Abstract: A test system and a test method for a lip sticking force of tipping paper for cigarettes are provided. The test system includes an artificial lip and test equipment. The artificial lip is a silica gel block. The test equipment includes a friction meter testing platform, a force measuring sensor, a rigid rope, a pulley, a pulley bracket and a sample loading module. The pulley is installed on the pulley bracket, and the rigid rope slides in the pulley. The rigid rope is L-shaped, a first end of the rigid rope in a horizontal direction is connected to the force measuring sensor, and a second end of the rigid rope in a vertical direction is connected to the sample loading module. The artificial lip is located directly below the sample loading module, and the artificial lip is in contact with the sample loading module at a test position.

Abstract: A computer-implemented method includes preprocessing, by a compiler, a plurality of macros in a computer program. Preprocessing a macro includes identifying a compile time condition associated with the macro. Preprocessing the macro further includes determining a current value of the compile time condition at the time of compiling a computer instruction and a previous value of the compile time condition. Preprocessing the macro further includes determining a set of computer instructions enclosed by the macro. The method further includes storing a macro information record that includes the compile time condition, the current value and the previous value of the compile time condition, and an identification of the set of computer instructions enclosed by the macro.

Abstract: A heart valve prosthesis delivery device can be modified in situ to facilitate retrieval of the device from a patient after delivery of a heart valve prosthesis. The device can include a nose cone that permits enclosures of the device to be drawn together in an aligned configuration, reducing the likelihood that the device will get caught on the prosthesis or vasculature as the device is retrieved from the patient.

Abstract: Disclosed is a light-emitting device which includes a light-emitting element and a wavelength conversion layer, and light of a first wavelength emitted by the light-emitting element is converted into light of a second wavelength and light of a third wavelength through the wavelength conversion layer. The light-emitting element includes a first contact layer, and the reflectivity of the first contact layer to the third wavelength is greater than 85%, so that the reflectivity of the light of the second wavelength and the light of the third wavelength converted by the wavelength conversion layer and reflected to the surface of the light-emitting element may be increased, and the white light conversion efficiency and the light extraction efficiency of the light-emitting device are improved.

Abstract: A gas mixture for treating a substrate in a substrate processing system includes hydrogen fluoride gas, a vapor of an alcohol, an additive consisting of a base, and a carrier gas. The gas mixture can be used to treat high aspect ratio (HAR) structures arranged on a surface of a substrate. A surface of the substrate may be spin rinsed using a first rinsing liquid. The first rinsing liquid is spun off from the surface of the substrate. The gas mixture is directed onto the surface of the substrate after the first rinsing liquid is dispensed.

Abstract: A four leg, lower extremity, robotic exoskeleton system is provided for medically assistive motion in gait, sit to stand (STS) and step climbing activities. The system has four articulated robotic legs, including two exoskeleton legs and two auto-pole legs, which are connected to a torso frame, controlled by a motion controller and a user interfaces, and that interacts with an assistive stationary robotic chair, or a wheelchair, for storage, dressing, STS and rest. The STS motion, in the stationary chair and the wheelchair, may be done with a single axis linear actuator, which maintains a back seat tip parallel to the ground for safety and comfort. Links of the exoskeleton and auto-pole legs are actuated by a linear or rotary actuators with their synchronized motion controlled by the motion controller, for safety, comfort and cost performance optimization depending on the medical needs.

Abstract: A gas mixture for treating a substrate in a substrate processing system includes hydrogen fluoride gas, a vapor of an alcohol, an additive consisting of a base, and a carrier gas. The gas mixture can be used to treat high aspect ratio (HAR) structures arranged on a surface of a substrate. A surface of the substrate may be spin rinsed using a first rinsing liquid. The first rinsing liquid is spun off from the surface of the substrate. The gas mixture is directed onto the surface of the substrate after the first rinsing liquid is dispensed.

Abstract: An underneath type railway freight car bogie wheelset radial device has front and rear subframes and two cross-arranged connecting rods that are pinned by round pin connectors. The subframe is a combination structure of the adapter and the lateral arm. The connecting rods are arranged under the bolster to form the underneath bogie wheelset radial structure. The height of the central plane of the connecting rod is lower than the height of the central plane of the subframe adapter surface. The adapter has an adapter surface forming an arc-shaped adapter structure and an adapter connecting arm integrated with the adapter surface structure and vertically arranged at one end of the adapter surface; the subframes are fixed to the adapter by the rivet assembly.

Abstract: Methods and apparatuses for precise trimming of silicon-containing materials are provided. Methods involve oxidizing silicon-containing materials and thermally removing the oxidized silicon-containing materials at particular temperatures for a self-limiting etch process. Methods also involve a surface reaction limited process using a halogen source and modulated temperature and exposure duration to etch small amounts of silicon-containing materials. Apparatuses are capable of flowing multiple oxidizers at particular temperature ranges to precisely etch substrates.

Abstract: Various embodiments described herein relate to methods and apparatus for etching a semiconductor substrate to remove a target material from a surface of the substrate. Generally, the techniques described herein are thermal techniques that do not rely on the use of plasma. In a number of embodiments, a particular gas mixture is provided to the reaction chamber to react with the target material. The gas mixture may include a combination of a halogen source such as hydrogen fluoride (HF), an organic solvent and/or water, an additive, and a carrier gas. A number of different materials may be used for the organic solvent and/or for the additive.

Abstract: Apparatuses and methods are described. An apparatus may include a processing chamber including chamber walls, a chamber heater configured to heat the walls, a pedestal positioned within the chamber and including a substrate heater having a plurality of light emitting diodes (LEDs) configured to emit light with wavelengths in the range of 400 nanometers (nm) and 800 nm, a window positioned above the heater and having a material transparent to light with wavelengths in the range of 400 nm and 800 nm, and three or more substrate supports, each having a substrate support surface vertically offset from the window and configured to support a substrate such that the window and the substrate are offset by a nonzero distance.

Abstract: A substrate processing system for selectively etching a layer on a substrate includes an upper chamber region, an inductive coil arranged around the upper chamber region and a lower chamber region including a substrate support to support a substrate. A gas distribution device is arranged between the upper chamber region and the lower chamber region and includes a plate with a plurality of holes. A cooling plenum cools the gas distribution device and a purge gas plenum directs purge gas into the lower chamber. A surface to volume ratio of the holes is greater than or equal to 4. A controller selectively supplies an etch gas mixture to the upper chamber and a purge gas to the purge gas plenum and strikes plasma in the upper chamber to selectively etch a layer of the substrate relative to at least one other exposed layer of the substrate.

Abstract: A method for treating a substrate includes arranging a substrate in a processing chamber. At least one of a vaporized solvent and a gas mixture including the solvent is supplied to the processing chamber to form a conformal liquid layer of the solvent on exposed surfaces of the substrate. The at least one of the vaporized solvent and the gas mixture is removed from the processing chamber. A reactive gas including a halogen species is supplied to the processing chamber. The conformal liquid layer adsorbs the reactive gas to form a reactive liquid layer that etches the exposed surfaces of the substrate.

Abstract: A railway self-generating express freight car bogie has a wheel-axle assembly, frame, journal box suspension device, bolster, foundation brake, side bearing, empty/load auto-adjustment equipment, central suspension device, longitudinal traction device, vertical damper and lateral damper. An axle-end generator is connected at the outer end of an axle of the wheel-axle assembly, the rotor part of the axle-end generator is connected to the end bearing of the wheel-axle assembly by the axle-end bolts, and the stator part is connected to the mount of the journal box suspension devices. The bogie is designed according to the zero-wear concept, and a large number of rubber components and hydraulic dampers are used to improve the lateral stability, linear stability and curve passing performance of the car, so that the bogie is highly adaptable to railway lines, and can meet the operating requirements within 160 km/h and reduce the workload of bogie operation and maintenance.

Abstract: A method for treating a substrate includes arranging a substrate in a processing chamber. At least one of a vaporized solvent and a gas mixture including the solvent is supplied to the processing chamber to form a conformal liquid layer of the solvent on exposed surfaces of the substrate. The at least one of the vaporized solvent and the gas mixture is removed from the processing chamber. A reactive gas including a halogen species is supplied to the processing chamber. The conformal liquid layer adsorbs the reactive gas to form a reactive liquid layer that etches the exposed surfaces of the substrate.

Abstract: A substrate processing system for selectively etching a layer on a substrate includes an upper chamber region, an inductive coil arranged around the upper chamber region and a lower chamber region including a substrate support to support a substrate. A gas distribution device is arranged between the upper chamber region and the lower chamber region and includes a plate with a plurality of holes. A cooling plenum cools the gas distribution device and a purge gas plenum directs purge gas into the lower chamber. A surface to volume ratio of the holes is greater than or equal to 4. A controller selectively supplies an etch gas mixture to the upper chamber and a purge gas to the purge gas plenum and strikes plasma in the upper chamber to selectively etch a layer of the substrate relative to at least one other exposed layer of the substrate.

Abstract: A gas mixture for treating a substrate in a substrate processing system includes hydrogen fluoride gas, a vapor of an alcohol, an additive consisting of a base, and a carrier gas. The gas mixture can be used to treat high aspect ratio (HAR) structures arranged on a surface of a substrate. A surface of the substrate may be spin rinsed using a first rinsing liquid. The first rinsing liquid is spun off from the surface of the substrate. The gas mixture is directed onto the surface of the substrate after the first rinsing liquid is dispensed.

Abstract: The present invention provides haloalkane substrates, and linkers for connecting such substrates to functional elements (e.g., tags, labels, surfaces, etc.). Substrates and linkers described herein find use, for example, in labeling, detection, and immobilization of proteins, cells, and molecules. In particular, the linkers provided herein find use within substrates for dehalogenase variants that form covalent bonds with their haloalkane substrates.

Abstract: A method for treating a substrate includes arranging a substrate in a processing chamber. At least one of a vaporized solvent and a gas mixture including the solvent is supplied to the processing chamber to form a conformal liquid layer of the solvent on exposed surfaces of the substrate. The at least one of the vaporized solvent and the gas mixture is removed from the processing chamber. A reactive gas including a halogen species is supplied to the processing chamber. The conformal liquid layer adsorbs the reactive gas to form a reactive liquid layer that etches the exposed surfaces of the substrate.