Patents by Inventor Jia He

Jia He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135551
    Abstract: Described examples relate to an apparatus comprising a memory for storing a sequence of image frames and at least one processor. The at least one processor may be configured to receive a first image frame of a sequence of image frames from an image capture device and select a first portion of a first image frame. The at least one processor may also be configured to obtain alignment information and determine a first portion and a second portion of a second image frame based on the alignment information. Further, the at least one processor may be configured to determine a bounding region within the second image frame and fetch image data corresponding to the bounding region of the second image frame from memory. In some examples, the first image frame may comprise a base image and the second image frame may comprise an alternative image frame. Further, the first image frame may comprise any one of the image frames of the sequence of image frames.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 25, 2024
    Inventors: Jia Feng, Damien Kelly, Ignacio Garcia Dorado, Xiaoying He
  • Patent number: 11967718
    Abstract: A negative active material includes a carbon material. The carbon material satisfies the following relationship: 6<Gr/K<16, Gr is a graphitization degree of the carbon material, measured by X-ray diffraction; and K is a ratio Id/Ig of a peak intensity Id of the carbon material at a wavenumber of 1250 cm?1 to 1650 cm?1 to a peak intensity Ig of the carbon material at a wavenumber of 1500 cm?1 to 1650 cm?1, and is measured by using Raman spectroscopy, and K is 0.06 to 0.15.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: April 23, 2024
    Assignee: NINGDE AMPEREX TECHNOLOGY LIMITED
    Inventors: Lihong He, Jia Tang, Jiali Dong, Yuansen Xie
  • Publication number: 20240121911
    Abstract: A solid-state storage device is provided. The solid-state storage device includes a case, a solid-state storage module, and a heat dissipation unit. The case includes a receiving space. The solid-state storage module is disposed in the receiving space of the case. The heat dissipation unit is connected to the case. The heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module. The heat dissipation unit includes a working fluid, a cooling channel, and at least one heat conductive rib. The cooling channel extends into the heat dissipation unit. The working fluid travels in the cooling channel. The heat conductive rib extends into the cooling channel. The solid-state storage device satisfies the specification of SNIA SFF-TA-1008.
    Type: Application
    Filed: June 7, 2023
    Publication date: April 11, 2024
    Inventors: Jiangshan LI, Jia HE
  • Publication number: 20240119919
    Abstract: Embodiments of the present disclosure provide a method and a device for music play. The method comprises receiving a first operation instruction in a target application for playing music; in response to the first operation instruction, presenting a first interface of the target application, the first interface including an operation control for enhancing a play effect of the music through at least one processing, the processing being used for representing music content in a way more than sound; receiving a second operation instruction for the operation control; processing the music based on the second operation instruction during a process of playing the music.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Mengfei Xie, Yufan Xue, Wei Hua, Xiaoyu Zhu, Dailong Chen, Jia Ding, Zoujie He, Jie Weng, Chaopeng Liu, Bowen Yang
  • Publication number: 20240119560
    Abstract: Described examples relate to an apparatus comprising one or more image sensors coupled to a vehicle and at least one processor. The at least one processor may be configured to capture, in a burst sequence using the one or more image sensors, multiple frames of an image of a scene, the multiple frames having respective, relative offsets of the image across the multiple frames and perform super-resolution computations using the captured, multiple frames of the image of the scene. The at least one processor may also be configured to accumulate, based on the super-resolution computations, color planes and combine, using the one or more processors, the accumulated color planes to create a super-resolution image of the scene.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 11, 2024
    Inventors: Ignacio Garcia Dorado, Damien Kelly, Xiaoying He, Jia Feng, Bartlomiej Wronski, Peyman Milanfar, Lucian Ion
  • Publication number: 20240107757
    Abstract: Embodiments of semiconductor devices and methods for forming the semiconductor devices are disclosed. In an example, a method for forming device openings includes forming a material layer over a first region and a second region of a substrate, the first region being adjacent to the second region, forming a mask layer over the material layer, the mask layer covering the first region and the second region, and forming a patterning layer over the mask layer. The patterning layer covers the first region and the second region and including openings corresponding to the first region. The plurality of openings includes a first opening adjacent to a boundary between the first region and the second region and a second opening further away from the boundary. Along a plane parallel to a top surface of the substrate, a size of the first opening is greater than a size of the second opening.
    Type: Application
    Filed: December 8, 2023
    Publication date: March 28, 2024
    Inventors: Jia He, Haihui Huang, Fandong Liu, Yaohua Yang, Peizhen Hong, Zhiliang Xia, Zongliang Huo, Yaobin Feng, Baoyou Chen, Qingchen Cao
  • Publication number: 20240098746
    Abstract: The present application relates to devices and components including apparatus, systems, and methods to provide reduced sensing schemes to facilitate sidelink transmissions.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Applicant: Apple Inc.
    Inventors: Chunxuan Ye, Dawei Zhang, Haijing Hu, Haitong Sun, Hong He, Jia Tang, Oghenekome Oteri, Weidong Yang, Zhibin Wu, Wei Zeng
  • Patent number: 11936045
    Abstract: A negative active material includes a carbon material. The carbon material satisfies the following relationship: 6<Gr/K<16, Gr is a graphitization degree of the carbon material, measured by means of X-ray diffraction; and K is a ratio Id/Ig of a peak intensity Id of the carbon material at a wavenumber of 1250 cm?1 to 1650 cm?1 to a peak intensity Ig of the carbon material at a wavenumber of 1500 cm?1 to 1650 cm?1, and is measured by using Raman spectroscopy, and K is 0.06 to 0.15. The negative active material according to this application can significantly improve an energy density, cycle performance, and rate performance of the electrochemical device.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: March 19, 2024
    Assignee: Ningde Amperex Technology Limited
    Inventors: Lihong He, Jia Tang, Jiali Dong, Yuansen Xie
  • Publication number: 20240090081
    Abstract: Apparatuses, systems, and methods for a user equipment device (UE) to perform methods for Fifth Generation New Radio (5G NR) frequency range two (FR2) based communications beam management. The UE may configure, via communications with a base station, serving the UE, a group ID for PUCCH resources within a group of PUCCHs, e.g., for FR2 based communications. The UE may receive, from the base station, an update to one or more PUCCH resources within the group of PUCCHs via a medium access control (MAC) control element (CE) that may include one of a resource ID indicating an update to a PUCCH resource or the group ID to update the group of PUCCH resources. The UE may update, based on the MAC-CE, the one or more PUCCH resources within the group of PUCCHs.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Inventors: Haitong Sun, Dawei Zhang, Hong He, Jia Tang, Pengkai Zhao, Tianyan Pu, Wei Zeng, Wei Zhang, Yuchul Kim, Yushu Zhang
  • Publication number: 20240074442
    Abstract: The present application provides an Uvaria grandiflora extract as a botanical fungicide, a preparation method therefor, and an application thereof. The broad-spectrum plant-derived fungicide provided in the present application comprises: Uvaria grandiflora whole plant extract and compound zeylenone obtained through separation and purification, which have the advantages of a broad antibacterial spectrum and a simple separation process. By means of a potted fungicidal activity test, it is proven that Uvaria grandiflora extracts have excellent control effects on Phytophthora capsici, cucumber downy mildew, potato late blight, and cowpea powdery mildew. Furthermore, Uvaria grandiflora extracts promote cucumber growth. Furthermore, a field efficacy test proves that the fungicidal activity of Uvaria grandiflora extracts against cucumber powdery mildew is better than that of the commercial fungicide Luna Sensation.
    Type: Application
    Filed: October 16, 2023
    Publication date: March 7, 2024
    Inventors: RANFENG SUN, JIANGUO HE, ZHAN HU, JIA XIE
  • Patent number: 11924832
    Abstract: Systems, methods, and circuitries are provided for performing sidelink communication. An example method generates SCI stage 1 and stage 2 for transmitting a transport block (TB) to a user equipment device (UE). The method includes determining the type of sidelink communication for transmitting the TB. An SCI stage 2 format is selected based on the type of sidelink communication. An SCI stage 2 payload is encoded in accordance with the selected SCI stage 2 format. The selected SCI stage 2 format value is encoded in an SCI stage 1 payload. The SCI stage 1 payload and SCI stage 2 payload are transmitted to the UE.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: March 5, 2024
    Assignee: Apple Inc.
    Inventors: Chunhai Yao, Chunxuan Ye, Wei Zeng, Yushu Zhang, Oghenekome Oteri, Weidong Yang, Hong He, Haitong Sun, Yang Tang, Jie Cui, Yuchul Kim, Dawei Zhang, Jia Tang
  • Patent number: 11917278
    Abstract: A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: February 27, 2024
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Man-Zhi Peng, Rui-Wu Liu, Jia-He Li
  • Patent number: 11903195
    Abstract: Embodiments of semiconductor devices and methods for forming the semiconductor devices are disclosed. In an example, a method for forming device openings includes forming a material layer over a first region and a second region of a substrate, the first region being adjacent to the second region, forming a mask layer over the material layer, the mask layer covering the first region and the second region, and forming a patterning layer over the mask layer. The patterning layer covers the first region and the second region and including openings corresponding to the first region. The plurality of openings includes a first opening adjacent to a boundary between the first region and the second region and a second opening further away from the boundary. Along a plane parallel to a top surface of the substrate, a size of the first opening is greater than a size of the second opening.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: February 13, 2024
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Jia He, Haihui Huang, Fandong Liu, Yaohua Yang, Peizhen Hong, Zhiliang Xia, Zongliang Huo, Yaobin Feng, Baoyou Chen, Qingchen Cao
  • Patent number: 11855806
    Abstract: A network node for a Data Communication Network (DCN) and a network device for providing traffic to the DCN are provided. The network node is configured to receive a plurality of packets carrying DCN messages; determine, from the received packets, a first set of packets addressed to other network nodes of the DCN. The network node is then configured to forward the first set of packets over a Time-Division-Multiplexing (TDM) connection, in particular over an Optical Data Unit-k (ODUk) connection, to a determined network node of the DCN. According to the application, a high bandwidth efficiency is maintained, and the number of interfaces to be managed on a controller is reduced.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: December 26, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Italo Busi, Yi Lin, Jia He
  • Publication number: 20230413560
    Abstract: A memory device includes a substrate, a stack over the substrate, and a gate line slit extending along a first direction and dividing the stack into two portions. The stack includes a connection portion that connects the two portions of the stack. The connection portion includes at least two sub-connection portions along a second direction perpendicular to the first direction. The gate line slit includes at least two portions along the first direction. Each sub-connection portion is between adjacent two portions of the gate line slit.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 21, 2023
    Inventors: Qiang Xu, Fandong Liu, Zongliang Huo, Zhiliang Xia, Yaohua Yang, Peizhen Hong, Wenyu Hua, Jia He
  • Publication number: 20230376674
    Abstract: A page layout method includes obtaining page information, element information of at least one page element to be laid out, and a layout rule; obtaining at least one candidate page layout policy based on the page information, the element information, and the layout rule using a reinforcement learning algorithm; and determining a target page layout policy from the at least one candidate page layout policy using an imitation learning algorithm.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 23, 2023
    Inventors: Jia He, Feiyang Pan, Xin Jin, Dandan Tu
  • Publication number: 20230366972
    Abstract: A communication method and apparatus are provided. The communication apparatus communicates with a device to obtain first information that includes location information and/or motion information of the device, and senses an environment to obtain environment sensing information that includes location information and/or motion information of an object in the environment. The communication apparatus determines a first antenna panel and/or a second antenna panel different from the first antenna panel based on the first information and the environment sensing information, where the first antenna panel is configured to communicate with a first device, and/or is configured to send, to the first device, a signal for sensing information, the second antenna panel is configured to receive sensing signal from the first device. In the communication apparatus, sensing and communication functions can be implemented in a single hardware system, thereby decreasing a size of the communication apparatus and reducing the cost.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 16, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xianfeng Du, Oupeng Li, Jia He
  • Publication number: 20230338701
    Abstract: Disclosed herein is a catheter comprising an outer conduit that comprises a first polymer; an inner conduit that comprises a second polymer; a structural support intermittently disposed in a region between the outer conduit and the inner conduit; where the structural support contacts the inner conduit and the outer conduit; where the structural support comprises a first biological agent that is released to a region outside the catheter via the outer conduit. Disclosed herein too is a method of using the catheter comprising disposing a catheter into a body of a living being; releasing the first biological agent into the organ in a first direction; and releasing a second biological agent into the organ in a second direction different from the first direction.
    Type: Application
    Filed: September 21, 2021
    Publication date: October 26, 2023
    Inventors: Diane J. Burgess, Jia He, Quanying Bao
  • Patent number: 11792989
    Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the memory device comprises a substrate, a stack structure on the substrate, and at least one gate line slit extending along a first direction substantially parallel to a top surface of the substrate, and dividing the stack structure into at least two portions. The stack structure includes at least one connection portion that divides the at least one gate line slit, and conductively connects the at least two portions.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: October 17, 2023
    Assignee: Yangtze Memory Technologies Co., Ltd.
    Inventors: Qiang Xu, Fandong Liu, Zongliang Huo, Zhiliang Xia, Yaohua Yang, Peizhen Hong, Wenyu Hua, Jia He
  • Publication number: 20230326997
    Abstract: A semiconductor device includes a substrate, a plurality of planar transistors, a fin-type field effect transistor and a first nonactive structure. The substrate includes a first region and a second region. The first region includes a plurality of first planar active regions and a nonactive region. The nonactive region is located between or aside the plurality of first planar active regions and includes a second planar active region. The second region has a fin active region. The plurality of planar transistors are located in the plurality of first planar active regions within the first region. The fin-type field effect transistor is located on the fin active region within the second region. The first nonactive structure is located in the nonactive region between the plurality of planar transistors.
    Type: Application
    Filed: May 18, 2022
    Publication date: October 12, 2023
    Applicant: United Microelectronics Corp.
    Inventors: Jia-He Lin, Yu-Ruei Chen, Yu-Hsiang Lin