Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the memory device comprises a substrate, a stack structure on the substrate, and at least one gate line slit extending along a first direction substantially parallel to a top surface of the substrate, and dividing the stack structure into at least two portions. The stack structure includes at least one connection portion that divides the at least one gate line slit, and conductively connects the at least two portions.

Abstract: A semiconductor device includes a substrate, a plurality of planar transistors, a fin-type field effect transistor and a first nonactive structure. The substrate includes a first region and a second region. The first region includes a plurality of first planar active regions and a nonactive region. The nonactive region is located between or aside the plurality of first planar active regions and includes a second planar active region. The second region has a fin active region. The plurality of planar transistors are located in the plurality of first planar active regions within the first region. The fin-type field effect transistor is located on the fin active region within the second region. The first nonactive structure is located in the nonactive region between the plurality of planar transistors.

Abstract: A method and an apparatus for sensing and communication is provided. The method includes: a first device obtains a sensing parameter including a physical feature of a sensing target; configures a first frame based on the sensing parameter, and performs sensing on the first frame. The first frame includes M first time periods and N second time periods, both M and N are integers greater than or equal to 0, without being equal to 0 at the same time. The first device sends or receives a waveform of a communication signal during the first time period, and sends or receives a waveform of a sensing signal during the second time period. According to this application, spectral efficiency can be improved as sensing is performed without affecting communication thereby minimizing communication overheads, and sensing and communication occupy a same spectrum resource thereby meeting the requirements of sensing and communication.

Abstract: This application provides a sensing signal transmission method and apparatus, so that transmission of a sensing signal can be coordinated by using a communication resource. This helps reduce interference between sensing nodes. The method includes: A terminal device sends a first message to a network device, where the first message includes information for requesting the network device to allocate a sensing resource to the terminal device. The network device receives the first message from the terminal device, allocates the sensing resource to the terminal device based on the first message, and sends a second message to the terminal device, where the second message includes the sensing resource allocated to the terminal device. The terminal device receives the second message from the network device, and sends a sensing signal on the allocated sensing resource.

Abstract: Example communication methods and apparatus are described. One example method includes sending a first training signal by a first device to a second device on a reflection path. The first device sends a second training signal to the second device on the reflection path. The reflection path is a transmission path formed after the first training signal and the second training signal are reflected by a surrounding object. An interval between the first training signal and the second training signal is used to indicate to decode data.

Abstract: A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.

Abstract: The present disclosure discloses a digital construction-based intelligent construction period early warning system and method, which belongs to the technical field of intelligent early warning. The system includes a digital construction module, a data calling module, an initial judgment module, an association analysis module, and an adjustment early warning module. An output end of the digital fabrication module is connected to an input end of the data calling module; an output end of the data calling module is connected to an input end of the initial judgment module; an output end of the initial judgment module is connected to an input end of the association analysis module; and an output end of the association analysis module is connected to an input end of the adjustment early warning module.

Abstract: Embodiments of this application disclose a communication method and an apparatus thereof, to implement data communication between a first communication apparatus and a second communication apparatus, so that spectrum resource utilization can be improved. The method in embodiments of this application includes: The first communication apparatus determines a first sensing signal and a second sensing signal; and the first communication apparatus determines a third sensing signal, where the third sensing signal is obtained based on a first data signal and the first sensing signal, the first data signal is a data signal to be sent by the first communication apparatus to the second communication apparatus, and a first frequency difference between a frequency of the second sensing signal and a frequency of the third sensing signal is a preset threshold; and the first communication apparatus sends the second sensing signal and the third sensing signal.

Abstract: Embodiments of semiconductor devices and methods for forming the semiconductor devices are disclosed. In an example, a method for forming device openings includes forming a material layer over a first region and a second region of a substrate, the first region being adjacent to the second region, forming a mask layer over the material layer, the mask layer covering the first region and the second region, and forming a patterning layer over the mask layer. The patterning layer covers the first region and the second region and including openings corresponding to the first region. The plurality of openings includes a first opening adjacent to a boundary between the first region and the second region and a second opening further away from the boundary. Along a plane parallel to a top surface of the substrate, a size of the first opening is greater than a size of the second opening.

Abstract: The present invention provides a copper billet horizontal continuous casting apparatus with a vertical shaft furnace for smelting and a corresponding process. The copper billet horizontal continuous casting apparatus with a vertical shaft furnace for smelting includes: a vertical shaft, a refining furnace, a mixing furnace, a holding furnace, and a continuous casting furnace; wherein the refining furnace includes a furnace body, and a gas flushing device disposed beneath the furnace body, a gas flushing brick is provided at the chamber bottom wall of the furnace body; a gas inlet device is provided on the vertical shaft furnace; the vertical shaft furnace further includes a detecting device and an adjusting device which are connected with the air inlet device.

Abstract: A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.

Abstract: A package structure includes a backing plate, at least one pad, a frame, a side enclosing plate, a magnetic component and a fixing structure. The backing plate supports a target object. The pad is disposed on the backing plate and fixes the target object. The frame is disposed on a lower side of the backing plate and bonded to the backing plate. The frame supports the backing plate to fix the pad onto the backing plate. The side enclosing plate is disposed around the backing plate and connected to the pad to fix the pad. The magnetic component is disposed on the backing plate and attracting a magnetic coating on the target object. The fixing structure is disposed at an end portion of the frame and connected to the pad to fix the pad.

Abstract: Embodiments of semiconductor devices and methods for forming the semiconductor devices are disclosed. In an example, a method for forming device openings includes forming a material layer over a first region and a second region of a substrate, the first region being adjacent to the second region, forming a mask layer over the material layer, the mask layer covering the first region and the second region, and forming a patterning layer over the mask layer. The patterning layer covers the first region and the second region and including openings corresponding to the first region. The plurality of openings includes a first opening adjacent to a boundary between the first region and the second region and a second opening further away from the boundary. Along a plane parallel to a top surface of the substrate, a size of the first opening is greater than a size of the second opening.

Abstract: A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

Abstract: The present invention provides a copper billet horizontal continuous casting apparatus with a vertical shaft furnace for smelting and a corresponding process. The copper billet horizontal continuous casting apparatus with a vertical shaft furnace for smelting includes: a vertical shaft, a refining furnace, a mixing furnace, a holding furnace, and a continuous casting furnace; wherein the refining furnace comprises a furnace body, and a gas flushing device disposed beneath the furnace body, a gas flushing brick is provided at the chamber bottom wall of the furnace body; a gas inlet device is provided on the vertical shaft furnace; the vertical shaft furnace further includes a detecting device and an adjusting device which are connected with the air inlet device.

Abstract: Certain embodiments provide an imaging method for a non-line-of-sight object and an electronic device. In certain embodiments, the method includes: detecting a first input operation; and generating first image data in response to the first input operation. The first image data is imaging data of the non-line-of-sight object obtained by fusing second image data and third image data. The first image data includes position information between the non-line-of-sight object and a line-of-sight object. The second image data is imaging data of the line-of-sight object captured by the optical camera. The third image data is imaging data of the non-line-of-sight object captured by the electromagnetic sensor.

Abstract: A liquid-phase reactor has an outer cylinder and an inner cylinder disposed along an axial direction of the reactor. The outer cylinder has a top head, a straight cylinder section and a bottom head. An annular space is formed between the inner cylinder and the outer cylinder. A top end of the inner cylinder is open and is in communication with the annular space. The inner cylinder has an upper cylinder and a lower cylinder sequentially from top to bottom. The upper cylinder is positioned in the straight cylinder section, with its cross-sectional area being gradually reduced from top to bottom. The lower cylinder is positioned in the bottom head, with its cross-sectional area being gradually increased from top to bottom. An inorganic membrane tube extending along the axial direction of the reactor is provided in the lower cylinder so that a shell-and-tube structure is formed.

Abstract: A package structure comprises a backing plate supporting a target object, at least one pad disposed on the backing plate and fixing the target object, a frame disposed on a lower side of the backing plate, bonded to the backing plate, and supporting the backing plate to fix the pad onto the backing plate, and a side enclosing plate disposed around the backing plate and connected to the pad to fix the pad. The package structure further comprises a magnetic component disposed on the backing plate and attracting a magnetic coating on the target object.

Abstract: A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.

Abstract: A mouse pad includes a mouse pad body and a mobile device support area, and the mobile device support area is flatly extended from a side of the mouse pad body and can be turned clockwise, so that the mobile device support area sticks out in a direction towards the top of the mouse pad body to form a mobile device support stand. Users can use the mouse pad or the transformed mobile device support stand alone or use the mouse pad body for the operation of a mouse while using the transformed mobile device support stand to achieve the effect of watching a mobile device.