Patents by Inventor JIA LIANG

JIA LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220379357
    Abstract: A fabricating apparatus and method for a flexible display screen. The fabricating apparatus for the flexible display screen comprises a roller mechanism and a jig (21); the jig (21) has a bearing surface (211) for bearing a flexible display panel (1); the bearing surface (211) is a curved surface; the roller mechanism comprises a roller (31); and the axis (x) of the roller (31) is parallel to the plain line (y) of the bearing surface. The fabricating apparatus for the flexible display screen is used for attaching a support layer (2) to the flexible display panel (1), so that the flexible display panel (1) is better bonded to the support layer (2), thereby reducing the probability that the flexible display panel (1) is separated from the support layer (2) during normal use.
    Type: Application
    Filed: March 9, 2021
    Publication date: December 1, 2022
    Inventors: Rongkun FAN, Yuanhong WEN, Peng WANG, Jialin WANG, Zhao LIANG, Tao ZHANG, Mu ZENG, Yang WANG, Jia DENG, Hongwei CUI
  • Publication number: 20220365843
    Abstract: The present invention provides a method for detecting a flash memory module and an associated SoC. The method reads data in a flash memory module with a specific data format, and then determining a plurality of characteristic parameters of the flash memory module and a size of a page by decoding and checking the data. Therefore, the SoC does not need to design a one-time-programmable memory or strap pins, so as to reduce the manufacturing cost of the SoC.
    Type: Application
    Filed: April 1, 2022
    Publication date: November 17, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Jia-Jhe Li, Chia-Liang Hung
  • Publication number: 20220367313
    Abstract: A manufacturing method of a semiconductor packaging device is provided, and the manufacturing method includes steps as follows. A working chip is soldered on one surface of a wiring board so that an working circuit inbuilt inside a chip body of the working chip is electrically connected to the wiring board. A silicon thermal conductivity element is soldered on one surface of a heat-dissipating metal lid. The heat-dissipating metal lid is fixedly covered on the wiring board such that the silicon thermal conductivity element is sandwiched between the chip body and the heat-dissipating metal lid, and the silicon thermal conductivity element is electrically isolated from the working circuit of the chip body and the wiring board.
    Type: Application
    Filed: July 29, 2022
    Publication date: November 17, 2022
    Inventors: Jia-Liang CHEN, Chi-Ming YANG, Yen-Chao LIN
  • Patent number: 11498454
    Abstract: A power battery cooling system of an electric vehicle, including: a cooling circuit configured for cooling a power battery of the electric vehicle; a solar sunroof; and a sunroof control unit configured for controlling the operation of the cooling circuit and the electric energy output of the solar sunroof; wherein the sunroof control unit is configured to start a power battery cooling operation based on the solar sunroof in the condition that the power battery is not in a high voltage output state and the temperature of the power battery is higher than a temperature threshold, the power battery cooling operation including: controlling the solar sunroof to output electric energy to the cooling circuit so that the cooling circuit performs the cooling of the power battery using the electric energy from the solar sunroof.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: November 15, 2022
    Assignee: Volvo Car Corporation
    Inventors: Haibo Liang, Jia Li, Tao Zhang
  • Patent number: 11487129
    Abstract: An optical integration device includes a first circuit layer comprising a first surface adjacent a first diffractive layer, the first diffractive layer arranged on a side of the first circuit layer along a first direction, and a first connecting pad electrically connected with the first circuit layer through a first conductive member. The optical integration device includes a side surface extending along the first direction. The side surface defines a first concavity extending through the first diffractive layer along the first direction. The first connecting pad includes a first mounting member connected with the side surface, and a first convex member extending from the first mounting member and received in the first concavity. The first conductive member includes a first conductive part arranged between the side surface and the first mounting member, and a second conductive part arranged between the first surface and the first convex member.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: November 1, 2022
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Jia-Liang Wu, Yi-Yin Chen
  • Patent number: 11465399
    Abstract: A bonding device includes: a supporting assembly, comprising a first and second supporting bodies arranged in a first direction, at least one of the first and second supporting bodies is movable in the first direction, the supporting assembly having an upper surface which faces a flexible substrate and matches an inner surface of the flexible substrate; and a stretching assembly, including a carrier film and a plurality of driving elements, a central area of the carrier film being attached to the inner surface of the flexible substrate, at least two of the plurality of driving elements arranged oppositely in the first direction, at least two of the plurality of driving elements arranged oppositely in a second direction, the plurality of driving elements are connected to peripheral portions of the carrier film, and stretches the peripheral portions of the carrier film to align the inner surface with the supporting assembly.
    Type: Grant
    Filed: June 19, 2021
    Date of Patent: October 11, 2022
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Fei Zeng, Jialin Wang, Jia Deng, Chaoxue Qin, Haitao Liang, Zhibing Lin, Guodong Zhou
  • Patent number: 11450586
    Abstract: A semiconductor packaging device includes a wiring board, a working chip, a heat-dissipating metal lid and a silicon thermal conductivity element. The working chip is mounted on the wiring board, and in-built with an working circuit therein. The silicon thermal conductivity element is thermally coupled to the working chip and the heat-dissipating metal lid, and is electrically isolated from the working circuit and the wiring board.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: September 20, 2022
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jia-Liang Chen, Chi-Ming Yang, Yen-Chao Lin
  • Publication number: 20220290669
    Abstract: The present disclosure provides a pump body assembly, a heat exchange apparatus, a fluid machine and an operating method thereof. The pump body assembly includes a piston, a shaft, a piston sheath, and a cylinder. The shaft drives the piston to rotate and reciprocate within the piston sheath while rotating. The piston sheath is located in the cylinder, and a compression chamber is defined between an outer circumferential wall of the piston and an inner wall of the cylinder. A pressure relief recess is defined in the outer circumferential wall of the piston or the inner wall of the cylinder at a position corresponding to the compression chamber.
    Type: Application
    Filed: August 24, 2020
    Publication date: September 15, 2022
    Applicant: GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI
    Inventors: Mingzhu DONG, Yusheng HU, Huijun WEI, Jia XU, Zhongcheng DU, Liping REN, Sen YANG, Zhi LI, Peilin ZHANG, Shebing LIANG, Zhengliang SHI, Rongting ZHANG, Ning DING
  • Publication number: 20220281215
    Abstract: A bonding fixture is used for fixing a flexible panel having a side edge comprising an edge part and corner parts, and an edge of at least one of the two corner parts is curve. The bonding fixture comprises a fixture body comprising a first profiling base configured for supporting the edge part; and a second profiling base arranged at at least one end of the first profiling base in a first direction, a length of the second profiling base in the first direction is equal to that of the corner parts in the first direction; the second profiling base is provided with a second profiling part configured for supporting the corner parts; in a second direction, the second profiling part extends beyond the first profiling base in a direction away from a center of the bonding fixture, and the second direction is perpendicular to the first direction.
    Type: Application
    Filed: October 26, 2021
    Publication date: September 8, 2022
    Inventors: Jia DENG, Haitao LIANG, Jialin WANG, Rongkun FAN, Peng WANG, Chaoxue QIN, Zhiwei DANG, Xinyu REN
  • Publication number: 20220279647
    Abstract: A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.
    Type: Application
    Filed: May 19, 2022
    Publication date: September 1, 2022
    Inventors: WEI-LIANG WU, JIA-HE LI
  • Publication number: 20220262701
    Abstract: A semiconductor packaging device includes a wiring board, a working chip, a heat-dissipating metal lid and a silicon thermal conductivity element. The working chip is mounted on the wiring board, and in-built with an working circuit therein. The silicon thermal conductivity element is thermally coupled to the working chip and the heat-dissipating metal lid, and is electrically isolated from the working circuit and the wiring board.
    Type: Application
    Filed: April 1, 2021
    Publication date: August 18, 2022
    Inventors: Jia-Liang CHEN, Chi-Ming YANG, Yen-Chao LIN
  • Publication number: 20220238820
    Abstract: The present disclosure provides a flexible display panel, a method for forming the flexible display panel and an adhesive application device for the method. The flexible display panel includes a cover plate layer and a screen film layer. The screen film layer includes a plurality of film layers laminated one on another at one side of the cover plate layer, and an adhesive is filled into a gap between an edge of an outermost film layer of the screen film layer relative to the cover plate layer and the cover plate layer.
    Type: Application
    Filed: December 15, 2021
    Publication date: July 28, 2022
    Inventors: Yaming WANG, Jia DENG, Haitao LIANG, Dongdong ZHAO, Mingqi GANG, Shaoxiong ZHANG, Jialin WANG
  • Publication number: 20220238670
    Abstract: A semiconductor device includes a first doped region in a substrate, wherein the first doped region has a first dopant type. The semiconductor device further includes a second doped region in the substrate, wherein the second doped region has a second dopant type opposite the first dopant type. The semiconductor device further includes a silicide structure on the substrate, wherein the silicide structure includes a main body and a silicide extension. The semiconductor device further includes a plurality of first gate structures on the substrate, wherein a space between adjacent gate structures of the plurality of first gate structures includes a first area and a second area, the silicide extension extends into the first area, the first doped region is in the substrate below the first area, and the second doped region is in the substrate below the second area.
    Type: Application
    Filed: February 12, 2021
    Publication date: July 28, 2022
    Inventors: Ming Jian WANG, Xin Yong WANG, Cun Cun CHEN, Jia Liang ZHONG
  • Patent number: 11399430
    Abstract: A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: July 26, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.
    Inventors: Wei-Liang Wu, Jia-He Li
  • Publication number: 20220224124
    Abstract: Systems and methods for balancing a pair of battery cells are described. A controller can determine a voltage difference based on a first voltage of a first battery cell and a second voltage of a second battery cell. The controller can determine a current difference between current of an inductor and a current limit of the inductor, where the inductor can be connected to a node between the first and second battery cells. The controller can identify at least one switching elements among a plurality of switching elements based on the voltage difference and the current difference. The controller can activate the identified switching elements to perform battery cell balancing between the first battery cell and the second battery cell.
    Type: Application
    Filed: January 13, 2021
    Publication date: July 14, 2022
    Applicant: Renesas Electronics America Inc.
    Inventors: Zhigang Liang, Jia Wei, John H. Carpenter, Jr., Masaya Emi
  • Publication number: 20220223352
    Abstract: Described is an integrated device for solar-driven water splitting. The integrated device includes cobalt phosphide (CoP) electrodes, series-connected perovskite solar cells (PSCs) encapsulated in a polymer, and a metal film connecting the CoP electrodes with the series-connected PSCs. Also described is a method for forming an integrated device for solar-driven water splitting.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 14, 2022
    Applicant: William Marsh Rice University
    Inventors: Jun Lou, Jia Liang
  • Patent number: 11376299
    Abstract: A method of preparing a Lilac Ginkgo Brick Tea includes the following steps: (1) mixing and drying fresh Lilac leaves and Ginkgo leaves to obtain a Lilac Ginkgo Tea; (2) fermenting the Lilac Ginkgo Tea to obtain a Fermented Lilac Ginkgo Tea; (3) mixing the Fermented Lilac Ginkgo Tea with a black tea to obtain a Fermented Lilac Ginkgo Tea Mixture; and (4) processing the Fermented Lilac Ginkgo Tea Mixture to obtain the Lilac Ginkgo Brick Tea.
    Type: Grant
    Filed: October 20, 2019
    Date of Patent: July 5, 2022
    Assignee: XI'AN KANGYUANSHENG BIOMEDICAL TECHNOLOGY CO., LTD.
    Inventors: Jia Wan, Chunchun Kong, Chengyuan Liang, Nan Hui, Chunyang Shi, Han Li, Bin Tian, Gennian Mao, Qianqian Zhao, Qiao Zeng
  • Publication number: 20220208684
    Abstract: An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180° with respect to a row direction and a column direction.
    Type: Application
    Filed: December 28, 2020
    Publication date: June 30, 2022
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Hao Wang, Ting-Chin Cho, Igor Elkanovich, Amnon Parnass, Chia-Hsiang Chang, Tsai-Ming Yang, Yen-Chung T. Chen, Ting-Hsu Chien, Yuan-Hung Lin, Chao-Ching Huang, Li-Ya Tseng, Pei Yu, Jia-Liang Chen, Yen-Wei Chen, Chung-Kai Wang, Chun-Hsu Chen, Yu-Ju Chang, Li-Hua Lin, Zanyu Yang
  • Publication number: 20220209226
    Abstract: This application relates to a negative electrode plate, a secondary battery and apparatus thereof. The secondary battery of the present application comprises a negative electrode plate, the negative electrode plate comprises a composite current collector and a negative electrode active material layer disposed on at least one surface of the composite current collector, the negative electrode active material layer comprises a silicon-based active material, the silicon-based active material accounts for 0.5 wt % to 50 wt % of total mass of the negative electrode active material layer, and the composite current collector comprises a polymer support layer and a metal conductive layer disposed on at least one surface of the polymer support layer, and the composite current collector has a brittleness parameter C ranging from 0.03 to 0.5. The secondary battery and the negative electrode plate achieve good coordination between the current collector and the negative electrode active material layer.
    Type: Application
    Filed: March 18, 2022
    Publication date: June 30, 2022
    Applicant: Contemporary Amperex Technology Co., Limited
    Inventors: Cheng LI, Qisen HUANG, Xin LIU, Changliang SHENG, Shiwen WANG, Xianghui LIU, Jia PENG, Mingling LI, Chengdu LIANG
  • Patent number: 11201100
    Abstract: A solid-state storage device includes a housing, a wiring board and a semiconductor package unit. The housing is formed with a heat-dissipating recess thereon. The wiring board is fixed in the housing. One side of the semiconductor package unit is mounted on the wiring board, and the other side of the semiconductor package unit is embedded in the heat-dissipating recess. A top surface and lateral surfaces surrounding the top surface of the semiconductor package unit are all thermally connected to the housing in the heat-dissipating recess.
    Type: Grant
    Filed: May 22, 2018
    Date of Patent: December 14, 2021
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Ting Shih, Chen-Wei Hung, Jia-Liang Chen