Abstract: A gate structure includes a gate dielectric layer, a work function layer, a metal layer, and a barrier layer. The work function layer is on the gate dielectric layer. The metal layer is over the work function layer. The barrier layer is sandwiched between the metal layer and the work function layer. The barrier layer includes silicon or aluminum.

Abstract: A flexible display includes a flexible display screen and a drive chip. The flexible display screen includes a flexible substrate. The flexible substrate includes a display region and a bonding region. The back of the flexible substrate is adhered with a supporting film and the drive chip is bonded to the bonding region.

Abstract: The embodiments of the present invention comprise a coolant-free hollow valve with a cavity and a vacuum being enclosed in the cavity. The valve is used for an engine and one example of an engine is an internal combustion engine. The valve comprises a coolant-free hollow vacuum cavity to reduce the heat conduction such that the combustion heat is used to perform useful work to improve the efficiency of the engine. One embodiment of the present invention is a coolant-free valve with a hollow vacuum cavity and a thermal barrier coating being deposited onto part of the external surface of the valve that comes into contact with the combustion chamber of the engine.

Abstract: Certain embodiments of a semiconductor device and a method of forming a semiconductor device comprise forming a high-k gate dielectric layer over a short channel semiconductor fin. A work function metal layer is formed over the high-k gate dielectric layer. A seamless metal fill layer is conformally formed over the work function metal layer.

Abstract: A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive connector is formed aside the first conductive connectors and electrically insulated to the die. A redistribution layer is formed on the die. The redistribution layer is electrically connected to the first conductive connectors and the second conductive connector. A conductive shield is formed on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die coupled the active surface. The die is electrically insulated from the conductive shield. Another manufacturing method of a package structure is also provided.

Abstract: An auxiliary fixture for a tire pressure monitoring device has a handle, a positioning base, and a holding lever. The positioning base is connected to the handle and has a pivot segment and a clamping segment. The pivot segment is deposited on a rear side of the positioning base and is pivotally connected to the handle. The clamping segment is deposited on a front side of the positioning base, is connected to the pivot segment, and has two adjusting elements and a pushing pin. The adjusting elements are deposited on a front side of the clamping segment, and the pushing pin is deposited between the adjusting elements to press against the tire pressure monitoring device. A distance between the adjusting elements can be adjusted to enable the adjusting elements to clamp the tire pressure monitoring device. The holding lever is connected to the handle.

Abstract: A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive connector is formed aside the first conductive connectors and electrically insulated to the die. A redistribution layer is formed on the die. The redistribution layer is electrically connected to the first conductive connectors and the second conductive connector. A conductive shield is formed on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die coupled the active surface. The die is electrically insulated from the conductive shield. Another manufacturing method of a package structure is also provided.

Abstract: A package structure including a die, a plurality of first conductive connectors, a second conductive connector electrically insulated from the die, a redistribution layer and a conductive shield is provided. The die includes an active surface, a back surface opposite the active surface, and a sidewall coupling the active surface to the back surface. The first conductive connectors are disposed on the active surface of the die and electrically connected to the die. The second conductive connector is disposed on the die and aside the first conductive connectors. The redistribution layer is disposed on the die and electrically connected to the first conductive connectors and the second conductive connector. The conductive shield coupled to the redistribution layer surrounds the second conductive connector and at least a portion of the sidewall. The die is electrically insulated to the conductive shield. A chip package structure is also provided.

Abstract: The present invention discloses a method and a process of producing ammonia from methane extracted from methane-hydrate at the site of methane-hydrate extraction. The method and the process comprise coupled chemical reactions. During the first reaction, carbon dioxide reacts methane-hydrate to produce carbon-dioxide-hydrate and methane: carbon dioxide+methane-hydrate?carbon-dioxide-hydrate+methane (CO2+CH4-hydrate?CO2-hydrate+CH4). The produced methane is reacted with water to produced carbon dioxide and hydrogen via the second reaction: methane+water?carbon dioxide+hydrogen (CH4+2H2O?CO2+4H2). One embodiment of the second reaction is a combination of the methane steam reforming reaction (CH4+H2O?CO+3H2) and the water-gas shift reaction (CO+H2O?CO2+H2), both are widely known in the art. The carbon dioxide produced in the second reaction is recycled and used for the first reaction.

Abstract: A centrifugal blower includes an electric motor, a centrifugal impeller driven by the motor, a diffuser mounted to the motor and disposed between the motor and the centrifugal impeller, and a casing mounted to the diffuser. The centrifugal impeller is received in a chamber defined by the diffuser and the casing. the casing defines an opening facing the inlet of the centrifugal impeller. The diffuser has a plurality of passage walls, and a plurality of diffusing passages, each bounded by neighboring passage walls. The diffuser further has at least one mounting portion connected to one of the passage walls. A cross section of each of the diffusing passages is increased form an outer end to an inner end thereof and no throat is formed in each of the diffusing passages.

Abstract: An auxiliary fixture for a tire pressure monitoring device has a handle, a positioning base, and a holding lever. The positioning base is connected to the handle and has a pivot segment and a clamping segment. The pivot segment is deposited on a rear side of the positioning base and is pivotally connected to the handle. The clamping segment is deposited on a front side of the positioning base, is connected to the pivot segment, and has two adjusting elements and a pushing pin. The adjusting elements are deposited on a front side of the clamping segment, and the pushing pin is deposited between the adjusting elements to press against the tire pressure monitoring device. A distance between the adjusting elements can be adjusted to enable the adjusting elements to clamp the tire pressure monitoring device. The holding lever is connected to the handle.

Abstract: An auxiliary fixture for a tire pressure monitoring device has a handle, a positioning base, and a holding lever. The positioning base is connected to the handle and has a pivot segment and a clamping segment. The pivot segment is deposited on a rear side of the positioning base and is pivotally connected to the handle. The clamping segment is deposited on a front side of the positioning base, is connected to the pivot segment, and has two adjusting elements and a pushing pin. The adjusting elements are deposited on a front side of the clamping segment, and the pushing pin is deposited between the adjusting elements to press against the tire pressure monitoring device. A distance between the adjusting elements can be adjusted to enable the adjusting elements to clamp the tire pressure monitoring device. The holding lever is connected to the handle.

Abstract: A stacked chip package structure includes a first chip, pillar bumps, a first encapsulant, a first redistribution layer, a second chip, a second encapsulant, a second redistribution layer and a through via. The pillar bumps are disposed on a plurality of first pads of the first chip respectively. The first encapsulant encapsulates the first chip and exposes the pillar bumps. The first redistribution layer is disposed on the first encapsulant and electrically connects the first chip. The second chip is disposed on the first redistribution layer. The second encapsulant encapsulates the second chip. The second redistribution layer is disposed on the second encapsulant and electrically coupled to the second chip. The through via penetrates the second encapsulant and electrically connects the first redistribution layer and the second redistribution layer.

Abstract: A stacked chip package structure includes a first chip, pillar bumps, a first encapsulant, a first redistribution layer, a second chip, a second encapsulant, a second redistribution layer and a through via. The pillar bumps are disposed on a plurality of first pads of the first chip respectively. The first encapsulant encapsulates the first chip and exposes the pillar bumps. The first redistribution layer is disposed on the first encapsulant and electrically connects the first chip. The second chip is disposed on the first redistribution layer. The second encapsulant encapsulates the second chip. The second redistribution layer is disposed on the second encapsulant and electrically coupled to the second chip. The through via penetrates the second encapsulant and electrically connects the first redistribution layer and the second redistribution layer.

Abstract: A stacked chip package structure includes a first chip, stud bumps, a second chip, pillar bumps, an encapsulant and conductive vias. The first stud bumps are respectively disposed on a plurality of first pads of the first chip, wherein each first stud bump includes a rough surface, and the rough surface of each first stud bump is rougher than a top surface of each first pad. The second chip is disposed on the first chip and exposes the first pads. The pillar bumps are respectively disposed on a plurality of second pads of the second chips. The encapsulant encapsulates the first chip and the second chip and exposes a top surface of each second stud bump. The first conductive vias penetrate the encapsulant and connect the first stud bumps. Each first conductive via covers the rough surface of each first stud bump.

Abstract: A fin field effect transistor (FinFET) is provided. The FinFET includes a substrate, a gate stack, and a filter layer, and strain layers. The substrate has a semiconductor fin. The gate stack is disposed across the semiconductor fin. The gate stack includes a gate dielectric layer, a work function layer and a metal filling layer. The gate dielectric layer is disposed on the semiconductor fin. The work function layer is disposed on the gate dielectric layer. The metal filling layer is over the work function layer. The filter layer is disposed between the work function layer and the metal filling layer to prevent or decrease penetration of diffusion atoms. The strain layers are beside the gate stack. A material of the filter layer is different from a material of the work function layer and a material of the metal filling layer.

Abstract: A single phase permanent magnet brushless motor includes a stator and a rotor. The stator includes an outer housing, a stator core mounted in the outer housing, and windings wound around the stator core. The stator core includes a yoke and a plurality of poles extending inwardly from the yoke. The yoke is fixed to the outer housing by welding. Reliability of the present motor is enhanced.

Abstract: Embodiments of the present invention generally relate to fiber designs for wavelength tunable ultra-short pulse lasers. More specifically, embodiments of the present invention relate to systems incorporating fiber designs for higher order mode fibers capable of soliton self frequency shifting where a system comprises a first fiber for shifting the wavelength from a pump wavelength to a transfer wavelength and a second fiber for shifting the pulse from the transfer wavelength to an output wavelength. In one embodiment of the present invention, a wavelength tunable short pulse fiber laser system comprises: a pulse generator for providing a pulse having an input wavelength; a mode-converter; a first designed fiber for shifting the pulse from the input wavelength to a transfer wavelength; and a second designed fiber for shifting the pulse from the transfer wavelength to an output wavelength.

Abstract: A method for manufacturing a semiconductor device includes providing a semiconductor substrate comprising a low-density region and a high-density region, forming a first gate structure in the low-density region and a second gate structure in the high-density region, form an etch stop layer on the first and second gate structures, and forming an interlayer dielectric layer on the etch stop layer and on the semiconductor substrate. The method further includes performing a first chemical mechanical polishing (CMP) process on the etch stop layer to expose a surface of a portion of the etch stop layer disposed on the first gate structure, performing a second CMP process on the etch stop layer to expose a surface of a portion of the etch stop layer disposed on the second gate structure, and performing a third CMP process to completely remove the etch stop layer.

Abstract: Embodiments of the present invention generally relate to optical mode conversion by nonlinear effects. More specifically, embodiments of the present invention relate to nonlinear mode conversion utilizing intermodal four-wave mixing to convert light between modes having different wavelengths for complex applications. In one embodiment of the present invention, a fiber comprises an input end for receiving light in a first mode at a first wavelength, and an output end for outputting light in a desired second mode at a desired second wavelength, wherein the first wavelength and the second wavelength are not the same. In many embodiments, the fiber comprises a higher-order mode fiber.