wireless bus includes (i) a first channel to identify proximally located WECs and (ii) a second channel to support communications among the proximally located WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips across multiple devices.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract: An integrated radar system includes a processing module and a radar device. The radar device includes an antenna module, a configurable shaping module, and a configurable transceiver module. The processing module generates an outbound signal and a control signal to configure the integrated radar system. The configured transceiver module converts the outbound signal into an outbound wireless signal. The configured shaping module shapes the outbound wireless signal into a shaped signal. The antenna module transmits the shaped signal and then receives an inbound radar signal. The configured shaping module shapes the inbound radar signal into an inbound wireless signal. The configured transceiver module converts the inbound wireless signal into an inbound symbol stream. The processing module determines location information regarding an object based on the inbound symbol stream.

Abstract: A transceiver circuit includes a transmitter to send communication signals and a receiver to receive communication signals sent by other transmitters. The transceiver circuit also includes a switch to connect the transmitter and the receiver to at least one antenna. The switch controls at least two directions of polarization of the at least one antenna.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract: An integrated radar system includes a processing module and a radar device. The radar device includes an antenna module, a configurable shaping module, and a configurable transceiver module. The processing module generates an outbound signal and a control signal to configure the integrated radar system. The configured transceiver module converts the outbound signal into an outbound wireless signal. The configured shaping module shapes the outbound wireless signal into a shaped signal. The antenna module transmits the shaped signal and then receives an inbound radar signal. The configured shaping module shapes the inbound radar signal into an inbound wireless signal. The configured transceiver module converts the inbound wireless signal into an inbound symbol stream. The processing module determines location information regarding an object based on the inbound symbol stream.

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract: An integrated radar system includes a processing module and a radar device. The radar device includes an antenna module, a configurable shaping module, and a configurable transceiver module. The processing module generates an outbound signal and a control signal to configure the integrated radar system. The configured transceiver module converts the outbound signal into an outbound wireless signal. The configured shaping module shapes the outbound wireless signal into a shaped signal. The antenna module transmits the shaped signal and then receives an inbound radar signal. The configured shaping module shapes the inbound radar signal into an inbound wireless signal. The configured transceiver module converts the inbound wireless signal into an inbound symbol stream. The processing module determines location information regarding an object based on the inbound symbol stream.

Abstract: Disclosed herein is a configurable system of wireless-enabled components (WECs) and applications thereof. The system includes a plurality of WECs and a controller. Each WEC comprises a functional resource and is adapted to wirelessly communicate with other WECs. The controller is adapted to dynamically configure the functional resource of each WEC and wireless communications among the plurality of WECs to form a field-programmable communications array. The controller may be one of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.