STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A stacked chip package structure includes a first chip, stud bumps, a second chip, pillar bumps, an encapsulant and conductive vias. The first stud bumps are respectively disposed on a plurality of first pads of the first chip, wherein each first stud bump includes a rough surface, and the rough surface of each first stud bump is rougher than a top surface of each first pad. The second chip is disposed on the first chip and exposes the first pads. The pillar bumps are respectively disposed on a plurality of second pads of the second chips. The encapsulant encapsulates the first chip and the second chip and exposes a top surface of each second stud bump. The first conductive vias penetrate the encapsulant and connect the first stud bumps. Each first conductive via covers the rough surface of each first stud bump.
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The application claims the priority benefit of U.S. provisional application Ser. No. 62/316,843, filed on Apr. 1, 2016 and Taiwan application serial no. 105137133, filed on Nov. 14, 2016. The entirety of each of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
BACKGROUND OF THE INVENTION Field of the InventionThe present invention generally relates to a chip package structure and a manufacturing method thereof. More particularly, the present invention relates to a stacked chip package structure and a manufacturing method thereof.
Description of Related ArtRecently, attention has paid to a semiconductor device called a “substrate with a built-in chip” in which a chip and the like are embed in a substrate made of resin and the like and a semiconductor device in which an insulating layer and a wiring layer are formed on the chip. In semiconductor devices such as a substrate with a built-in chip, it is necessary to bury a chip in the insulating layer, and further form a via hole through the insulating layer to electrically connect an electrode pad on the chip to an external electric terminal.
In general, the via hole is typically formed by using a laser beam. In this case, the laser beam passes through the insulating layer, and the electrode pad of the chip made of Al and the like may be filed apart by irradiation of the laser beam. As a result, the device including a semiconductor chip is disadvantageously damaged.
SUMMARY OF THE INVENTIONAccordingly, the present invention is directed to a stacked chip package structure which has favourable reliability, lower production cost and thinner overall thickness.
The present invention is further directed to a manufacturing method of the stacked chip package structure, which improves reliability and yield of the stacked chip package structure and reduces production cost and overall thickness of the stacked chip package structure.
The present invention provides a stacked chip package structure including a first chip, a plurality of first stud bumps, a second chip, a plurality of pillar bumps, an encapsulant and a plurality of first conductive vias. The first chip has a first active surface and a plurality of first pads disposed on the first active surface. The first stud bumps are disposed on the first pads. The second chip is disposed on the first chip without covering the first pads, and the second chip has a second active surface and a plurality of second pads disposed on the second active surface. The pillar bumps are disposed on the second pads. The encapsulant encapsulates the first chip and the second chip and exposes a top surface of each of the second stud bumps. The first conductive vias penetrate the encapsulant and are coupled to the first stud bumps.
The present invention further provides a manufacturing method of a stacked chip package structure, and the method includes the following steps. A first chip is disposed on a carrier, wherein the first chip has a first active surface and a plurality of first pads disposed on the first active surface. A second chip is disposed on the first chip without covering the first pads and has a second active surface and a plurality of second pads disposed on the second active surface. A plurality of first stud bumps are formed on the first pads. A plurality of pillar bumps are formed on the second pads. The first chip and the second chip are encapsulated by an encapsulant, wherein the encapsulant exposes a top surface of each second stud bump. A plurality of first vias are formed by a laser process, wherein the first vias penetrate the encapsulant and expose the first stud bumps. A conductive layer is formed in the first vias to form a plurality of first conductive vias. The carrier is removed.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
In the present embodiment, before the second chip 120 is disposed on the first chip 110, a third chip 150 may be disposed on the first chip 110. The third chip 150 is located between the first chip 110 and the second chip 120 as shown in
Then, a plurality of first stud bumps 116 are respectively formed on the first pads 114. A plurality of pillar bumps 126 are respectively formed on the second pads 124. A plurality of second stud bumps 156 are respectively formed on the third pads. Each of the first stud bumps 116 may include a protruded knot 116a as shown in
Next, referring to
Then, referring to
In the present embodiment, the second vias 162 penetrate the encapsulant 130 until the second vias 162 respectively expose the second stud bumps 156. As such, a top surface of each second stud bump 156 is roughened by the laser process during the formation of the second vias 162, so as to prevent the third pads 154 underneath the second stud bumps 156 from being damaged during the formation of the second vias 162. In addition, the rough surface of the second stud bump 156 is rougher than a top surface of the third pad 154. In this way, the bonding strength between the second stud bumps 156 and the conductive layer 164 subsequently formed thereon may be enhanced.
Next, referring to
Next, referring to
Then, referring to
In the present embodiment, there is more than one first chip 110. Multiple first chips 110 may be disposed on the carrier 200. The first chips 110 are arranged in a side-by-side manner. The second chip 120 may be disposed on the first chips 110 as shown in
In the present embodiment, there may be more than one first chip 110. Multiple first chips 110 are disposed on the carrier 200. The first chips 110 are arranged in a side-by-side manner. Herein, before the second chip 120 is disposed on the first chips 110, a plurality of third chips 150 are firstly disposed on the first chips 110 respectively without covering the first pads 114 of the first chips 110. The third chips 150 may be disposed between the first chips 110 and the second chip 120 as shown in
Then, similar to the previous embodiment, a plurality of first stud bumps 116 are respectively formed on the first pads 114, a plurality of pillar bumps 126 are respectively formed on the second pads 124, and a plurality of second stud bumps 156 are respectively formed on the third pads. Next, referring to
Next, referring to
Then, referring to
In sum, in the present invention, the chips are stacked on top of one another on the carrier. The stud bumps/pillar bumps are formed on the pads of the chips before stacking or after stacking the chips. Then, encapsulant is formed to encapsulate the chips and expose the pillar bumps of the topmost chip. The vias may penetrate the encapsulant to expose the stud bumps of the lower chips are formed by laser process. The stud bumps are used to prevent the pads of the lower chips from being damaged by the laser process. In addition, the top surfaces of the stud bumps are roughened by the laser process. The rough surface may enhance the bonding strength between the stud bumps and the conductive vias. Therefore, the manufacturing method in the present invention improves reliability and yield of the stacked chip package structure manufactured thereby. Also, with such configuration, the overall thickness and the production cost of the stacked chip package structure may be reduced.
It will be apparent to those skilled in the art that various modifications and variations may be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims
1. A stacked chip package structure, comprising:
- a first chip having a first active surface and a plurality of first pads disposed on the first active surface;
- a plurality of first stud bumps disposed on the first pads;
- a second chip disposed on the first chip without covering the first pads, the second chip having a second active surface and a plurality of second pads disposed on the second active surface;
- a plurality of pillar bumps disposed on the second pads;
- an encapsulant encapsulating the first chip and the second chip and exposing a top surface of each of the second stud bumps; and
- a plurality of first conductive vias penetrating the encapsulant and coupled to the first stud bumps.
2. The stacked chip package structure as claimed in claim 1, further comprising a redistribution layer disposed on the encapsulant, wherein the redistribution layer comprises a circuit layer electrically connected to the first chip and the second chip through the first conductive vias and the pillar bumps.
3. The stacked chip package structure as claimed in claim 2, further comprising a passivation layer, wherein the passivation layer is disposed on the redistribution layer, the passivation layer comprises a plurality of openings exposing a part of the redistribution layer.
4. The stacked chip package structure as claimed in claim 3, further comprising a plurality of solder balls, wherein the solder balls are disposed on the openings of the passivation layer and electrically connected to the circuit layer.
5. The stacked chip package structure as claimed in claim 1, further comprising a shielding layer disposed on an outer surface of the encapsulant.
6. The stacked chip package structure as claimed in claim 5, wherein the shielding layer is electrically connected to a ground or a supply voltage of the stacked chip package structure.
7. The stacked chip package structure as claimed in claim 1, wherein each of the first stud bumps comprises a rough surface, the rough surface of each of the first stud bumps is rougher than a top surface of each of the first pads, and each of the first conductive vias covering the rough surface of each of the first stud bumps.
8. The stacked chip package structure as claimed in claim 7, wherein the rough surface comprises a rough knot, and each of the first conductive vias covers the rough knot of each of the first stud bumps.
9. The stacked chip package structure as claimed in claim 1, further comprising a third chip, a plurality of second stud bumps and a plurality of second conductive vias, wherein the third chip has a third active surface and a plurality of third pads disposed on the third active surface, the third chip is disposed on the first chip without covering the first pads, the second chip is disposed on the third chip without covering the third pads, the second stud bumps are disposed on the third pads, and the second conductive vias penetrate the encapsulant and are coupled to the second stud bumps.
10. The stacked chip package structure as claimed in claim 1, wherein the number of the first chip is plural, the first chips are arranged in a side-by-side mariner, and the second chip is disposed on the first chips.
11. The stacked chip package structure as claimed in claim 9, further comprising a plurality of third chips, a plurality of second stud bumps and a plurality of second conductive vias, wherein each of the third chips has a third active surface and a plurality of third pads disposed on the third active surface, the third chips are disposed on the first chips without covering the first pads of the first chips, the second chip is disposed on the third chips without covering the third pads of the third chips, the second stud bumps are disposed on the third pads, and the second conductive vias penetrate the encapsulant and are coupled to the second stud bumps.
12. A manufacturing method of a stacked chip package structure, comprising:
- disposing a first chip on a carrier, wherein the first chip has a first active surface and a plurality of first pads disposed on the first active surface;
- disposing a second chip on the first chip, wherein the second chip exposes the first pads and has a second active surface and a plurality of second pads disposed on the second active surface;
- forming a plurality of first stud bumps on the first pads;
- forming a plurality of pillar bumps on the second pads;
- encapsulating the first chip and the second chip by an encapsulant, wherein the encapsulant exposes a top surface of each of the pillar bumps;
- forming a plurality of first vias by a laser process, wherein the first vias penetrate the encapsulant and expose the first stud bumps;
- forming a conductive layer in the first vias to form a plurality of first conductive vias; and
- removing the carrier.
13. The manufacturing method of the stacked chip package structure as claimed in claim 12, further comprising:
- forming a redistribution layer on the encapsulant, wherein the redistribution layer comprises a circuit layer electrically connected to the first chip and the second chip through the first conductive vias and the pillar bumps.
14. The manufacturing method of the stacked chip package structure as claimed in claim 13, further comprising:
- forming a passivation layer on the redistribution layer, wherein the passivation layer comprises a plurality of openings exposing a part of the redistribution layer.
15. The manufacturing method of the stacked chip package structure as claimed in claim 14, further comprising:
- forming a plurality of solder balls on the openings of the passivation layer, wherein the solder balls are electrically connected to the circuit layer.
16. The manufacturing method of the stacked chip package structure as claimed in claim 12, further comprising:
- forming a shielding layer on an outer surface of the encapsulant.
17. The manufacturing method of the stacked chip package structure as claimed in claim 12, wherein a top surface of each of the first stud bumps is roughened by the laser process to form a rough surface, and the conductive layer covers the rough surface of each of the first stud bumps.
18. The manufacturing method of the stacked chip package structure as claimed in claim 12, further comprising:
- disposing a third chip on the first chip without covering the first pads before the second chip is disposed on the first chip, wherein the second chip is disposed on the third chip without covering the third pads, and the third chip has a third active surface and a plurality of third pads disposed on the third active surface;
- forming a plurality of second stud bumps on the third pads; and
- forming a plurality of second conductive vias penetrating the encapsulant and coupled to the second stud bumps.
19. The manufacturing method of the stacked chip package structure as claimed in claim 12, wherein the number of the first chip is plural, the first chips are arranged in a side-by-side manner, and the second chip is disposed on the first chips.
20. The manufacturing method of the stacked chip package structure as claimed in claim 19, further comprising:
- disposing a plurality of third chips on the first chips without covering the first pads of the first chips before the second chip is disposed on the first chips, wherein the second chip is disposed on the third chips without covering the third pads of the third chips, and each of the third chips has a third active surface and a plurality of third pads disposed on the third active surface;
- forming a plurality of second stud bumps on the third pads; and
- forming a plurality of second conductive vias penetrating the encapsulant and coupled to the second stud bumps.
Type: Application
Filed: Mar 10, 2017
Publication Date: Oct 5, 2017
Applicant: Powertech Technology Inc. (Hsinchu County)
Inventors: Li-Chih Fang (Hsinchu County), Ji-Cheng Lin (Hsinchu County), Che-Min Chu (Hsinchu County), Chun-Te Lin (Hsinchu County), Chien-Wen Huang (Hsinchu County)
Application Number: 15/455,149