Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Abstract: A semiconductor package includes a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, an encapsulant encapsulating at least a portion of the semiconductor chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer and a via electrically connected to the connection pads of the semiconductor chip, wherein at least a portion of the redistribution layer and the via is formed of a metal layer having a concave portion depressed from a lower surface thereof and filled with an insulating material.

Abstract: A display device includes first to fourth electrodes spaced from each other on a base surface and a fifth electrode spaced from the first to fourth electrodes. A first light emitter is between the first to fourth electrodes and the fifth electrode and overlaps the first to fourth electrodes. A second light emitter is between the fourth and fifth electrodes and overlaps at least one of the first or second electrodes. A third light emitter is between the first to fourth electrodes and the fifth electrode and overlaps at least one of the third or fourth electrodes. A charge generating is layer between the first and second light emitters and between the first and third light emitters. Color filters transmit light from the light emitters in different wavelength ranges.

Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Abstract: A fingerprint sensor includes a first conductive pattern formed on one side of a core, a second conductive pattern formed on the first conductive pattern, an insulating layer formed between the first conductive pattern and the second conductive pattern, a dielectric layer configured to cover the second conductive pattern, and a protective layer covering the dielectric layer, wherein the protective layer includes a photosetting resin.

Abstract: An organic electroluminescence display device includes: a substrate; a first electrode including a first sub-electrode, a second sub-electrode, and a third sub-electrode which are arranged on the substrate; an organic light emitting layer on the first electrode and including a first light emitting layer, a second light emitting layer, and a third light emitting layer; and a second electrode on the organic light emitting layer, and the first light emitting layer is on the first sub-electrode, the second light emitting layer is on the first sub-electrode, the second sub-electrode, and the third sub-electrode, and the third light emitting layer is on the third sub-electrode, and the first light emitting layer is on a lower portion of the second light emitting layer, and the third light emitting layer is on an upper portion of the second light emitting layer.

Abstract: A molded product includes a body comprising a light-shielding photosensitive resin. The light-shielding photosensitive resin has a tinting strength having an L value equal than or less than 40, an a* value of ?40 to ?10, and a b* value less than or equal to 5 in the L*a*b* color space (CIE colorimetric system), and the light-shielding photosensitive resin has a directed transmittance (% T) of less than 10% at a wavelength band of 200 nm to 700 nm.

Abstract: A display device includes first to fourth electrodes spaced from each other on a base surface and a fifth electrode spaced from the first to fourth electrodes. A first light emitter is between the first to fourth electrodes and the fifth electrode and overlaps the first to fourth electrodes. A second light emitter is between the fourth and fifth electrodes and overlaps at least one of the first or second electrodes. A third light emitter is between the first to fourth electrodes and the fifth electrode and overlaps at least one of the third or fourth electrodes. A charge generating is layer between the first and second light emitters and between the first and third light emitters. Color filters transmit light from the light emitters in different wavelength ranges.

Abstract: An organic light emitting diode (OLED) display includes a substrate, a thin film transistor (TFT) on the substrate, an OLED connected to the TFT and configured to emit white light, and a capping layer on the OLED. The capping layer includes a first high refractive index layer, a first low refractive index layer, a second high refractive index layer, and a second low refractive index layer that are sequentially stacked.

Abstract: An organic light emitting display includes: a substrate; a first electrode on the substrate; an organic light emitting layer on the first electrode; a second electrode formed on the organic light emitting layer; a non-resonance reflection inducing layer on the second electrode; and a capping layer on the non-resonance reflection inducing layer.

Abstract: An organic light emitting diode display includes: a first electrode positioned over the substrate; an organic emission layer positioned over the first electrode; a second electrode positioned over the organic emission layer; a refractive layer positioned over the second electrode; and a light transflective metal layer positioned over the refractive layer.

Abstract: An organic light emitting diode (OLED) display includes a substrate, a thin film transistor (TFT) on the substrate, an OLED connected to the TFT and configured to emit white light, and a capping layer on the OLED. The capping layer includes a first high refractive index layer, a first low refractive index layer, a second high refractive index layer, and a second low refractive index layer that are sequentially stacked.

Abstract: A fingerprint sensor includes a first conductive pattern formed on one side of a core, a second conductive pattern formed on the first conductive pattern, an insulating layer formed between the first conductive pattern and the second conductive pattern, a dielectric layer configured to cover the second conductive pattern, and a protective layer covering the dielectric layer, wherein the protective layer includes a photosetting resin

Abstract: An organic light emitting display includes: a substrate; a first electrode on the substrate; an organic light emitting layer on the first electrode; a second electrode formed on the organic light emitting layer; a non-resonance reflection inducing layer on the second electrode; and a capping layer on the non-resonance reflection inducing layer.

Abstract: An organic light emitting display includes: a substrate; a first electrode on the substrate; an organic light emitting layer on the first electrode; a second electrode formed on the organic light emitting layer; a non-resonance reflection inducing layer on the second electrode; and a capping layer on the non-resonance reflection inducing layer.

Abstract: A resin composition and a printed circuit board comprising the same, include an epoxy resin, and a teflon resin including nano-silica on a surface thereof.

Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.

Abstract: A method of fabricating an organic light emitting device includes forming a first electrode layer on a substrate, surface-treating the first electrode layer with CF4 plasma, forming a first common layer containing pentacene on the surface-treated first electrode layer, forming an organic light emitting layer on the first common layer, forming a second common layer on the organic light emitting layer, and forming a second electrode layer on the second common layer. The CF4 plasma treatment enhances the luminous efficiency of the organic light emitting device.