Patents by Inventor Ji-Man Ryu
Ji-Man Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11830655Abstract: A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.Type: GrantFiled: August 11, 2020Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan Yang, Joung Gul Ryu, Ji Man Ryu, Byung Soo Kang, Byeong Cheol Moon
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Publication number: 20230360841Abstract: A coil portion disposed in the body, and including a coil pattern including a plurality of turns, and a lead-out portion extended to one side surface of the body, and an external electrode disposed on the body and connected to the lead-out portion, wherein an outermost turn of the plurality of turns having a first region and a second region, and, wherein a line width of the second region is greater than a line width of the first region, and wherein the line width of the second region is greater than a line width of the most adjacent turn with the outermost turn.Type: ApplicationFiled: January 19, 2023Publication date: November 9, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Man RYU, Byeong Cheol MOON
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Patent number: 11721473Abstract: A coil component includes a body, an insulating substrate embedded in the body and including an insulating resin, and first and second substrate protection layers covering respective surfaces of the insulating substrate to protect the insulating substrate and including a ceramic. A coil portion includes first and second coil patterns respectively disposed on the first and second substrate protection layers. Each of the first and second coil patterns includes a first conductive layer, disposed on the respective first or second substrate protection layer, and a second conductive layer disposed on the first conductive layer to expose a side surface of the first conductive layer.Type: GrantFiled: August 26, 2019Date of Patent: August 8, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joung Gul Ryu, Ji Man Ryu, Byeong Cheol Moon
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Publication number: 20220415564Abstract: A coil component includes: a body; a coil portion including a coil pattern disposed in the body and first and second lead portions exposed to a first surface of the body to be spaced apart from each other; and first and second external electrodes disposed on the first surface of the body and spaced apart from each other and connected to the first and second lead portions, respectively, wherein in a cross-section perpendicular to the first surface of the body, a curved portion having a radius of curvature of 1 ?m or more is formed in a region in which each of the first and second lead portions and an outermost turn of the coil pattern are connected to each other.Type: ApplicationFiled: May 12, 2022Publication date: December 29, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Min Ji CHO, Jae Hun KIM, Ji Man RYU
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Publication number: 20210335532Abstract: A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.Type: ApplicationFiled: August 11, 2020Publication date: October 28, 2021Inventors: Ju Hwan Yang, Joung Gul Ryu, Ji Man Ryu, Byung Soo Kang, Byeong Cheol Moon
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Patent number: 10984942Abstract: A coil component includes a body including a coil, and an external electrode disposed on an external surface of the body and connected to the coil, wherein the body includes a support member supporting the coil and including a through-hole and a via hole spaced apart from the through-hole, the coil includes a coil body and a lead portion connecting the coil body and the external electrode to each other, and a support thin film layer is interposed between one surface of the support member and one surface of the lead portion facing the one surface.Type: GrantFiled: October 29, 2018Date of Patent: April 20, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Ji Hyung Jung, Mi Geum Kim, Ji Man Ryu, Do Young Jung, Joung Gul Ryu
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Publication number: 20200118730Abstract: A coil component includes a body, an insulating substrate embedded in the body and including an insulating resin, and first and second substrate protection layers covering respective surfaces of the insulating substrate to protect the insulating substrate and including a ceramic. A coil portion includes first and second coil patterns respectively disposed on the first and second substrate protection layers. Each of the first and second coil patterns includes a first conductive layer, disposed on the respective first or second substrate protection layer, and a second conductive layer disposed on the first conductive layer to expose a side surface of the first conductive layer.Type: ApplicationFiled: August 26, 2019Publication date: April 16, 2020Inventors: Joung Gul Ryu, Ji Man Ryu, Byeong Cheol Moon
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Publication number: 20190287711Abstract: A coil component includes a body including a coil, and an external electrode disposed on an external surface of the body and connected to the coil, wherein the body includes a support member supporting the coil and including a through-hole and a via hole spaced apart from the through-hole, the coil includes a coil body and a lead portion connecting the coil body and the external electrode to each other, and a support thin film layer is interposed between one surface of the support member and one surface of the lead portion facing the one surface.Type: ApplicationFiled: October 29, 2018Publication date: September 19, 2019Inventors: Jae Hun KIM, Ji Hyung JUNG, Mi Geum KIM, Ji Man RYU, Do Young JUNG, Joung Gul RYU
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Patent number: 10147533Abstract: An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.Type: GrantFiled: April 7, 2016Date of Patent: December 4, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hyun Lyoo, Se Woong Paeng, Jung Min Kim, Jeong Gu Yeo, Tae Hoon Kim, Sang Jun Lee, Ji Hyung Jung, Ji Man Ryu, Do Young Jung
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Patent number: 9793741Abstract: The present invention relates to a magnetic sheet, a wireless charging sheet, and a method for manufacturing a magnetic sheet. According to an embodiment of the present invention, a magnetic sheet used in a wireless charging sheet, which includes a metal sheet layer consisting of a plurality of divided segments; and an insulating material filled in a dividing space between the segments and forms a magnetic path of a magnetic field generated around a coil, is provided. Further, a wireless charging sheet and a method for manufacturing a magnetic sheet are provided.Type: GrantFiled: October 10, 2014Date of Patent: October 17, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Gu Yeo, Kang Ryong Choi, Dong Hyeok Choi, Sung Yong An, Chang Ryul Jung, Ji Man Ryu
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Publication number: 20160351321Abstract: An inductor includes a body including an organic material and a coil part disposed in the body. External electrodes are disposed on outer surfaces of the body and connected to the coil part. The coil part includes a conductive pattern and a conductive via. An adhesive layer is disposed between the conductive pattern and the conductive via, and the adhesive layer is formed of a material different from materials of the conductive pattern and the conductive via.Type: ApplicationFiled: April 7, 2016Publication date: December 1, 2016Inventors: Soo Hyun LYOO, Se Woong PAENG, Jung Min KIM, Jeong Gu YEO, Tae Hoon KIM, Sang Jun LEE, Ji Hyung JUNG, Ji Man RYU, Do Young JUNG
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Patent number: 9391363Abstract: There are provided a multilayer ferrite sheet capable of performing communications in a wideband frequency, an antenna device using the same, and a manufacturing method thereof. The multilayer ferrite sheet includes: a Y-type hexaferrite layer; and a Z-type hexaferrite layer, wherein the Y-type hexaferrite and the Z-type hexaferrite are alternately laminated.Type: GrantFiled: March 7, 2013Date of Patent: July 12, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hyeok Choi, Jin Young Kim, Sung Yong An, Ji Man Ryu
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Patent number: 9088068Abstract: There is provided a magnetic composite sheet including: a magnetic layer including first and second magnetic pieces having different sizes; and a cover film formed on one surface or both surfaces of the magnetic layer, wherein, in a cross-section of the magnetic composite sheet taken in a direction parallel to a direction in which the magnetic layer and the cover film are laminated, when a length of the first magnetic piece in a vertical direction is a and a length thereof in a horizontal direction is b, and a length of the second magnetic piece in the vertical direction is a? and a length thereof in the horizontal direction is b?, b/a is greater than b?/a?(b/a>b?/a?).Type: GrantFiled: May 7, 2013Date of Patent: July 21, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hyeok Choi, Jin Young Kim, Chang Ryul Jung, Ji Man Ryu, Sung Yong An
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Publication number: 20150102892Abstract: The present invention relates to a magnetic sheet, a wireless charging sheet, and a method for manufacturing a magnetic sheet. According to an embodiment of the present invention, a magnetic sheet used in a wireless charging sheet, which includes a metal sheet layer consisting of a plurality of divided segments; and an insulating material filled in a dividing space between the segments and forms a magnetic path of a magnetic field generated around a coil, is provided. Further, a wireless charging sheet and a method for manufacturing a magnetic sheet are provided.Type: ApplicationFiled: October 10, 2014Publication date: April 16, 2015Inventors: Jeong Gu YEO, Kang Ryong CHOI, Dong Hyeok CHOI, Sung Yong AN, Chang Ryul JUNG, Ji Man RYU
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Patent number: 8786064Abstract: Disclosed herein is a semiconductor chip, including: a first substrate having a concave formed on one surface thereof and an opening formed on a bottom surface of the concave; a second substrate contacting the other surface of the first substrate; and a semiconductor chip mounted in the concave.Type: GrantFiled: January 30, 2012Date of Patent: July 22, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Su Kim, Ji Man Ryu, Soon Gyu Yim
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Publication number: 20140176381Abstract: There is provided a magnetic composite sheet including: a magnetic layer including first and second magnetic pieces having different sizes; and a cover film formed on one surface or both surfaces of the magnetic layer, wherein, in a cross-section of the magnetic composite sheet taken in a direction parallel to a direction in which the magnetic layer and the cover film are laminated, when a length of the first magnetic piece in a vertical direction is a and a length thereof in a horizontal direction is b, and a length of the second magnetic piece in the vertical direction is a? and a length thereof in the horizontal direction is b?, b/a is greater than b?/a?(b/a>b?/a?).Type: ApplicationFiled: May 7, 2013Publication date: June 26, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hyeok CHOI, Jin Young KIM, Chang Ryul JUNG, Ji Man RYU, Sung Yong AN
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Publication number: 20140176380Abstract: There are provided a multilayer ferrite sheet capable of performing communications in a wideband frequency, an antenna device using the same, and a manufacturing method thereof. The multilayer ferrite sheet includes: a Y-type hexaferrite layer; and a Z-type hexaferrite layer, wherein the Y-type hexaferrite and the Z-type hexaferrite are alternately laminated.Type: ApplicationFiled: March 7, 2013Publication date: June 26, 2014Applicant: SAMSUNG ELECTRO-MACHANICS CO., LTD.Inventors: Dong Hyeok Choi, Jin Young Kim, Sung Yong An, Ji Man Ryu
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Publication number: 20140145807Abstract: There are provided a magnetic sheet and a contactless power transmission device including the same. The magnetic sheet includes a ferrite sheet, a metal sheet formed on the ferrite sheet and including a polymer resin and a metal powder, and an adhesive film inserted between the ferrite sheet and the metal sheet.Type: ApplicationFiled: February 25, 2013Publication date: May 29, 2014Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Kang Ryong CHOI, Ji Man RYU, Dong Hyeok CHOI, Chang Ryul JUNG, Sung Yong AN
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Publication number: 20140145512Abstract: There is provided a contactless power transmission device including a permanent magnet disposed at the center of a coil of a receiver in order to allow the center of the coil of the receiver and the center of a coil of a transmitter to coincide, and a coating layer formed on a surface of the permanent magnet.Type: ApplicationFiled: February 25, 2013Publication date: May 29, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kang Ryong CHOI, Ji Man RYU, Dong Hyeok CHOI, Chang Ryul JUNG, Sung Yong AN
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Publication number: 20130105955Abstract: Disclosed herein is a semiconductor chip, including: a first substrate having a concave formed on one surface thereof and an opening formed on a bottom surface of the concave; a second substrate contacting the other surface of the first substrate; and a semiconductor chip mounted in the concave.Type: ApplicationFiled: January 30, 2012Publication date: May 2, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Su Kim, Ji Man Ryu, Soon Gyu Yim