Abstract: An information display method and an information display apparatus suitable for multi-person viewing are provided. The method is adapted to an electronic apparatus having a transparent display and a processor, and the method includes following steps: detecting a plurality of users viewing the transparent display, and calculating a gaze range of each user viewing the transparent display; calculating an intersection range of the gaze ranges of the users and determining whether a ratio of the intersection range to the gaze ranges exceeds a preset intersection ratio; displaying object information of the objects appeared in the gaze range according to each of the gaze ranges if the ratio does not exceed the preset intersection ratio; and displaying object information of the objects appeared in the gaze range according to the intersection range if the ratio exceeds the preset intersection ratio.

Abstract: An information display method and an information display apparatus suitable for multi-person viewing are provided. The method is adapted to an electronic apparatus having a transparent display and a processor, and the method includes following steps: detecting a plurality of users viewing the transparent display, and calculating a gaze range of each user viewing the transparent display; calculating an intersection range of the gaze ranges of the users and determining whether a ratio of the intersection range to the gaze ranges exceeds a preset intersection ratio; displaying object information of the objects appeared in the gaze range according to each of the gaze ranges if the ratio does not exceed the preset intersection ratio; and displaying object information of the objects appeared in the gaze range according to the intersection range if the ratio exceeds the preset intersection ratio.

Abstract: A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.

Abstract: A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.

Abstract: A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.

Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Abstract: According to an embodiment of the present disclosure, a chip package including at least one chip, a first encapsulation layer, a redistribution layer, and a second encapsulation layer is provided. The at least one chip has an active surface, a back surface opposite to the active surface, and sidewall surfaces connecting the active surface and the back surface. The first encapsulation layer covers the sidewall surfaces. The first encapsulation layer has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the active surface and the first surface, and electrically connected to the at least one chip. The second encapsulation layer is disposed on the back surface and the second surface. A thermal expansion coefficient of the second encapsulation layer is less than a thermal expansion coefficient of the first encapsulation layer. Chip packaging methods are also provided.

Abstract: A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.

Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.

Abstract: A flexible substrate repair structure, a manufacturing method thereof, and an inspection and repair method of a flexible substrate are provided. The flexible substrate repair structure includes a flexible substrate and at least one repair layer. The flexible substrate has a regular recess. The at least one repair layer is located on the flexible substrate and is completely filled in the regular recess. The material of the repair layer includes a polysilazane compound having the unit shown in formula (1) below, wherein Rx, Ry and Rz are respectively hydrogen, a C1 to C10 substituted alkyl group, an unsubstituted alkyl group, an alkenyl group, or an aromatic group.

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, at least one first side wall barrier structure, at least one thermal protrusion, and a first filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The first side wall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first side wall barrier structure is located on at least one side of the environmental sensitive electronic device. The thermal protrusion is located on the second substrate. The first filler layer is located between the first substrate and the second substrate and covers the environmental sensitive electronic device, the first side wall barrier structure, and the thermal protrusion.

Abstract: A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.

Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Abstract: A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, at least one first side wall barrier structure, at least one thermal protrusion, and a first filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The first side wall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first side wall barrier structure is located on at least one side of the environmental sensitive electronic device. The thermal protrusion is located on the second substrate. The first filler layer is located between the first substrate and the second substrate and covers the environmental sensitive electronic device, the first side wall barrier structure, and the thermal protrusion.

Abstract: A package of an environmental sensitive element including a flexible substrate, an environmental sensitive element, a flexible sacrificial layer and a packaging structure is provided. The environmental sensitive element is disposed on the flexible substrate. The flexible sacrificial layer is disposed on the environmental sensitive element, wherein the environmental sensitive element includes a plurality of first thin films and the flexible sacrificial layer includes a plurality of second thin films. The bonding strength between two adjacent second thin films is substantially equal to or lower than the bonding strength between two adjacent first thin films. Further, the packaging structure covers the environmental sensitive element and the flexible sacrificial layer.

Abstract: A fabricating method of an organic thin film transistor having a hydrophobic layer is provided. The organic thin film transistor including a gate, a gate insulator covering the gate, a source, a drain, an organic semiconductor layer, a hydrophobic layer and a protecting droplet. A hydrophobic region is formed by forming the hydrophobic layer on a surface of the source and a surface of the drain, respectively. Meanwhile, a hydrophilic region is formed on the organic semiconductor layer exposed by the hydrophobic layer. The protecting droplet is self-assemblingly formed on the organic semiconductor layer to protect the device characteristic by using the surface tension thereof.

Abstract: A stacked structure including a soluble organic semiconductor material and a water soluble photosensitive material is provided. The water soluble photosensitive material is directly disposed on the surface of the soluble organic semiconductor material.

Abstract: A sensing device for sensing a force is provided. The sensing device includes a soft laminose dielectric structure, a first electrode, a second electrode, at least one third electrode and a measuring element. The soft laminose dielectric structure has a first surface and a second surface opposite to each other. The first electrode is disposed on the first surface. The second electrode is disposed on the second surface. The whole of the second electrode overlaps with the first electrode. The third electrode is disposed on the second surface. The third electrode partially overlaps with the first electrode. The measuring element is used for measuring the electronic characteristic between the first electrode and the second electrode, and for measuring the electronic characteristic between the first electrode and the third electrode.