Abstract: Disclosed herein is a semiconductor chip, including: a first substrate having a concave formed on one surface thereof and an opening formed on a bottom surface of the concave; a second substrate contacting the other surface of the first substrate; and a semiconductor chip mounted in the concave.

Abstract: Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks.

Abstract: A flake powder for an electromagnetic wave absorber and a method of manufacturing the flake powder are described. The flake powder is made-up of nano-sized metals and pores forming a flake body having a composite structure formed by aggregation of nano-sized magnetic metals. The method includes the steps of preparing a metal oxide; milling the metal oxide into nano-sized powder; reducing the milled metal oxide powder to form a magnetic metal powder; flaking the reduced magnetic metal powder; and heat treating the flaked magnetic metal powder to relieve residual stress thereof.